페이지 132 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BUK7C1R8-60EJ	NXP	MOSFET N-CH 60V 200A D2PAK-7 FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 60V Current - Continuous Drain (Id) @ 25°C: - Drive Voltage (Max Rds On, Min Rds On): - Vgs(th) (Max) @ Id: - Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: - Vgs (Max): - FET Feature: - Power Dissipation (Max): - Rds On (Max) @ Id, Vgs: - Operating Temperature: - Mounting Type: Surface Mount Supplier Device Package: D2PAK (7-Lead) Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	패키지: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB	재고2,224
PSMN3R7-25YLC,115	NXP	MOSFET N-CH 25V 97A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 97A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 1.95V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 21.6nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 1585pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 64W (Tc) Rds On (Max) @ Id, Vgs: 3.9 mOhm @ 20A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	패키지: SC-100, SOT-669	재고7,584
MC44BS373CAEF	NXP	AUDIO VIDEO INTERGRATION MOD Type: NTSC/PAL Modulator Applications: Audio/Video, VCR's, Set-Top Boxes Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.154", 3.90mm Width)	재고15,948
NX5P3201CUKZ	NXP	IC USB SWITCH HI SD 3A 30WLCSP Switch Type: USB Switch Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: Parallel Voltage - Load: 2.7 V ~ 5.5 V, 3.4 V ~ 5.5 V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3A, 6A Rds On (Typ): 8 mOhm, 32 mOhm Input Type: Non-Inverting Features: Slew Rate Controlled, Status Flag Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 30-UFBGA, WLCSP Supplier Device Package: 30-WLCSP (2.26x2.56)	패키지: 30-UFBGA, WLCSP	재고2,128
MC33931VWR2	NXP	IC MOTOR DRIVER PAR 44HSOP Motor Type - Stepper: - Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Step Resolution: - Applications: Automotive Current - Output: 5A Voltage - Supply: 5 V ~ 28 V Voltage - Load: 5 V ~ 28 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 44-HSOP	패키지: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad	재고4,464
GTL2008PW,118	NXP	IC TRANSLATOR GTL-LVTTL 28-TSSOP Translator Type: Mixed Signal Channel Type: Unidirectional Number of Circuits: 1 Channels per Circuit: 12 Voltage - VCCA: - Voltage - VCCB: - Input Signal: GTL, LVTTL Output Signal: LVTTL, GTL Output Type: Open Drain, Tri-State Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: - Mounting Type: Surface Mount Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	패키지: 28-TSSOP (0.173", 4.40mm Width)	재고5,328
74HC7030D,653	NXP	IC FIFO REGISTER 9X64 28SOIC Memory Size: 576 (64 x 9) Function: Asynchronous, Synchronous Data Rate: 33MHz Access Time: 36ns Voltage - Supply: 2 V ~ 6 V Current - Supply (Max): - Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SO	패키지: 28-SOIC (0.295", 7.50mm Width)	재고2,416
TDA9881TS/V2,518	NXP	IC IF-PLL DEMOD 24-SSOP Type: Demodulator Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	패키지: 24-SSOP (0.209", 5.30mm Width)	재고6,176
PCA9501PW,112	NXP	IC I/O EXPANDER I2C 8B 20TSSOP Number of I/O: 8 Interface: I2C, SMBus Interrupt Output: Yes Features: EEPROM, POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고6,240
PCA9535D,118	NXP	IC I/O EXPANDER I2C 16B 24SOIC Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-SOIC (0.295", 7.50mm Width) Supplier Device Package: 24-SO	패키지: 24-SOIC (0.295", 7.50mm Width)	재고2,656
TJA1041T/N1,118	NXP	IC TXRX CAN 14BIT 27V 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 70mV Data Rate: - Voltage - Supply: 4.75 V ~ 5.25 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	패키지: 14-SOIC (0.154", 3.90mm Width)	재고4,928
MPC8360ZUADDH	NXP	IC MPU MPC83XX 266MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	패키지: 740-LBGA	재고6,544
MPC8358VVAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	패키지: 740-LBGA	재고5,040
XPC850CVR50BU	NXP	IC MPU MPC8XX 50MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	패키지: 256-BBGA	재고4,896
MC9S08SH4CTGR	NXP	IC MCU 8BIT 4KB FLASH 16TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고85,152
MC56F8036VLF	NXP	IC MCU 16BIT 64KB FLASH 48LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 32MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 39 Program Memory Size: 64KB (32K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D 10x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고24,096
LPC1114FHN33/302:5	NXP	IC MCU 32BIT 32KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	패키지: 32-VQFN Exposed Pad	재고19,680
MPL115A1T1	NXP	IC BAROMETER SPI DGTL MINI 8-LGA Pressure Type: Absolute Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa) Output Type: SPI Output: 10 b Accuracy: ±0.145 PSI (±1 kPa) Voltage - Supply: 2.375 V ~ 5.5 V Port Size: - Port Style: No Port Features: Shutdown Mode, Standby Mode Termination Style: PCB Maximum Pressure: 145.04 PSI (1000 kPa) Operating Temperature: -40°C ~ 105°C Package / Case: 8-TLGA Supplier Device Package: 8-LGA	패키지: 8-TLGA	재고36,858
MMA2612NKWR2	NXP	ACCELEROMETER 125G PCM 16QFN Type: Digital Axis: X Acceleration Range: ±125g Sensitivity (LSB/g): 4.096 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM Voltage - Supply: 6.3 V ~ 30 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	패키지: 16-QFN Exposed Pad	재고7,956
MMA20312BVT1	NXP	IC AMP HBT INGAP/GAAS 12QFN Frequency: 1.8GHz ~ 2.2GHz P1dB: 28.2dBm Gain: 27.2dB Noise Figure: 3.3dB RF Type: LTE, PCS, TD-SCDMA, UMTS Voltage - Supply: 5V Current - Supply: 70mA Test Frequency: 2.14GHz Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	패키지: 12-VFQFN Exposed Pad	재고5,868
MWCT1013VLH	NXP	32BIT256K FLASHIFR PGM Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고9,012
SAF3560HV/V1101,55	NXP	DIGITAL RADIO PROCESSOR 144HLQFP Applications: Automotive Interface: I²C, SPI, UART Voltage - Supply: 1.2V, 3.3V Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-HLQFP (20x20) Mounting Type: Surface Mount	패키지: 144-LQFP Exposed Pad	재고5,040
SPC5606BK0MLL6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고5,072
SPC5643LFK0MLQ1R	NXP	NXP 32-BIT MCU DUAL POWER ARCH Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 120MHz Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 32x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고5,568
S912XET256BCALR	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고5,760
S9S08DN48F2MLH	NXP	8-BIT MCU S08 CORE 48KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 1.5K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고3,696
MIMX8MM2CVTKZAA	NXP	IC MPU I.MX 8M MINI SOLO BGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.6GHz Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3L, DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: MIPI-DSI Ethernet: GbE SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS Package / Case: 486-LFBGA, FCBGA Supplier Device Package: 486-FCBGA (14x14)	패키지: 486-LFBGA, FCBGA	재고4,624
SAF7770EL-200Z10AY	NXP	SAF7770EL Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 364-LFBGA Supplier Device Package: 364-LFBGA (15x15)	패키지: -	Request a Quote

BUK7C1R8-60EJ

NXP

MOSFET N-CH 60V 200A D2PAK-7

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: -
Drive Voltage (Max Rds On, Min Rds On): -
Vgs(th) (Max) @ Id: -
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: -
Vgs (Max): -
FET Feature: -
Power Dissipation (Max): -
Rds On (Max) @ Id, Vgs: -
Operating Temperature: -
Mounting Type: Surface Mount
Supplier Device Package: D2PAK (7-Lead)
Package / Case: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

패키지: TO-263-7, D2Pak (6 Leads + Tab), TO-263CB

재고2,224

PSMN3R7-25YLC,115

NXP

MOSFET N-CH 25V 97A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 21.6nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 1585pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 64W (Tc)
Rds On (Max) @ Id, Vgs: 3.9 mOhm @ 20A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

패키지: SC-100, SOT-669

재고7,584

MC44BS373CAEF

NXP

AUDIO VIDEO INTERGRATION MOD

Type: NTSC/PAL Modulator
Applications: Audio/Video, VCR's, Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.154", 3.90mm Width)

재고15,948

NX5P3201CUKZ

NXP

IC USB SWITCH HI SD 3A 30WLCSP

Switch Type: USB Switch
Number of Outputs: 2
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: Parallel
Voltage - Load: 2.7 V ~ 5.5 V, 3.4 V ~ 5.5 V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A, 6A
Rds On (Typ): 8 mOhm, 32 mOhm
Input Type: Non-Inverting
Features: Slew Rate Controlled, Status Flag
Fault Protection: Over Temperature, Over Voltage, Reverse Current, UVLO
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 30-UFBGA, WLCSP
Supplier Device Package: 30-WLCSP (2.26x2.56)

패키지: 30-UFBGA, WLCSP

재고2,128

MC33931VWR2

NXP

IC MOTOR DRIVER PAR 44HSOP

Motor Type - Stepper: -
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (2)
Interface: Parallel
Technology: CMOS
Step Resolution: -
Applications: Automotive
Current - Output: 5A
Voltage - Supply: 5 V ~ 28 V
Voltage - Load: 5 V ~ 28 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 44-HSOP

패키지: 44-BSSOP (0.433", 11.00mm Width) Exposed Pad

재고4,464

GTL2008PW,118

NXP

IC TRANSLATOR GTL-LVTTL 28-TSSOP

Translator Type: Mixed Signal
Channel Type: Unidirectional
Number of Circuits: 1
Channels per Circuit: 12
Voltage - VCCA: -
Voltage - VCCB: -
Input Signal: GTL, LVTTL
Output Signal: LVTTL, GTL
Output Type: Open Drain, Tri-State
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: -
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

패키지: 28-TSSOP (0.173", 4.40mm Width)

재고5,328

74HC7030D,653

NXP

IC FIFO REGISTER 9X64 28SOIC

Memory Size: 576 (64 x 9)
Function: Asynchronous, Synchronous
Data Rate: 33MHz
Access Time: 36ns
Voltage - Supply: 2 V ~ 6 V
Current - Supply (Max): -
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SO

패키지: 28-SOIC (0.295", 7.50mm Width)

재고2,416

TDA9881TS/V2,518

NXP

IC IF-PLL DEMOD 24-SSOP

Type: Demodulator
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

패키지: 24-SSOP (0.209", 5.30mm Width)

재고6,176

PCA9501PW,112

NXP

IC I/O EXPANDER I2C 8B 20TSSOP

Number of I/O: 8
Interface: I2C, SMBus
Interrupt Output: Yes
Features: EEPROM, POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.5 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고6,240

PCA9535D,118

NXP

IC I/O EXPANDER I2C 16B 24SOIC

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 24-SO

패키지: 24-SOIC (0.295", 7.50mm Width)

재고2,656

TJA1041T/N1,118

NXP

IC TXRX CAN 14BIT 27V 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 70mV
Data Rate: -
Voltage - Supply: 4.75 V ~ 5.25 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

패키지: 14-SOIC (0.154", 3.90mm Width)

재고4,928

MPC8360ZUADDH

NXP

IC MPU MPC83XX 266MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

패키지: 740-LBGA

재고6,544

MPC8358VVAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

패키지: 740-LBGA

재고5,040

XPC850CVR50BU

NXP

IC MPU MPC8XX 50MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

패키지: 256-BBGA

재고4,896

MC9S08SH4CTGR

NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 13
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고85,152

MC56F8036VLF

NXP

IC MCU 16BIT 64KB FLASH 48LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 64KB (32K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 16
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D 10x12b; D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고24,096

LPC1114FHN33/302:5

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VQFN Exposed Pad
Supplier Device Package: 32-HVQFN (7x7)

패키지: 32-VQFN Exposed Pad

재고19,680

MPL115A1T1

NXP

IC BAROMETER SPI DGTL MINI 8-LGA

Pressure Type: Absolute
Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
Output Type: SPI
Output: 10 b
Accuracy: ±0.145 PSI (±1 kPa)
Voltage - Supply: 2.375 V ~ 5.5 V
Port Size: -
Port Style: No Port
Features: Shutdown Mode, Standby Mode
Termination Style: PCB
Maximum Pressure: 145.04 PSI (1000 kPa)
Operating Temperature: -40°C ~ 105°C
Package / Case: 8-TLGA
Supplier Device Package: 8-LGA

패키지: 8-TLGA

재고36,858

MMA2612NKWR2

NXP

ACCELEROMETER 125G PCM 16QFN

Type: Digital
Axis: X
Acceleration Range: ±125g
Sensitivity (LSB/g): 4.096
Sensitivity (mV/g): -
Bandwidth: -
Output Type: PCM
Voltage - Supply: 6.3 V ~ 30 V
Features: Selectable Low Pass Filter
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN-EP (6x6)

패키지: 16-QFN Exposed Pad

재고7,956

MMA20312BVT1

NXP

IC AMP HBT INGAP/GAAS 12QFN

Frequency: 1.8GHz ~ 2.2GHz
P1dB: 28.2dBm
Gain: 27.2dB
Noise Figure: 3.3dB
RF Type: LTE, PCS, TD-SCDMA, UMTS
Voltage - Supply: 5V
Current - Supply: 70mA
Test Frequency: 2.14GHz
Package / Case: 12-VFQFN Exposed Pad
Supplier Device Package: 12-QFN (3x3)

패키지: 12-VFQFN Exposed Pad

재고5,868

MWCT1013VLH

NXP

32BIT256K FLASHIFR PGM

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고9,012

SAF3560HV/V1101,55

NXP

DIGITAL RADIO PROCESSOR 144HLQFP

Applications: Automotive
Interface: I²C, SPI, UART
Voltage - Supply: 1.2V, 3.3V
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-HLQFP (20x20)
Mounting Type: Surface Mount

패키지: 144-LQFP Exposed Pad

재고5,040

SPC5606BK0MLL6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 77
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 7x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고5,072

SPC5643LFK0MLQ1R

NXP

NXP 32-BIT MCU DUAL POWER ARCH

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 120MHz
Connectivity: CANbus, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 32x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고5,568

S912XET256BCALR

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고5,760

S9S08DN48F2MLH

NXP

8-BIT MCU S08 CORE 48KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 53
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고3,696

MIMX8MM2CVTKZAA

NXP

IC MPU I.MX 8M MINI SOLO BGA

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.6GHz
Co-Processors/DSP: ARM® Cortex®-M4
RAM Controllers: DDR3L, DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: MIPI-DSI
Ethernet: GbE
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: ARM TZ, CAAM, HAB, OCRAM, RDC, SJC, SNVS
Package / Case: 486-LFBGA, FCBGA
Supplier Device Package: 486-FCBGA (14x14)

패키지: 486-LFBGA, FCBGA

재고4,624

SAF7770EL-200Z10AY

NXP

SAF7770EL

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 364-LFBGA
Supplier Device Package: 364-LFBGA (15x15)

패키지: -

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