페이지 15 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BC557C,112	NXP	TRANS PNP 45V 0.1A TO-92 Transistor Type: PNP Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA Current - Collector Cutoff (Max): 15nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V Power - Max: 500mW Frequency - Transition: 100MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA)	재고4,192
BB202,115	NXP	DIODE VAR CAP 6V SOD-523 Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz Capacitance Ratio: 2.5 Capacitance Ratio Condition: C0.2/C2.3 Voltage - Peak Reverse (Max): 6V Diode Type: Single Q @ Vr, F: - Operating Temperature: -55°C ~ 85°C (TJ) Mounting Type: Surface Mount Package / Case: SC-79, SOD-523 Supplier Device Package: SOD-523	패키지: SC-79, SOD-523	재고22,788
MC33909N5ADR2	NXP	SBC SG 1 CAN 0 LIN HLQFP48 Applications: System Basis Chip Current - Supply: 7mA Voltage - Supply: 3.5 V ~ 28 V Operating Temperature: -40°C ~ 125°C Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고7,280
MC44BC375UAEFR2	NXP	IC A-VHF MODULATOR 16-SOIC Type: Modulator Applications: Set-Top Boxes Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.154", 3.90mm Width)	재고78,000
M86262G12	NXP	IC C2K 650MHZ 8CH VOIP 625BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고5,376
MC8640VU1000HE	NXP	IC MPU MPC86XX 1.0GHZ 994FCCBGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	패키지: 994-BCBGA, FCCBGA	재고6,752
MPC8264AZUPIBB	NXP	IC MPU MPC82XX 300MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 300MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	패키지: 480-LBGA	재고5,696
MPC8536CVJAQGA	NXP	IC MPU MPC85XX 1.0GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고4,096
P80C552EFB/08,557	NXP	IC MCU 8BIT ROMLESS 80QFP Core Processor: 8051 Core Size: 8-Bit Speed: 16MHz Connectivity: EBI/EMI, I2C, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 40 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14x20)	패키지: 80-BQFP	재고7,424
LPC2106FHN48/01,55	NXP	IC MCU 32BIT 128KB FLASH 48HVQFN Core Processor: ARM7? Core Size: 16/32-Bit Speed: 60MHz Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 32 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-HVQFN (7x7)	패키지: 48-VFQFN Exposed Pad	재고6,496
MC9S08PT16AVLC	NXP	IC MCU 8BIT 16KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 28 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고6,912
MKL27Z256VFM4	NXP	IC MCU 32BIT 256KB FLASH 32QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART, USB Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 16x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-UFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	패키지: 32-UFQFN Exposed Pad	재고8,556
ADC0801S040TS/C1:1	NXP	IC ADC 8BIT PAR 40MHZ 20-SSOP Number of Bits: 8 Sampling Rate (Per Second): 10k Number of Inputs: 1 Input Type: Differential Data Interface: Parallel Configuration: ADC Ratio - S/H:ADC: - Number of A/D Converters: 1 Architecture: SAR Reference Type: External, Supply Voltage - Supply, Analog: 4.5 V ~ 6.3 V Voltage - Supply, Digital: 4.5 V ~ 6.3 V Features: - Operating Temperature: -40°C ~ 85°C Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP Mounting Type: -	패키지: 20-LSSOP (0.173", 4.40mm Width)	재고5,040
UDA1330ATS/N2,112	NXP	IC AUDIO DAC STEREO 16-SSOP Type: DAC, Audio Number of Channels: - Resolution (Bits): 20 b Sampling Rate (Per Second): 55k Data Interface: I2S Voltage Supply Source: Analog and Digital Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-SSOP	패키지: 16-LSSOP (0.173", 4.40mm Width)	재고6,976
MPXV7025GC6T1	NXP	SENSOR PRESSURE AXIAL PORT 8-SMD Pressure Type: Compound Operating Pressure: ±3.63 PSI (±25 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.18mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: ±29.01 PSI (±200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD, Gull Wing, Top Port Supplier Device Package: -	패키지: 8-SMD, Gull Wing, Top Port	재고7,182
MPXV5100GC7U	NXP	PRESSURE SENSOR SILICON 8-DIP Pressure Type: Vented Gauge Operating Pressure: 14.5 PSI (100 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±2.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.13" (3.17mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-DIP (0.550", 13.97mm), Top Port Supplier Device Package: 8-DIP	패키지: 8-DIP (0.550", 13.97mm), Top Port	재고7,704
TEF6901AH/V3,518	NXP	IC INTEGRATED CAR RADIO 64-QFP Frequency: - Sensitivity: - Data Rate (Max): - Modulation or Protocol: AM, FM, WB Applications: AM/FM Radio Receiver Current - Receiving: 102mA Data Interface: PCB, Surface Mount Memory Size: - Antenna Connector: PCB, Surface Mount Features: - Voltage - Supply: 8 V ~ 9 V Operating Temperature: -40°C ~ 85°C Package / Case: 64-BQFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-BQFP	재고3,186
SA601DK,112	NXP	IC MIXER LNA 1GHZ 20SSOP RF Type: - Frequency: 1GHz Number of Mixers: 1 Gain: 11.5dB Noise Figure: 1.6dB Secondary Attributes: - Current - Supply: 7.4mA Voltage - Supply: 2.7 V ~ 5.5 V Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	패키지: 20-LSSOP (0.173", 4.40mm Width)	재고7,002
LS1088ASE7Q1A	NXP	LS1088A 1600/2100 WE RVA Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고5,952
FS32K144UFT0CLLT	NXP	S32K144 32-BIT MCU, ARM Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고5,296
SPC5742PFK1AMLQ9	NXP	1.5MB NVM 2 X E200Z4 CORES 200 Core Processor: e200z4 Core Size: 32-Bit Dual-Core Speed: 200MHz Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART Peripherals: DMA, LVD, POR, WDT Number of I/O: - Program Memory Size: 1.5MB (1.5M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192K x 8 Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V Data Converters: A/D 64x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고3,552
S912XEQ384BMAL	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고5,904
MKS22FN128VLL12	NXP	KINETIS S 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT Number of I/O: 66 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 1x16b. D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고6,688
MC56F83763VLHR	NXP	IC Type: DSP Interface: CANbus, SCI, SPI Clock Rate: 100MHz Non-Volatile Memory: FLASH (128kB) On-Chip RAM: 48kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote
LPC55S28JBD64K	NXP	IC MCU 32BIT 512KB FLASH 64HTQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 36 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-TQFP Exposed Pad Supplier Device Package: 64-HTQFP (10x10)	패키지: -	재고5,031
PCA9420BSAZ	NXP	PCA9420BS Applications: - Current - Supply: 4.5µA Voltage - Supply: 3.3V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-HVQFN (3x3)	패키지: -	재고6,744
FG32K144HFT0MLLT	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
CLF1G0035-100P	NXP	RF MOSFET HEMT 50V LDMOST Transistor Type: HEMT Frequency: 3.5GHz Gain: 12.5dB Voltage - Test: 50 V Current Rating: - Noise Figure: - Current - Test: 330 mA Power - Output: 100W Voltage - Rated: 150 V Package / Case: SOT-1228A Supplier Device Package: LDMOST	패키지: -	Request a Quote

BC557C,112

NXP

TRANS PNP 45V 0.1A TO-92

Transistor Type: PNP
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Power - Max: 500mW
Frequency - Transition: 100MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA)

재고4,192

BB202,115

NXP

DIODE VAR CAP 6V SOD-523

Capacitance @ Vr, F: 11.2pF @ 2.3V, 1MHz
Capacitance Ratio: 2.5
Capacitance Ratio Condition: C0.2/C2.3
Voltage - Peak Reverse (Max): 6V
Diode Type: Single
Q @ Vr, F: -
Operating Temperature: -55°C ~ 85°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Supplier Device Package: SOD-523

패키지: SC-79, SOD-523

재고22,788

MC33909N5ADR2

NXP

SBC SG 1 CAN 0 LIN HLQFP48

Applications: System Basis Chip
Current - Supply: 7mA
Voltage - Supply: 3.5 V ~ 28 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고7,280

MC44BC375UAEFR2

NXP

IC A-VHF MODULATOR 16-SOIC

Type: Modulator
Applications: Set-Top Boxes
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.154", 3.90mm Width)

재고78,000

M86262G12

NXP

IC C2K 650MHZ 8CH VOIP 625BGA

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,376

MC8640VU1000HE

NXP

IC MPU MPC86XX 1.0GHZ 994FCCBGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

패키지: 994-BCBGA, FCCBGA

재고6,752

MPC8264AZUPIBB

NXP

IC MPU MPC82XX 300MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 300MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

재고5,696

MPC8536CVJAQGA

NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고4,096

P80C552EFB/08,557

NXP

IC MCU 8BIT ROMLESS 80QFP

Core Processor: 8051
Core Size: 8-Bit
Speed: 16MHz
Connectivity: EBI/EMI, I2C, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 40
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-BQFP
Supplier Device Package: 80-PQFP (14x20)

패키지: 80-BQFP

재고7,424

LPC2106FHN48/01,55

NXP

IC MCU 32BIT 128KB FLASH 48HVQFN

Core Processor: ARM7?
Core Size: 16/32-Bit
Speed: 60MHz
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 32
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.65 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-HVQFN (7x7)

패키지: 48-VFQFN Exposed Pad

재고6,496

MC9S08PT16AVLC

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 28
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고6,912

MKL27Z256VFM4

NXP

IC MCU 32BIT 256KB FLASH 32QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 16x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-UFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

패키지: 32-UFQFN Exposed Pad

재고8,556

ADC0801S040TS/C1:1

NXP

IC ADC 8BIT PAR 40MHZ 20-SSOP

Number of Bits: 8
Sampling Rate (Per Second): 10k
Number of Inputs: 1
Input Type: Differential
Data Interface: Parallel
Configuration: ADC
Ratio - S/H:ADC: -
Number of A/D Converters: 1
Architecture: SAR
Reference Type: External, Supply
Voltage - Supply, Analog: 4.5 V ~ 6.3 V
Voltage - Supply, Digital: 4.5 V ~ 6.3 V
Features: -
Operating Temperature: -40°C ~ 85°C
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-SSOP
Mounting Type: -

패키지: 20-LSSOP (0.173", 4.40mm Width)

재고5,040

UDA1330ATS/N2,112

NXP

IC AUDIO DAC STEREO 16-SSOP

Type: DAC, Audio
Number of Channels: -
Resolution (Bits): 20 b
Sampling Rate (Per Second): 55k
Data Interface: I2S
Voltage Supply Source: Analog and Digital
Voltage - Supply: 2.7 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-SSOP

패키지: 16-LSSOP (0.173", 4.40mm Width)

재고6,976

MPXV7025GC6T1

NXP

SENSOR PRESSURE AXIAL PORT 8-SMD

Pressure Type: Compound
Operating Pressure: ±3.63 PSI (±25 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.13" (3.18mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: ±29.01 PSI (±200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD, Gull Wing, Top Port
Supplier Device Package: -

패키지: 8-SMD, Gull Wing, Top Port

재고7,182

MPXV5100GC7U

NXP

PRESSURE SENSOR SILICON 8-DIP

Pressure Type: Vented Gauge
Operating Pressure: 14.5 PSI (100 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±2.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.13" (3.17mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-DIP (0.550", 13.97mm), Top Port
Supplier Device Package: 8-DIP

패키지: 8-DIP (0.550", 13.97mm), Top Port

재고7,704

TEF6901AH/V3,518

NXP

IC INTEGRATED CAR RADIO 64-QFP

Frequency: -
Sensitivity: -
Data Rate (Max): -
Modulation or Protocol: AM, FM, WB
Applications: AM/FM Radio Receiver
Current - Receiving: 102mA
Data Interface: PCB, Surface Mount
Memory Size: -
Antenna Connector: PCB, Surface Mount
Features: -
Voltage - Supply: 8 V ~ 9 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 64-BQFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-BQFP

재고3,186

SA601DK,112

NXP

IC MIXER LNA 1GHZ 20SSOP

RF Type: -
Frequency: 1GHz
Number of Mixers: 1
Gain: 11.5dB
Noise Figure: 1.6dB
Secondary Attributes: -
Current - Supply: 7.4mA
Voltage - Supply: 2.7 V ~ 5.5 V
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-SSOP

패키지: 20-LSSOP (0.173", 4.40mm Width)

재고7,002

LS1088ASE7Q1A

NXP

LS1088A 1600/2100 WE RVA

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고5,952

FS32K144UFT0CLLT

NXP

S32K144 32-BIT MCU, ARM

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고5,296

SPC5742PFK1AMLQ9

NXP

1.5MB NVM 2 X E200Z4 CORES 200

Core Processor: e200z4
Core Size: 32-Bit Dual-Core
Speed: 200MHz
Connectivity: CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, WDT
Number of I/O: -
Program Memory Size: 1.5MB (1.5M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192K x 8
Voltage - Supply (Vcc/Vdd): 3.15 V ~ 5.5 V
Data Converters: A/D 64x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고3,552

S912XEQ384BMAL

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고5,904

MKS22FN128VLL12

NXP

KINETIS S 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/O: 66
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 1x16b. D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고6,688

MC56F83763VLHR

NXP

IC

Type: DSP
Interface: CANbus, SCI, SPI
Clock Rate: 100MHz
Non-Volatile Memory: FLASH (128kB)
On-Chip RAM: 48kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: -

Request a Quote

LPC55S28JBD64K

NXP

IC MCU 32BIT 512KB FLASH 64HTQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 36
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-TQFP Exposed Pad
Supplier Device Package: 64-HTQFP (10x10)

패키지: -

재고5,031

PCA9420BSAZ

NXP

PCA9420BS

Applications: -
Current - Supply: 4.5µA
Voltage - Supply: 3.3V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-HVQFN (3x3)

패키지: -

재고6,744

FG32K144HFT0MLLT

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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CLF1G0035-100P

NXP

RF MOSFET HEMT 50V LDMOST

Transistor Type: HEMT
Frequency: 3.5GHz
Gain: 12.5dB
Voltage - Test: 50 V
Current Rating: -
Noise Figure: -
Current - Test: 330 mA
Power - Output: 100W
Voltage - Rated: 150 V
Package / Case: SOT-1228A
Supplier Device Package: LDMOST

패키지: -

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