이미지 |
부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Current - Supply | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고4,992 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고3,504 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
패키지: 56-VFQFN Exposed Pad |
재고2,128 |
|
- | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고3,088 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
패키지: 56-VFQFN Exposed Pad |
재고4,064 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
패키지: 56-VFQFN Exposed Pad |
재고4,480 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
패키지: 56-VFQFN Exposed Pad |
재고2,416 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
패키지: 56-VFQFN Exposed Pad |
재고4,544 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8M MINI
|
패키지: 56-VFQFN Exposed Pad |
재고5,472 |
|
- | 2.7V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
패키지: - |
재고2,928 |
|
- | - | - | - | - | - |
||
NXP |
POWER MANAGEMENT IC FOR LOW-POWE
|
패키지: 25-UFBGA, WLCSP |
재고2,704 |
|
- | 3.3V ~ 5.5V | -40°C ~ 85°C (TA) | Surface Mount | 25-UFBGA, WLCSP | 25-WLCSP (2.09x2.09) |
||
NXP |
IC POWER MANAGEMENT
|
패키지: 56-VFQFN Exposed Pad |
재고6,300 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
패키지: 56-VFQFN Exposed Pad |
재고7,620 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
패키지: 56-VFQFN Exposed Pad |
재고8,328 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
패키지: - |
재고6,372 |
|
- | - | - | - | - | - |
||
NXP |
IC POWER MANAGEMENT
|
패키지: 56-VFQFN Exposed Pad |
재고6,348 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
패키지: 56-VFQFN Exposed Pad |
재고8,088 |
|
- | - | - | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC WIRELESS PWR TX 96KB LQFP48
|
패키지: 48-LQFP |
재고12,612 |
|
1.7mA | 3V ~ 3.6V | -40°C ~ 105°C (TA) | Surface Mount | 48-LQFP | 48-LQFP (7x7) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고5,760 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고2,432 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT
|
패키지: 56-VFQFN Exposed Pad |
재고4,096 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고2,496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QXP
|
패키지: 56-VFQFN Exposed Pad |
재고6,256 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고7,888 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고7,344 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC POWER MANAGEMENT I.MX8QM
|
패키지: 56-VFQFN Exposed Pad |
재고6,496 |
|
- | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | Surface Mount, Wettable Flank | 56-VFQFN Exposed Pad | 56-HVQFN (8x8) |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
패키지: - |
재고4,784 |
|
- | - | - | - | - | - |
||
NXP |
IC SBCS CAN HIGH SPEED 48HTQFP
|
패키지: - |
재고7,936 |
|
- | - | - | - | - | - |