페이지 37 - NXP 제품 - PMIC - 전력 관리 - 특수 | Heisener Electronics
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NXP 제품 - PMIC - 전력 관리 - 특수

기록 1,370
페이지  37/49
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제조업체
설명
패키지
재고
수량
Current - Supply
Voltage - Supply
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
MC33FS6500CAER2
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고7,568
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS4500CAER2
NXP

FS4500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고5,136
-
-1.0 V ~ 40 V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6520NAER2
NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고6,080
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS4500CAER2
NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고5,696
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MWCT1011CFM
NXP

15W SINGLE-COIL CONSUMER STAND

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고4,256
-
-
-
-
-
-
MC34VR500V8ESR2
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
패키지: 56-VFQFN Exposed Pad
재고6,336
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V7ESR2
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
패키지: 56-VFQFN Exposed Pad
재고4,656
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V6ESR2
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
패키지: 56-VFQFN Exposed Pad
재고5,856
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V5ESR2
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
패키지: 56-VFQFN Exposed Pad
재고3,904
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC34VR500V4ESR2
NXP

REGULATOR BUCK QUAD WITH UP TO

  • Applications: QorlQ LS1/T1 Communications Processors
  • Current - Supply: 250µA
  • Voltage - Supply: 2.8 V ~ 4.5 V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFQFN Exposed Pad
  • Supplier Device Package: 56-QFN-EP (8x8)
패키지: 56-VFQFN Exposed Pad
재고7,328
250µA
2.8 V ~ 4.5 V
-40°C ~ 105°C (TA)
Surface Mount
56-VFQFN Exposed Pad
56-QFN-EP (8x8)
MC35FS6510NAER2
NXP

FS6500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고4,400
-
-1.0 V ~ 40 V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6510NAER2
NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고5,616
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS6500NAER2
NXP

FS6500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고4,160
-
-1.0 V ~ 40 V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33FS6500NAER2
NXP

SYSTEM BASIS CHIP DCDC 0.8A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고5,504
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34FS6408NAER2
NXP

SYSTEM BASIS CHIP CAN 5V 1.5

  • Applications: System Basis Chip
  • Current - Supply: 13mA
  • Voltage - Supply: 2.7 V ~ 36 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고5,040
13mA
2.7 V ~ 36 V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC35FS4500NAER2
NXP

FS4500

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고7,136
-
-1.0 V ~ 40 V
-40°C ~ 150°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC33PF3000A6ES
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고4,944
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33PF3000A5ES
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고6,784
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33PF3000A4ES
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고6,144
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33PF3000A3ES
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고5,552
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33PF3000A0ES
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고6,736
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33FS4500NAER2
NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: -1.0 V ~ 40 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고2,144
-
-1.0 V ~ 40 V
-40°C ~ 125°C (TA)
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34FS6407NAER2
NXP

SYSTEM BASIS CHIP CAN 5V 0.7

  • Applications: System Basis Chip
  • Current - Supply: 13mA
  • Voltage - Supply: 2.7 V ~ 36 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP Exposed Pad
재고5,536
13mA
2.7 V ~ 36 V
-40°C ~ 125°C
Surface Mount
48-LQFP Exposed Pad
48-LQFP (7x7)
MC34PF3000A8EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고7,616
-
2.8 V ~ 5.5 V
-40°C ~ 105°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC33664ATL1EGR2
NXP

TRANSFORMER PHYSICAL LAYER

  • Applications: Isolated Communications Interface
  • Current - Supply: 40mA
  • Voltage - Supply: 4.5 V ~ 7 V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 16-SOIC
패키지: 16-SOIC (0.154", 3.90mm Width)
재고4,128
40mA
4.5 V ~ 7 V
-40°C ~ 125°C (TA)
Surface Mount
16-SOIC (0.154", 3.90mm Width)
16-SOIC
MC32PF3000A8EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고5,056
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC32PF3000A6EP
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고3,232
-
2.8 V ~ 5.5 V
-40°C ~ 85°C
Surface Mount
48-VFQFN Exposed Pad
48-QFN (7x7)
MC34PF1550A7EP
NXP

PF1550

  • Applications: Embedded Systems, Low-Power IoT, Mobile/Wearable Devices
  • Current - Supply: -
  • Voltage - Supply: 3.8 V ~ 7 V
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-QFN (5x5)
패키지: 40-VFQFN Exposed Pad
재고4,912
-
3.8 V ~ 7 V
-40°C ~ 105°C
Surface Mount
40-VFQFN Exposed Pad
40-QFN (5x5)