이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Memory Format | Technology | Memory Size | Memory Interface | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC EEPROM 256KBIT 250NS 28PIN
|
패키지: 28-BCPGA |
재고5,984 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28CPGA
|
패키지: 28-BCPGA |
재고2,608 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28CPGA
|
패키지: 28-BCPGA |
재고2,272 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
패키지: 32-CLCC |
재고5,040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
패키지: - |
재고3,664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 28FLATPK
|
패키지: 28-CFlatPack |
재고4,384 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
패키지: 32-CLCC |
재고4,224 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32CLCC
|
패키지: 32-CLCC |
재고3,088 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 32CLCC
|
패키지: 32-CLCC |
재고5,760 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
패키지: - |
재고4,240 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 120NS 28FLATPK
|
패키지: 28-CFlatPack |
재고4,960 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 120ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
패키지: 28-CFlatPack |
재고2,480 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28FLATPK
|
패키지: 28-CFlatPack |
재고7,584 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
패키지: 28-CFlatPack |
재고5,168 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28PIN
|
패키지: 28-BCPGA |
재고4,224 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 200NS 28CPGA
|
패키지: 28-BCPGA |
재고5,792 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 200ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Through Hole | 28-BCPGA | 28-CPGA (13.55x15.06) |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
패키지: - |
재고3,552 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
패키지: - |
재고5,040 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
패키지: - |
재고2,880 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
패키지: 28-CFlatPack |
재고2,256 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 250NS 28FLATPK
|
패키지: 28-CFlatPack |
재고2,624 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 250ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 28FLATPK
|
패키지: 28-CFlatPack |
재고3,248 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 28-CFlatPack | 28-Flatpack, Ceramic Bottom-Brazed |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
패키지: - |
재고3,136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 90NS 32CLCC
|
패키지: 32-CLCC |
재고7,664 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 90ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
패키지: - |
재고7,152 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
패키지: 32-CLCC |
재고7,136 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 3ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
패키지: - |
재고2,544 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | - | - | - |
||
Microchip Technology |
IC EEPROM 256KBIT 150NS 32CLCC
|
패키지: 32-CLCC |
재고3,376 |
|
EEPROM | EEPROM | 256Kb (32K x 8) | Parallel | - | 10ms | 150ns | 4.5 V ~ 5.5 V | -55°C ~ 125°C (TC) | Surface Mount | 32-CLCC | 32-CLCC (13.97x11.43) |