페이지 103 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF8P9300HSR5	NXP	FET RF 2CH 70V 960MHZ NI-1230HS Transistor Type: LDMOS (Dual) Frequency: 960MHz Gain: 19.4dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 2.4A Power - Output: 100W Voltage - Rated: 70V Package / Case: NI-1230S Supplier Device Package: NI-1230S	패키지: NI-1230S	재고6,896
MRFE6S9200HSR5	NXP	FET RF 66V 880MHZ NI-880S Transistor Type: LDMOS Frequency: 880MHz Gain: 21dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 58W Voltage - Rated: 66V Package / Case: NI-880S Supplier Device Package: NI-880S	패키지: NI-880S	재고5,632
LD6836CX4/21HYL	NXP	IC REG LINEAR 2.1V 300MA UNCASED Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.1V Voltage - Output (Max): - Voltage Dropout (Max): 0.16V @ 300mA Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-XFBGA Supplier Device Package: -	패키지: 4-XFBGA	재고6,208
PCA8546ATT/AJ	NXP	IC LCD DRIVER UNIV 56TSSOP Display Type: LCD Configuration: 176 Segment Interface: I2C Digits or Characters: - Current - Supply: 30µA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 95°C Mounting Type: Surface Mount Package / Case: 56-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 56-TSSOP	패키지: 56-TFSOP (0.240", 6.10mm Width)	재고17,790
UJA1075TW/3V3/WD,1	NXP	IC SBC CAN/LIN HS 3.3V 32HTSSOP Applications: Automotive Interface: CAN, LIN Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	재고3,088
PCA9542AD,118	NXP	IC I2C MUX 2CH 14-SOIC Applications: 2-Channel I2C Multiplexer Interface: I2C Voltage - Supply: 2.3 V ~ 5.5 V Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO Mounting Type: Surface Mount	패키지: 14-SOIC (0.154", 3.90mm Width)	재고24,642
TJA1050T/N1,112	NXP	IC CAN TRANSCEIVER HS 8-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고3,728
MPC8377EVRAJF	NXP	IC MPU MPC83XX 533MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Security; SEC 3.0 RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고6,800
MC860ENCVR50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고5,808
MPC8555VTALF	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고7,488
MPC860SRCVR66D4	NXP	IC MPU MPC8XX 66MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고6,848
MCIMX6D6AVT10ADR	NXP	IC MPU I.MX6D 1.0GHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	패키지: 624-FBGA, FCBGA	재고2,768
MPC564MVR56R2	NXP	IC MCU 32BIT 512KB FLASH 388BGA Core Processor: PowerPC Core Size: 32-Bit Speed: 56MHz Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 56 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V Data Converters: A/D 32x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 388-BBGA Supplier Device Package: 388-PBGA (27x27)	패키지: 388-BBGA	재고5,696
MC908GR8CDWER	NXP	IC MCU 8BIT 7.5KB FLASH 28SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 17 Program Memory Size: 7.5KB (7.5K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 384 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 6x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	패키지: 28-SOIC (0.295", 7.50mm Width)	재고7,824
MC9S12HZ256VAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, I2C, SCI, SPI Peripherals: LCD, Motor control PWM, POR, PWM, WDT Number of I/O: 85 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고33,528
S908AB32AH3VFUE	NXP	IC MCU 8BIT 32KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM Number of I/O: 51 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고4,160
MK50DX128CMC7	NXP	IC MCU 32BIT 128KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 72MHz Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 63 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 36x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	패키지: 121-LFBGA	재고6,672
MM912JP812AMAF	NXP	IC DRVR INJECTOR/IGN 100LQFP Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	패키지: 100-LQFP Exposed Pad	재고6,016
MC145152DW2	NXP	IC PAR-IN PLL FREQ SYNTH 28-SOIC Type: PLL Clock/Frequency Synthesizer PLL: Yes Input: Clock Output: CMOS Number of Circuits: 1 Ratio - Input:Output: 1:1 Differential - Input:Output: No/No Frequency - Max: 25MHz Divider/Multiplier: Yes/No Voltage - Supply: 3 V ~ 9 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	패키지: 28-SOIC (0.295", 7.50mm Width)	재고21,120
MPX2102D	NXP	SENSOR DIFF PRESS 14.5PSI MAX Pressure Type: Differential Operating Pressure: 14.5 PSI (100 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: -0.6% ~ 0.4% Voltage - Supply: 10 V ~ 16 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 4-SIP Module Supplier Device Package: -	패키지: 4-SIP Module	재고3,528
MC33941EGR2	NXP	SENSOR IC TOUCH/PROXMTY 24SOIC Amplifier Type: - Voltage - Supply: - Output Type: - Current - Supply: - Operating Temperature: - Mounting Type: -	패키지: -	재고3,546
MC33FS6511CAE	NXP	SYSTEM BASIS CHIP DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP Exposed Pad	재고7,104
FS32K144UFT0VLHT	NXP	S32K144 32-BIT MCU ARM CORTEX-M Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고4,864
MC9S08QL8CTG	NXP	IC MCU 8BIT 8KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LINbus, SCI Peripherals: LVD, PWM, WDT Number of I/O: 14 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고11,532
LPC55S16JBD100K	NXP	IC MCU 32BIT 256KB FLSH 100LQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	패키지: -	Request a Quote
S9S12GN16J1MLCR	NXP	IC MCU 16BIT 16KB FLASH 32LQFP Core Processor: S12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: -	Request a Quote
S912ZVL64AVFMR	NXP	S12Z CPU, 64K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote
S912ZVCA19F1WLF	NXP	S12Z, 48LQFP, 192K FLASH Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V Data Converters: A/D 10x12b SAR; D/A 1x8b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote

MRF8P9300HSR5

NXP

FET RF 2CH 70V 960MHZ NI-1230HS

Transistor Type: LDMOS (Dual)
Frequency: 960MHz
Gain: 19.4dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 2.4A
Power - Output: 100W
Voltage - Rated: 70V
Package / Case: NI-1230S
Supplier Device Package: NI-1230S

패키지: NI-1230S

재고6,896

MRFE6S9200HSR5

NXP

FET RF 66V 880MHZ NI-880S

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 21dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 58W
Voltage - Rated: 66V
Package / Case: NI-880S
Supplier Device Package: NI-880S

패키지: NI-880S

재고5,632

LD6836CX4/21HYL

NXP

IC REG LINEAR 2.1V 300MA UNCASED

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.1V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.16V @ 300mA
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-XFBGA
Supplier Device Package: -

패키지: 4-XFBGA

재고6,208

PCA8546ATT/AJ

NXP

IC LCD DRIVER UNIV 56TSSOP

Display Type: LCD
Configuration: 176 Segment
Interface: I2C
Digits or Characters: -
Current - Supply: 30µA
Voltage - Supply: 1.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 95°C
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 56-TSSOP

패키지: 56-TFSOP (0.240", 6.10mm Width)

재고17,790

UJA1075TW/3V3/WD,1

NXP

IC SBC CAN/LIN HS 3.3V 32HTSSOP

Applications: Automotive
Interface: CAN, LIN
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

재고3,088

PCA9542AD,118

NXP

IC I2C MUX 2CH 14-SOIC

Applications: 2-Channel I2C Multiplexer
Interface: I2C
Voltage - Supply: 2.3 V ~ 5.5 V
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO
Mounting Type: Surface Mount

패키지: 14-SOIC (0.154", 3.90mm Width)

재고24,642

TJA1050T/N1,112

NXP

IC CAN TRANSCEIVER HS 8-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고3,728

MPC8377EVRAJF

NXP

IC MPU MPC83XX 533MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고6,800

MC860ENCVR50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고5,808

MPC8555VTALF

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고7,488

MPC860SRCVR66D4

NXP

IC MPU MPC8XX 66MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고6,848

MCIMX6D6AVT10ADR

NXP

IC MPU I.MX6D 1.0GHZ 624FCBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

패키지: 624-FBGA, FCBGA

재고2,768

MPC564MVR56R2

NXP

IC MCU 32BIT 512KB FLASH 388BGA

Core Processor: PowerPC
Core Size: 32-Bit
Speed: 56MHz
Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 56
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
Data Converters: A/D 32x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 388-BBGA
Supplier Device Package: 388-PBGA (27x27)

패키지: 388-BBGA

재고5,696

MC908GR8CDWER

NXP

IC MCU 8BIT 7.5KB FLASH 28SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 17
Program Memory Size: 7.5KB (7.5K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 384 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 6x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

패키지: 28-SOIC (0.295", 7.50mm Width)

재고7,824

MC9S12HZ256VAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, I2C, SCI, SPI
Peripherals: LCD, Motor control PWM, POR, PWM, WDT
Number of I/O: 85
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고33,528

S908AB32AH3VFUE

NXP

IC MCU 8BIT 32KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM
Number of I/O: 51
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고4,160

MK50DX128CMC7

NXP

IC MCU 32BIT 128KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 72MHz
Connectivity: EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 63
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 36x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

패키지: 121-LFBGA

재고6,672

MM912JP812AMAF

NXP

IC DRVR INJECTOR/IGN 100LQFP

Applications: Engine Control
Core Processor: S12P
Program Memory Type: FLASH (128 kB)
Controller Series: HCS12
RAM Size: 6K x 8
Interface: CAN, SCI, SPI
Number of I/O: 8
Voltage - Supply: 4.7 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-LQFP-EP (14x14)

패키지: 100-LQFP Exposed Pad

재고6,016

MC145152DW2

NXP

IC PAR-IN PLL FREQ SYNTH 28-SOIC

Type: PLL Clock/Frequency Synthesizer
PLL: Yes
Input: Clock
Output: CMOS
Number of Circuits: 1
Ratio - Input:Output: 1:1
Differential - Input:Output: No/No
Frequency - Max: 25MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3 V ~ 9 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

패키지: 28-SOIC (0.295", 7.50mm Width)

재고21,120

MPX2102D

NXP

SENSOR DIFF PRESS 14.5PSI MAX

Pressure Type: Differential
Operating Pressure: 14.5 PSI (100 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -0.6% ~ 0.4%
Voltage - Supply: 10 V ~ 16 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 4-SIP Module
Supplier Device Package: -

패키지: 4-SIP Module

재고3,528

MC33941EGR2

NXP

SENSOR IC TOUCH/PROXMTY 24SOIC

Amplifier Type: -
Voltage - Supply: -
Output Type: -
Current - Supply: -
Operating Temperature: -
Mounting Type: -

패키지: -

재고3,546

MC33FS6511CAE

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP Exposed Pad

재고7,104

FS32K144UFT0VLHT

NXP

S32K144 32-BIT MCU ARM CORTEX-M

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고4,864

MC9S08QL8CTG

NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Number of I/O: 14
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고11,532

LPC55S16JBD100K

NXP

IC MCU 32BIT 256KB FLSH 100LQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

패키지: -

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S9S12GN16J1MLCR

NXP

IC MCU 16BIT 16KB FLASH 32LQFP

Core Processor: S12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: -

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S912ZVL64AVFMR

NXP

S12Z CPU, 64K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

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S912ZVCA19F1WLF

NXP

S12Z, 48LQFP, 192K FLASH

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 18V
Data Converters: A/D 10x12b SAR; D/A 1x8b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

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