이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
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Molex, LLC |
CONN FPC BOTTOM 6POS 0.50MM R/A
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패키지: - |
재고3,132 |
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Surface Mount, Right Angle | Contacts, Bottom | 6 | 0.020" (0.50mm) | Solder | 0.12mm | 0.031" (0.80mm) | Flip Lock, Backlock | Notched | Copper Alloy | Gold | Polymer, Glass Filled | Polymer, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 HB |
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Molex, LLC |
CONN FPC BOTTOM 5POS 0.50MM R/A
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패키지: - |
재고44,772 |
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Surface Mount, Right Angle | Contacts, Bottom | 5 | 0.020" (0.50mm) | Solder | 0.12mm | 0.031" (0.80mm) | Flip Lock, Backlock | Notched | Copper Alloy | Gold | Polymer, Glass Filled | Polymer, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 4POS 0.50MM R/A
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패키지: - |
재고36,000 |
|
Surface Mount, Right Angle | Contacts, Bottom | 4 | 0.020" (0.50mm) | Solder | 0.12mm | 0.031" (0.80mm) | Flip Lock, Backlock | Notched | Copper Alloy | Gold | Polymer, Glass Filled | Polymer, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 21POS 0.30MM R/A
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패키지: - |
재고7,704 |
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Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.012" (0.30mm) | Solder | 0.20mm | 0.041" (1.05mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA46), Nylon 4/6 | Solder Retention | - | - | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 17POS 0.30MM R/A
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패키지: - |
재고8,676 |
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Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.012" (0.30mm) | Solder | 0.20mm | 0.041" (1.05mm) | Flip Lock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA46), Nylon 4/6 | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 24POS 0.50MM R/A
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패키지: - |
재고8,946 |
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Surface Mount, Right Angle | Contacts, Top | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 20POS 0.50MM R/A
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패키지: - |
재고4,860 |
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Surface Mount, Right Angle | Contacts, Top | 20 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC FPC TOP 6POS 0.50MM R/A
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패키지: - |
재고3,186 |
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Surface Mount, Right Angle | Contacts, Top | 6 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 39POS 0.30MM R/A
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패키지: - |
재고2,124 |
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Surface Mount, Right Angle | Contacts, Bottom | 39 | 0.012" (0.30mm) | Solder | 0.20mm | 0.077" (1.95mm) | Flip Lock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 24POS 0.50MM R/A
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패키지: - |
재고7,722 |
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Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 9POS 0.50MM SMD
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패키지: - |
재고6,318 |
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Surface Mount | Contacts, Vertical, 1 Sided | 9 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 9POS 0.50MM SMD
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패키지: - |
재고3,580 |
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Surface Mount | Contacts, Vertical, 1 Sided | 9 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 9POS 0.50MM SMD
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패키지: - |
재고7,056 |
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Surface Mount | Contacts, Vertical, 1 Sided | 9 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 8POS 0.50MM SMD
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패키지: - |
재고2,196 |
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Surface Mount | Contacts, Vertical, 1 Sided | 8 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 23POS 0.30MM R/A
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패키지: - |
재고6,336 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 23 | 0.012" (0.30mm) | Solder | 0.20mm | 0.045" (1.14mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
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Molex, LLC |
CONN FPC 25POS 0.30MM R/A
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패키지: - |
재고3,508 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 25 | 0.012" (0.30mm) | Solder | 0.20mm | 0.045" (1.14mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
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Molex, LLC |
CONN FPC 27POS 0.30MM R/A
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패키지: - |
재고8,352 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 27 | 0.012" (0.30mm) | Solder | 0.20mm | 0.045" (1.14mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
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Molex, LLC |
CONN FPC 33POS 0.30MM R/A
|
패키지: - |
재고5,526 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 33 | 0.012" (0.30mm) | Solder | 0.20mm | 0.045" (1.14mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention | 50V | -40°C ~ 85°C | UL94 V-0, UL94 HB |
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Molex, LLC |
CONN FFC BOTTOM 22POS 0.50MM R/A
|
패키지: - |
재고7,092 |
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Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 21POS 0.30MM R/A
|
패키지: - |
재고5,040 |
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Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.012" (0.30mm) | Solder | 0.20mm | 0.051" (1.30mm) | Flip Lock | Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP) | Polyamide (PA46), Nylon 4/6 | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 5POS 0.50MM R/A
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패키지: - |
재고8,514 |
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Surface Mount, Right Angle | Contacts, Bottom | 5 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 33POS 0.50MM R/A
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패키지: - |
재고4,194 |
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Surface Mount, Right Angle | Contacts, Top | 33 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC FPC 12POS 0.50MM R/A
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패키지: - |
재고2,772 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | - | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 15POS 1.00MM SMD
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패키지: - |
재고7,524 |
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Surface Mount | Contacts, Vertical, 1 Sided | 15 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | 125V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC VERT 12POS 1.00MM SMD
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패키지: - |
재고2,412 |
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Surface Mount | Contacts, Vertical, 1 Sided | 12 | 0.039" (1.00mm) | Solder | 0.30mm | 0.226" (5.74mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Zero Insertion Force (ZIF) | - | - | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 8POS 1.00MM R/A
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패키지: - |
재고5,022 |
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Through Hole, Right Angle | Contacts, Bottom | 8 | 0.039" (1.00mm) | Kinked Pin | 0.30mm | 0.165" (4.20mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA66), Nylon 6/6 | Polyester | Zero Insertion Force (ZIF) | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 33POS 0.50MM R/A
|
패키지: - |
재고7,056 |
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Surface Mount, Right Angle | Contacts, Bottom | 33 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 30POS 0.50MM R/A
|
패키지: - |
재고2,448 |
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Surface Mount, Right Angle | Contacts, Bottom | 30 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |