페이지 112 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PZM20NB1,115	NXP	DIODE ZENER 20V 300MW SMT3 Voltage - Zener (Nom) (Vz): 20V Tolerance: ±2% Power - Max: 300mW Impedance (Max) (Zzt): 20 Ohms Current - Reverse Leakage @ Vr: 70nA @ 15V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고3,600
DC6M601X6/18S,135	NXP	IC REG BUCK 1.8V 0.65A 6WLCSP Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Fixed Number of Outputs: 1 Voltage - Input (Min): 2.3V Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.8V Voltage - Output (Max): - Current - Output: 650mA Frequency - Switching: 6MHz Synchronous Rectifier: Yes Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (1.36x0.96)	패키지: 6-XFBGA, WLCSP	재고4,016
SSTUA32866EC,518	NXP	IC BUFFER 1.8V 25BIT SOT536 Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity Supply Voltage: 1.7 V ~ 2 V Number of Bits: 25, 14 Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 96-LFBGA Supplier Device Package: 96-LFBGA (13.5x5.5)	패키지: 96-LFBGA	재고2,320
N74F08D,602	NXP	IC GATE AND 4CH 2-INP 14-SO Logic Type: AND Gate Number of Circuits: 4 Number of Inputs: 2 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	패키지: 14-SOIC (0.154", 3.90mm Width)	재고2,592
TDA1519CJ/N3C,112	NXP	IC AMP AUDIO PWR 22W MONO B 9SIL Type: Class B Output Type: 1-Channel (Mono) or 2-Channel (Stereo) Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 17.5 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -25°C ~ 150°C (TJ) Supplier Device Package: 9-SIL Package / Case: 9-SIP	패키지: 9-SIP	재고5,136
MC33972EW	NXP	IC SWITCH DETECT SPI 32-SOIC Applications: Switch Monitoring Interface: SPI Serial Voltage - Supply: 3.1 V ~ 5.25 V Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC Mounting Type: Surface Mount	패키지: 32-SOIC (0.295", 7.50mm Width)	재고6,272
UJA1076ATW/3V3/1J	NXP	IC SBC CAN/LIN 3.3V HS 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	재고5,184
MC33CD1030AE	NXP	SWITCH DETECT INTERFACE, 33 CHAN Applications: Switch Monitoring Interface: SPI Voltage - Supply: 4.5 V ~ 36 V Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7) Mounting Type: Surface Mount	패키지: 48-LQFP Exposed Pad	재고7,792
PCA9515AD,112	NXP	IC REDRIVER I2C 1CH 400KHZ 8SO Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 6pF Voltage - Supply: 2.3 V ~ 3.6 V Current - Supply: 800µA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고20,172
MPC8572LVTAULE	NXP	IC MPU MPC85XX 1.333GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	패키지: 1023-BFBGA, FCBGA	재고2,624
MCIMX6Q4AVT08AC	NXP	IC MPU I.MX6Q 852MHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 4 Core, 32-Bit Speed: 852MHZ Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	패키지: 624-FBGA, FCBGA	재고6,688
MC9328MXSVP10R2	NXP	IC MPU I.MXS 100MHZ 225MAPBGA Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 100MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: - SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 225-LFBGA Supplier Device Package: 225-MAPBGA (13x13)	패키지: 225-LFBGA	재고4,480
MCF5216CVF66J	NXP	IC MCU 32BIT 512KB FLASH 256BGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 66MHz Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 142 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 256-LBGA Supplier Device Package: 256-MAPBGA	패키지: 256-LBGA	재고5,360
MC9S12XA256CAL	NXP	IC MCU 16BIT 256KB FLASH 112LQFP Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고5,296
S9S12GN48F0CLH	NXP	IC MCU 16BIT 48KB FLASH 64LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고3,184
PCF85063TP/1Z	NXP	IC RTC CLK/CALENDAR I2C 8-SON Type: Clock/Calendar Features: Alarm, Leap Year, Square Wave Output Memory Size: - Time Format: HH:MM:SS (12/24 hr) Date Format: YY-MM-DD-dd Interface: I2C, 2-Wire Serial Voltage - Supply: 0.9 V ~ 5.5 V Voltage - Supply, Battery: - Current - Timekeeping (Max): 0.6µA @ 3.3V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 8-WFDFN Exposed Pad Supplier Device Package: 8-HWSON (2x3)	패키지: 8-WFDFN Exposed Pad	재고966,750
PCA2002TK/1,118	NXP	IC WATCH CIRCUIT 10HVSON PLL: No Main Purpose: Battery operated wrist watches Input: Crystal Output: - Number of Circuits: 1 Ratio - Input:Output: 1:2 Differential - Input:Output: No/No Frequency - Max: 32kHz Voltage - Supply: 1.1 V ~ 3.6 V Operating Temperature: -10°C ~ 60°C Mounting Type: Surface Mount Package / Case: 10-VFDFN Exposed Pad Supplier Device Package: 10-HVSON (3x3)	패키지: 10-VFDFN Exposed Pad	재고2,768
MC33FS6523CAE	NXP	SYSTEM BASIS CHIP DCDC 2.2A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP Exposed Pad	재고6,132
TEA19031AOT/1J	NXP	SMART CHARGING PROTOCOL CONTR US Output Isolation: - Internal Switch(s): - Voltage - Breakdown: - Topology: - Voltage - Start Up: - Voltage - Supply (Vcc/Vdd): - Duty Cycle: - Frequency - Switching: - Power (Watts): - Fault Protection: - Control Features: - Operating Temperature: - Package / Case: - Supplier Device Package: - Mounting Type: -	패키지: -	재고7,472
LS1048ASN7PTA	NXP	LS1048A 1400/1800 REV A Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,544
MCIMX6D4AVT10AE	NXP	I.MX6D ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	패키지: 624-FBGA, FCBGA	재고4,944
MC56F82643VLC	NXP	IC DSC 32-BIT 32-LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: SCI Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 64KB (32K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 6x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고5,040
SPC5604BK0CLQ4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고4,336
TJA1463ATK-S1Z	NXP	IC TRANSCEIVER HALF 1/1 14HVSON Type: Transceiver Protocol: CANbus Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 100 mV Data Rate: 8Mbps Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	패키지: -	Request a Quote
MIMXRT1176AVM8AR	NXP	IC MCU 32BIT EXT MEM 289MAPBGA Core Processor: ARM® Cortex®-M4, Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 400MHz, 800MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT Number of I/O: 13 Program Memory Size: - Program Memory Type: External Program Memory EEPROM Size: - RAM Size: 2M x 8 Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V Data Converters: A/D 20x12b SAR; D/A 1x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14x14)	패키지: -	Request a Quote
FC32K146HAT0MLLT	NXP	IC Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
MIMX8QM5AVUFFAB	NXP	MPU I.MX8 QUAD MAX Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고96
S32G234MABK0VUCR	NXP	S32G234M ARM CORTEX-M7, HSE, LLC Core Processor: ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 32/64-Bit Speed: 400MHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (4) SATA: - USB: - Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	패키지: -	Request a Quote

PZM20NB1,115

NXP

DIODE ZENER 20V 300MW SMT3

Voltage - Zener (Nom) (Vz): 20V
Tolerance: ±2%
Power - Max: 300mW
Impedance (Max) (Zzt): 20 Ohms
Current - Reverse Leakage @ Vr: 70nA @ 15V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고3,600

DC6M601X6/18S,135

NXP

IC REG BUCK 1.8V 0.65A 6WLCSP

Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Fixed
Number of Outputs: 1
Voltage - Input (Min): 2.3V
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.8V
Voltage - Output (Max): -
Current - Output: 650mA
Frequency - Switching: 6MHz
Synchronous Rectifier: Yes
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)

패키지: 6-XFBGA, WLCSP

재고4,016

SSTUA32866EC,518

NXP

IC BUFFER 1.8V 25BIT SOT536

Logic Type: 1:1, 1:2 Configurable Registered Buffer with Parity
Supply Voltage: 1.7 V ~ 2 V
Number of Bits: 25, 14
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Supplier Device Package: 96-LFBGA (13.5x5.5)

패키지: 96-LFBGA

재고2,320

N74F08D,602

NXP

IC GATE AND 4CH 2-INP 14-SO

Logic Type: AND Gate
Number of Circuits: 4
Number of Inputs: 2
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

패키지: 14-SOIC (0.154", 3.90mm Width)

재고2,592

TDA1519CJ/N3C,112

NXP

IC AMP AUDIO PWR 22W MONO B 9SIL

Type: Class B
Output Type: 1-Channel (Mono) or 2-Channel (Stereo)
Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm; 11W x 2 @ 2 Ohm
Voltage - Supply: 6 V ~ 17.5 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -25°C ~ 150°C (TJ)
Supplier Device Package: 9-SIL
Package / Case: 9-SIP

패키지: 9-SIP

재고5,136

MC33972EW

NXP

IC SWITCH DETECT SPI 32-SOIC

Applications: Switch Monitoring
Interface: SPI Serial
Voltage - Supply: 3.1 V ~ 5.25 V
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC
Mounting Type: Surface Mount

패키지: 32-SOIC (0.295", 7.50mm Width)

재고6,272

UJA1076ATW/3V3/1J

NXP

IC SBC CAN/LIN 3.3V HS 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

재고5,184

MC33CD1030AE

NXP

SWITCH DETECT INTERFACE, 33 CHAN

Applications: Switch Monitoring
Interface: SPI
Voltage - Supply: 4.5 V ~ 36 V
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)
Mounting Type: Surface Mount

패키지: 48-LQFP Exposed Pad

재고7,792

PCA9515AD,112

NXP

IC REDRIVER I2C 1CH 400KHZ 8SO

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 1
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 6pF
Voltage - Supply: 2.3 V ~ 3.6 V
Current - Supply: 800µA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고20,172

MPC8572LVTAULE

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

패키지: 1023-BFBGA, FCBGA

재고2,624

MCIMX6Q4AVT08AC

NXP

IC MPU I.MX6Q 852MHZ 624FCBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 4 Core, 32-Bit
Speed: 852MHZ
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

패키지: 624-FBGA, FCBGA

재고6,688

MC9328MXSVP10R2

NXP

IC MPU I.MXS 100MHZ 225MAPBGA

Core Processor: ARM920T
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 100MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: -
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 225-LFBGA
Supplier Device Package: 225-MAPBGA (13x13)

패키지: 225-LFBGA

재고4,480

MCF5216CVF66J

NXP

IC MCU 32BIT 512KB FLASH 256BGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 66MHz
Connectivity: CAN, EBI/EMI, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 142
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 256-LBGA
Supplier Device Package: 256-MAPBGA

패키지: 256-LBGA

재고5,360

MC9S12XA256CAL

NXP

IC MCU 16BIT 256KB FLASH 112LQFP

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: EBI/EMI, I2C, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고5,296

S9S12GN48F0CLH

NXP

IC MCU 16BIT 48KB FLASH 64LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고3,184

PCF85063TP/1Z

NXP

IC RTC CLK/CALENDAR I2C 8-SON

Type: Clock/Calendar
Features: Alarm, Leap Year, Square Wave Output
Memory Size: -
Time Format: HH:MM:SS (12/24 hr)
Date Format: YY-MM-DD-dd
Interface: I2C, 2-Wire Serial
Voltage - Supply: 0.9 V ~ 5.5 V
Voltage - Supply, Battery: -
Current - Timekeeping (Max): 0.6µA @ 3.3V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 8-WFDFN Exposed Pad
Supplier Device Package: 8-HWSON (2x3)

패키지: 8-WFDFN Exposed Pad

재고966,750

PCA2002TK/1,118

NXP

IC WATCH CIRCUIT 10HVSON

PLL: No
Main Purpose: Battery operated wrist watches
Input: Crystal
Output: -
Number of Circuits: 1
Ratio - Input:Output: 1:2
Differential - Input:Output: No/No
Frequency - Max: 32kHz
Voltage - Supply: 1.1 V ~ 3.6 V
Operating Temperature: -10°C ~ 60°C
Mounting Type: Surface Mount
Package / Case: 10-VFDFN Exposed Pad
Supplier Device Package: 10-HVSON (3x3)

패키지: 10-VFDFN Exposed Pad

재고2,768

MC33FS6523CAE

NXP

SYSTEM BASIS CHIP DCDC 2.2A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP Exposed Pad

재고6,132

TEA19031AOT/1J

NXP

SMART CHARGING PROTOCOL CONTR US

Output Isolation: -
Internal Switch(s): -
Voltage - Breakdown: -
Topology: -
Voltage - Start Up: -
Voltage - Supply (Vcc/Vdd): -
Duty Cycle: -
Frequency - Switching: -
Power (Watts): -
Fault Protection: -
Control Features: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -
Mounting Type: -

패키지: -

재고7,472

LS1048ASN7PTA

NXP

LS1048A 1400/1800 REV A

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,544

MCIMX6D4AVT10AE

NXP

I.MX6D ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

패키지: 624-FBGA, FCBGA

재고4,944

MC56F82643VLC

NXP

IC DSC 32-BIT 32-LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 100MHz
Connectivity: SCI
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 64KB (32K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 6x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고5,040

SPC5604BK0CLQ4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 123
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고4,336

TJA1463ATK-S1Z

NXP

IC TRANSCEIVER HALF 1/1 14HVSON

Type: Transceiver
Protocol: CANbus
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 100 mV
Data Rate: 8Mbps
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

패키지: -

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MIMXRT1176AVM8AR

NXP

IC MCU 32BIT EXT MEM 289MAPBGA

Core Processor: ARM® Cortex®-M4, Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 400MHz, 800MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, Temp Sensor, WDT
Number of I/O: 13
Program Memory Size: -
Program Memory Type: External Program Memory
EEPROM Size: -
RAM Size: 2M x 8
Voltage - Supply (Vcc/Vdd): 1.65V ~ 1.95V, 3V ~ 3.6V
Data Converters: A/D 20x12b SAR; D/A 1x12b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: Surface Mount
Package / Case: 289-LFBGA
Supplier Device Package: 289-LFBGA (14x14)

패키지: -

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FC32K146HAT0MLLT

NXP

IC

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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MIMX8QM5AVUFFAB

NXP

MPU I.MX8 QUAD MAX

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고96

S32G234MABK0VUCR

NXP

S32G234M ARM CORTEX-M7, HSE, LLC

Core Processor: ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 32/64-Bit
Speed: 400MHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (4)
SATA: -
USB: -
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

패키지: -

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