페이지 127 - NXP 제품 - 내장형 - 마이크로 컨트롤러

SP5748GTK0AMMJ6R

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

패키지: 256-LBGA

재고7,344

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5646CCK0MLT1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

패키지: 208-LQFP

재고4,208

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 125°C (TA)

-

208-LQFP

208-TQFP (28x28)

SPC5646CCAMLT1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

패키지: 208-LQFP

재고5,264

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 125°C (TA)

-

208-LQFP

208-TQFP (28x28)

SPC5777CSK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

패키지: 416-BGA

재고6,288

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SP5748GHK0AMKU6R

NXP

ULTRA RELIABLE MCU WITH VAST PER

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP Exposed Pad

재고2,592

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

129

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

176-LQFP Exposed Pad

176-LQFP (24x24)

SPC5777CLK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

패키지: 416-BGA

재고6,768

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5777CDK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

패키지: 416-BGA

재고7,104

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5777CCK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

패키지: 416-BGA

재고7,888

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5674KAVMS2R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z7d
Core Size: 32-Bit Dual-Core
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 384K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 5.5 V
Data Converters: A/D 34x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 473-LFBGA
Supplier Device Package: 473-MAPBGA (19x19)

패키지: 473-LFBGA

재고5,584

32-Bit Dual-Core

180MHz

CANbus, EBI/EMI, Ethernet, FlexRay, I²C, LINbus, SPI

DMA, POR, PWM, WDT

-

1.5MB (1.5M x 8)

FLASH

64K x 8

384K x 8

1.14 V ~ 5.5 V

A/D 34x12b

Internal

-40°C ~ 105°C (TA)

-

473-LFBGA

473-MAPBGA (19x19)

SPC5748GSK0AMMJ6

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

패키지: 256-LBGA

재고3,200

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5668GF1AMMGR

NXP

NXP 32-BIT MCU POWER ARCH 2MB FL

Core Processor: e200z650
Core Size: 32-Bit
Speed: 116MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 155
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 592K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

패키지: 208-BGA

재고4,080

32-Bit

116MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

155

2MB (2M x 8)

FLASH

-

592K x 8

3 V ~ 5.5 V

A/D 36x10b

Internal

-40°C ~ 125°C (TA)

-

208-BGA

208-MAPBGA (17x17)

FS32R274KSK2MMMR

NXP

IC SRAM 2M FLASH 257MAPBGA

Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit Tri-Core
Speed: 180MHz, 240MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 1.5M x 8
Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

패키지: 257-LFBGA

재고5,872

32-Bit Tri-Core

180MHz, 240MHz

CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire

POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

1.5M x 8

1.19 V ~ 5.5 V

A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b

Internal

-40°C ~ 125°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

FS32R274KBK2MMMR

NXP

2M FLASH 1.5MB SRAM 2X

Core Processor: e200z4, e200z7 (2)
Core Size: 32-Bit Tri-Core
Speed: 180MHz, 240MHz
Connectivity: CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 1.5M x 8
Voltage - Supply (Vcc/Vdd): 1.19 V ~ 5.5 V
Data Converters: A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

패키지: 257-LFBGA

재고3,488

32-Bit Tri-Core

180MHz, 240MHz

CANbus, Ethernet, FlexRay, I²C, LINbus, SPI, ZipWire

POR, PWM, WDT

-

2MB (2M x 8)

FLASH

64K x 8

1.5M x 8

1.19 V ~ 5.5 V

A/D 16x12b SAR, 4x12 Sigma, D/A 1x12b

Internal

-40°C ~ 125°C (TA)

-

257-LFBGA

257-MAPBGA (14x14)

SPC5748GGK0AVMJ6

NXP

32 BIT6MB FLASH768 RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

패키지: 256-LBGA

재고5,648

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 105°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5646CCF0VLT1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

패키지: 208-LQFP

재고6,928

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 105°C (TA)

-

208-LQFP

208-TQFP (28x28)

SPC5777CK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

패키지: 416-BGA

재고6,336

32-Bit Tri-Core

264MHz

CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SPC5777CAK3MME3R

NXP

NXP 32-BIT MCU POWER ARCH CORES

Core Processor: e200z7
Core Size: 32-Bit Tri-Core
Speed: 264MHz
Connectivity: EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI
Peripherals: DMA, LVD, POR, Zipwire
Number of I/O: -
Program Memory Size: 8MB (8M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16b Sigma-Delta, eQADC
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 416-BGA
Supplier Device Package: 416-MAPBGA (27x27)

패키지: 416-BGA

재고6,928

32-Bit Tri-Core

264MHz

EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI

DMA, LVD, POR, Zipwire

-

8MB (8M x 8)

FLASH

-

512K x 8

3 V ~ 5.5 V

A/D 16b Sigma-Delta, eQADC

Internal

-40°C ~ 125°C (TA)

-

416-BGA

416-MAPBGA (27x27)

SP5748GTK0AMKU6R

NXP

TRIPLE CORE 6M FLASH

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP Exposed Pad

재고5,232

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

129

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

176-LQFP Exposed Pad

176-LQFP (24x24)

SP5748GBK0AMMJ6R

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

패키지: 256-LBGA

재고3,520

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5646CK0MMJ1

NXP

3M FLASH256K RAM120MHZ

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고4,096

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

199

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPBGA

SPC5646CF0MMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고4,640

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

199

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 125°C (TA)

-

256-LBGA

256-MAPBGA

SPC5668GAVMG

NXP

NXP 32-BIT MCU POWER ARCH 2MB

Core Processor: e200z650
Core Size: 32-Bit
Speed: 116MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 155
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 592K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

패키지: 208-BGA

재고38,880

32-Bit

116MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

155

2MB (2M x 8)

FLASH

-

592K x 8

3 V ~ 5.5 V

A/D 36x10b

Internal

-40°C ~ 105°C (TA)

-

208-BGA

208-MAPBGA (17x17)

SPC5748GBK0AVMJ6

NXP

TRIPLE CORE 6M FLASH 768K RAM

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 178
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPPBGA (17x17)

패키지: 256-LBGA

재고2,192

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

178

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 105°C (TA)

-

256-LBGA

256-MAPPBGA (17x17)

SPC5646CCF0VLT1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

패키지: 208-LQFP

재고6,144

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 105°C (TA)

-

208-LQFP

208-TQFP (28x28)

SPC5748GBK0AVKU6

NXP

TRIPLE CORE, 6M FLASH

Core Processor: e200z2, e200z4, e200z4
Core Size: 32-Bit Tri-Core
Speed: 80MHz/160MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG
Peripherals: DMA, LVD, POR, WDT
Number of I/O: 129
Program Memory Size: 6MB (6M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 80x10b, 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP Exposed Pad

재고5,424

32-Bit Tri-Core

80MHz/160MHz

CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG

DMA, LVD, POR, WDT

129

6MB (6M x 8)

FLASH

-

768K x 8

3 V ~ 5.5 V

A/D 80x10b, 64x12b

Internal

-40°C ~ 125°C (TA)

-

176-LQFP Exposed Pad

176-LQFP (24x24)

SPC5646CF0MLT1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 177
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 208-LQFP
Supplier Device Package: 208-TQFP (28x28)

패키지: 208-LQFP

재고5,040

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

177

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 125°C (TA)

-

208-LQFP

208-TQFP (28x28)

SPC5646CCK0MLU1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 147
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 27x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP

재고7,728

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

147

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 27x10b, 5x12b

Internal

-40°C ~ 125°C (TA)

-

176-LQFP

176-LQFP (24x24)

SPC5646CCK0VMJ1

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4d, e200z0h
Core Size: 32-Bit Dual-Core
Speed: 80MHz/120MHz
Connectivity: CANbus, Ethernet, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 199
Program Memory Size: 3MB (3M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x10b, 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고6,496

32-Bit Dual-Core

80MHz/120MHz

CANbus, Ethernet, I²C, LINbus, SCI, SPI

DMA, POR, PWM, WDT

199

3MB (3M x 8)

FLASH

64K x 8

256K x 8

3 V ~ 5.5 V

A/D 33x10b, 10x12b

Internal

-40°C ~ 105°C (TA)

-

256-LBGA

256-MAPBGA