이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고3,152 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고6,752 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고4,240 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고5,344 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TRANSCEIVER 14HVSON
|
패키지: 14-VDFN Exposed Pad |
재고2,608 |
|
CAN | 1/1 | - | - | - | 3.3 V ~ 5 V | - | Surface Mount | 14-VDFN Exposed Pad | 14-HVSON (3x4.5) |
||
NXP |
IC TRANSCEIVER CAN HS 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고3,424 |
|
CAN | 1/1 | Half | 300mV | 5Mbps | 4.75 V ~ 5.25 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TRANSCEIVER CAN HS 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고6,912 |
|
CAN | 1/1 | Half | 300mV | 5Mbps | 4.75 V ~ 5.25 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,656 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC LIN TRANSCEIVER 8-SO
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,480 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC LIN TRANSCEIVER 8-SO
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고5,616 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC LIN TRANSCEIVER 8-SO
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고3,904 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC LIN TRANSCEIVER 8-SO
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,480 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC LIN TRANSCEIVER 8-SO
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고5,632 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고2,176 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고2,992 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고5,856 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고7,040 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고5,488 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN SAE J2602 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고2,192 |
|
LIN | 1/1 | Full | 200mV | - | 5.5 V ~ 28 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TRANSCEIVER CAN HS 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고6,000 |
|
CAN | 1/1 | Half | 300mV | - | 4.75 V ~ 5.25 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |
||
NXP |
IC TXRX LIN 2.1/SAE J2602 8-SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,880 |
|
LIN | 1/1 | Full | 175mV | - | 5.5 V ~ 27 V | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC LIN INTERFACE W/WAKE 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고4,992 |
|
LIN | 1/1 | Half | 175mV | 20kbps | 7 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
IC LIN INTERFACE W/WAKE 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고25,428 |
|
LIN | 1/1 | Half | 175mV | 20kbps | 7 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
IC LIN INTERFACE W/WAKE 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,832 |
|
LIN | 1/1 | Half | 175mV | 10kbps | 7 V ~ 18 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
NXP |
IC LINE RCVR DUAL DIFF 8-SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고6,208 |
|
- | 0/2 | - | - | - | 5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC LINE RCVR DUAL DIFF 8-SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고2,464 |
|
- | 0/2 | - | - | - | 5 V ~ 18 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC TRANSCEIVER CAN HS 8SOIC
|
패키지: 8-SOIC (0.154", 3.90mm Width) |
재고7,872 |
|
CAN | 1/1 | Half | 300mV | - | 4.75 V ~ 5.25 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
NXP |
IC TRANSCEIVER CAN HS 8HVSON
|
패키지: 8-VDFN Exposed Pad |
재고7,680 |
|
CAN | 1/1 | Half | 300mV | - | 4.75 V ~ 5.25 V | -40°C ~ 150°C | Surface Mount | 8-VDFN Exposed Pad | 8-HVSON (3x3) |