페이지 15 - NXP 제품 - PMIC - 전력 관리 - 특수 | Heisener Electronics
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NXP 제품 - PMIC - 전력 관리 - 특수

기록 1,370
페이지  15/49
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Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MC33FS6516NAER2
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC32PF1550A8EP
NXP

POWER MANAGEMENT IC 3 BUCK REGS

  • Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
  • Current - Supply: -
  • Voltage - Supply: 4.1V ~ 6V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (5x5)
패키지: -
Request a Quote
-
4.1V ~ 6V
-40°C ~ 85°C (TA)
Surface Mount
40-VFQFN Exposed Pad
40-HVQFN (5x5)
MPF7100BVMA4ES
NXP

PF7100 PMIC I.MX8DXP/DX

  • Applications: i.MX Processors
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
패키지: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MC33FS6508NAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6515KAER2
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6527CAER2
NXP

SYSTEM BASIS CHIP, DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MFS8601BMDA0ESR2
NXP

SAFETY SYSTEM BASIS CHIP FOR DOM

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
패키지: -
Request a Quote
-
60V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
MPF5020AVNA0ESR2
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
패키지: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MC35FS6515CAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MWCT1213AVLH
NXP

15W, MULTI-COIL AUTO, MULTI-DEVI

  • Applications: Controller, Wireless Power Transmitter
  • Current - Supply: 300µA
  • Voltage - Supply: 2.7V ~ 3.6V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
패키지: -
Request a Quote
300µA
2.7V ~ 3.6V
-40°C ~ 105°C (TA)
Surface Mount
64-LQFP
64-LQFP (10x10)
MC33PF8200EMESR2
NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
패키지: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS6507CAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6507NAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC35FS6515NAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 2.7V ~ 40V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
2.7V ~ 40V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC33FS6507KAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MPF5030BMDA0ES
NXP

POWER MANAGEMENT IC, S32, NON-PR

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 3.3V ~ 5.25V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-PowerVFQFN
  • Supplier Device Package: 40-HVQFN (6x6)
패키지: -
재고1,299
-
3.3V ~ 5.25V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-PowerVFQFN
40-HVQFN (6x6)
MC33FS6507LAE
NXP

SYSTEM BASIS CHIP, DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MFS8600BMDA0ES
NXP

IC FS86 SYSTEM BASIS CHIP ASIL

  • Applications: Camera
  • Current - Supply: -
  • Voltage - Supply: 4.5V ~ 60V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: -
Request a Quote
-
4.5V ~ 60V
-40°C ~ 125°C (TA)
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF1550A9EPR2
NXP

POWER MANAGEMENT IC 3 BUCK REGS

  • Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
  • Current - Supply: -
  • Voltage - Supply: 4.1V ~ 6V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (5x5)
패키지: -
Request a Quote
-
4.1V ~ 6V
-40°C ~ 85°C (TA)
Surface Mount
40-VFQFN Exposed Pad
40-HVQFN (5x5)
MC33PF8100CEESR2
NXP

PF8100

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-HVQFN (8x8)
패키지: -
Request a Quote
-
2.5V ~ 5.5V
-40°C ~ 105°C (TA)
Surface Mount, Wettable Flank
56-VFQFN Exposed Pad
56-HVQFN (8x8)
MC33FS4505CAER2
NXP

SYSTEM BASIS CHIP, LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MC35FS6518NAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
Request a Quote
-
1V ~ 5V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-HLQFP (7x7)
MPF5020CMMA0ES
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
패키지: -
Request a Quote
-
-
-
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)
MFS5600AMMA0ESR2
NXP

DUAL 36V AUTOMOTIVE DC-DC CONTRO

  • Applications: -
  • Current - Supply: 140µA
  • Voltage - Supply: 2.7V ~ 36V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
패키지: -
Request a Quote
140µA
2.7V ~ 36V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
32-VFQFN Exposed Pad
32-HVQFN (5x5)
MFS2602AMDA0AD
NXP

AUTO SBC

  • Applications: -
  • Current - Supply: 30µA
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
패키지: -
Request a Quote
30µA
3.2V ~ 40V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP-EP (7x7)
MPF7100BVBA4ESR2
NXP

POWER MANAGEMENT IC, I.MX 8DX/8D

  • Applications: i.MX Processors
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-HVQFN (7x7)
패키지: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
48-VFQFN Exposed Pad
48-HVQFN (7x7)
TEA2206T-1J
NXP

IC ACTIVE BRIDGE CTRL SO8

  • Applications: Desktop, Notebook PCs
  • Current - Supply: 2mA
  • Voltage - Supply: 440V
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
패키지: -
재고14,505
2mA
440V
-40°C ~ 125°C (TJ)
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SO
MPF5020CMMACES
NXP

POWER MANAGEMENT IC, PRE-PROG, 3

  • Applications: High Performance i.MX 8, S32x Processor Based
  • Current - Supply: 10µA
  • Voltage - Supply: 2.5V ~ 5.5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount, Wettable Flank
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (6x6)
패키지: -
Request a Quote
10µA
2.5V ~ 5.5V
-40°C ~ 125°C (TA)
Surface Mount, Wettable Flank
40-VFQFN Exposed Pad
40-HVQFN (6x6)