페이지 151 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF19030LSR3	NXP	FET RF 65V 1.96GHZ NI-400S Transistor Type: LDMOS Frequency: 1.96GHz Gain: 13dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 300mA Power - Output: 30W Voltage - Rated: 65V Package / Case: NI-400S Supplier Device Package: NI-400S	패키지: NI-400S	재고22,848
MMRF1304GNR1	NXP	FET RF 133V 512MHZ TO270-2 Transistor Type: LDMOS Frequency: 512MHz Gain: 25.4dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 10mA Power - Output: 25W Voltage - Rated: 133V Package / Case: TO-270BA Supplier Device Package: TO-270G-2	패키지: TO-270BA	재고3,248
BZX84-C3V0/LF1VL	NXP	DIODE ZENER TO-236AB SOT23 Voltage - Zener (Nom) (Vz): 3V Tolerance: ±5% Power - Max: 250mW Impedance (Max) (Zzt): 95 Ohms Current - Reverse Leakage @ Vr: 10µA @ 1V Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고2,848
BZX284-C43,115	NXP	DIODE ZENER 43V 400MW SOD2 Voltage - Zener (Nom) (Vz): 43V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 80 Ohms Current - Reverse Leakage @ Vr: 50nA @ 30.1V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	패키지: SOD-110	재고4,960
TDA3681ATH/N1C,518	NXP	IC VOLT REG W/SW & IGNIT 20-HSOP Applications: Ignition Buffer, Regulator Current - Supply: 110µA Voltage - Supply: 9.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	패키지: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	재고6,176
PCF8562TT/S400/2,1	NXP	IC LCD DRIVER 48-TSSOP Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C, 2-Wire Serial Digits or Characters: 8 Characters, 16 Characters Current - Supply: 8µA Voltage - Supply: 1.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	패키지: 48-TFSOP (0.240", 6.10mm Width)	재고6,976
74HCT40105D,112	NXP	IC 4X16 FIFO REGISTER 16-SOIC Memory Size: 64 (16 x 4) Function: Asynchronous Data Rate: 28MHz Access Time: 40ns Voltage - Supply: 4.5 V ~ 5.5 V Current - Supply (Max): - Bus Directional: Uni-Directional Expansion Type: Depth, Width Programmable Flags Support: No Retransmit Capability: No FWFT Support: No Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고5,952
74LV367DB,118	NXP	IC BUFF DVR TRI-ST HEX 16SSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 2, 4 (Hex) Input Type: - Output Type: Push-Pull Current - Output High, Low: 8mA, 8mA Voltage - Supply: 1 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Supplier Device Package: 16-SSOP	패키지: 16-SSOP (0.209", 5.30mm Width)	재고6,256
TJA1042T/1J	NXP	IC TRANSCEIVER CAN HS 8SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: Half Receiver Hysteresis: 120mV Data Rate: 5Mbps Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고124,860
NX3DV2567HR-Q100X	NXP	IC ANLG SWITCH 4PDT 16HXQFN Applications: Networking Multiplexer/Demultiplexer Circuit: - Switch Circuit: 4PDT Number of Channels: 1 On-State Resistance (Max): 700 mOhm Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V Voltage - Supply, Dual (V±): - -3db Bandwidth: 160MHz Features: - Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 16-XFQFN Exposed Pad Supplier Device Package: 16-HXQFN (3x3)	패키지: 16-XFQFN Exposed Pad	재고17,994
MC68HC000IEI16R	NXP	IC MPU M680X0 16MHZ 68PLCC Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 16MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 68-LCC (J-Lead) Supplier Device Package: 68-PLCC (25x25)	패키지: 68-LCC (J-Lead)	재고5,728
MC68EN360RC33L	NXP	IC MPU M683XX 33MHZ 241PGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 241-BEPGA Supplier Device Package: 241-PGA (47.24x47.24)	패키지: 241-BEPGA	재고7,040
MC68360CVR25L	NXP	IC MPU M683XX 25MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고78,384
MC9328MXLVM15R2	NXP	IC MPU I.MXL 150MHZ 256MAPBGA Core Processor: ARM920T Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 150MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: - SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 256-LFBGA Supplier Device Package: -	패키지: 256-LFBGA	재고5,856
MC68711E20MFNE3	NXP	IC MCU 8BIT 20KB OTP 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	패키지: 52-LCC (J-Lead)	재고3,728
MC9S12GC96MFUE	NXP	IC MCU 16BIT 96KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고5,808
MC100ES6226AC	NXP	IC CLK BUFFER 1:9 3GHZ 32LQFP Type: Fanout Buffer (Distribution), Divider Number of Circuits: 1 Ratio - Input:Output: 1:9 Differential - Input:Output: Yes/Yes Input: LVPECL Output: LVCMOS, LVPECL Frequency - Max: 3GHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: 0°C ~ 110°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고5,168
MPXV2053DP	NXP	SENSOR PRESSURE DIFF DUAL 8-SOP Pressure Type: Differential Operating Pressure: 7.25 PSI (50 kPa) Output Type: Wheatstone Bridge Output: 0 mV ~ 40 mV (10V) Accuracy: -0.6% ~ 0.4% Voltage - Supply: 10 V ~ 16 V Port Size: Male - 0.13" (3.3mm) Tube, Dual Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 29.01 PSI (200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SMD Module Supplier Device Package: -	패키지: 8-SMD Module	재고8,412
MC33493DTBE	NXP	IC RF TRANSMITTER UHF 14-TSSOP Frequency: 315 ~ 434MHz, 868 ~ 928MHz Applications: General Data Transfer Modulation or Protocol: FSK, OOK Data Rate (Max): 10 kbps Power - Output: -3dBm Current - Transmitting: 11.6mA Data Interface: PCB, Surface Mount Antenna Connector: PCB, Surface Mount Memory Size: - Features: - Voltage - Supply: 1.9 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C Package / Case: 14-TSSOP (0.173", 4.40mm Width)	패키지: 14-TSSOP (0.173", 4.40mm Width)	재고2,448
JN516X-EK001Z	NXP	EVAL KIT JN516X Type: - Frequency: - For Use With/Related Products: - Supplied Contents: -	패키지: -	재고3,436
MC33FS6512CAER2	NXP	SYSTEM BASIS CHIP DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP Exposed Pad	재고7,568
S912XDP512J1MALR	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 80MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b, 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고5,024
SPC5603BK0VLL4	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고5,856
S9S12XS256J0VAAR	NXP	16-BIT MCU S12X CORE 256KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 40MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 59 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 8x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고2,656
MK02FN64VFM10R	NXP	KINETIS K 32-BIT MCU ARM CORTEX Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: I²C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM Number of I/O: 26 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 12x16b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고2,480
MC33PF8100EQESR2	NXP	POWER MANAGEMENT IC I.MX8 PRE-PR Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: - Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	패키지: -	Request a Quote
SPC5606BAMLQ6R	NXP	NXP 32-BIT MCU, POWER ARCH CORE Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
S32G274AABK0VUCR	NXP	S32G274A ARM CORTEX-M7 AND -A53, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: GbE (4) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	패키지: -	Request a Quote

MRF19030LSR3

NXP

FET RF 65V 1.96GHZ NI-400S

Transistor Type: LDMOS
Frequency: 1.96GHz
Gain: 13dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 300mA
Power - Output: 30W
Voltage - Rated: 65V
Package / Case: NI-400S
Supplier Device Package: NI-400S

패키지: NI-400S

재고22,848

MMRF1304GNR1

NXP

FET RF 133V 512MHZ TO270-2

Transistor Type: LDMOS
Frequency: 512MHz
Gain: 25.4dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 10mA
Power - Output: 25W
Voltage - Rated: 133V
Package / Case: TO-270BA
Supplier Device Package: TO-270G-2

패키지: TO-270BA

재고3,248

BZX84-C3V0/LF1VL

NXP

DIODE ZENER TO-236AB SOT23

Voltage - Zener (Nom) (Vz): 3V
Tolerance: ±5%
Power - Max: 250mW
Impedance (Max) (Zzt): 95 Ohms
Current - Reverse Leakage @ Vr: 10µA @ 1V
Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고2,848

BZX284-C43,115

NXP

DIODE ZENER 43V 400MW SOD2

Voltage - Zener (Nom) (Vz): 43V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 80 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 30.1V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

패키지: SOD-110

재고4,960

TDA3681ATH/N1C,518

NXP

IC VOLT REG W/SW & IGNIT 20-HSOP

Applications: Ignition Buffer, Regulator
Current - Supply: 110µA
Voltage - Supply: 9.5 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 20-HSOP

패키지: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

재고6,176

PCF8562TT/S400/2,1

NXP

IC LCD DRIVER 48-TSSOP

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C, 2-Wire Serial
Digits or Characters: 8 Characters, 16 Characters
Current - Supply: 8µA
Voltage - Supply: 1.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

패키지: 48-TFSOP (0.240", 6.10mm Width)

재고6,976

74HCT40105D,112

NXP

IC 4X16 FIFO REGISTER 16-SOIC

Memory Size: 64 (16 x 4)
Function: Asynchronous
Data Rate: 28MHz
Access Time: 40ns
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Supply (Max): -
Bus Directional: Uni-Directional
Expansion Type: Depth, Width
Programmable Flags Support: No
Retransmit Capability: No
FWFT Support: No
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고5,952

74LV367DB,118

NXP

IC BUFF DVR TRI-ST HEX 16SSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 2, 4 (Hex)
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 8mA, 8mA
Voltage - Supply: 1 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 16-SSOP

패키지: 16-SSOP (0.209", 5.30mm Width)

재고6,256

TJA1042T/1J

NXP

IC TRANSCEIVER CAN HS 8SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: Half
Receiver Hysteresis: 120mV
Data Rate: 5Mbps
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고124,860

NX3DV2567HR-Q100X

NXP

IC ANLG SWITCH 4PDT 16HXQFN

Applications: Networking
Multiplexer/Demultiplexer Circuit: -
Switch Circuit: 4PDT
Number of Channels: 1
On-State Resistance (Max): 700 mOhm
Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 160MHz
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 16-XFQFN Exposed Pad
Supplier Device Package: 16-HXQFN (3x3)

패키지: 16-XFQFN Exposed Pad

재고17,994

MC68HC000IEI16R

NXP

IC MPU M680X0 16MHZ 68PLCC

Core Processor: EC000
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 16MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 68-LCC (J-Lead)
Supplier Device Package: 68-PLCC (25x25)

패키지: 68-LCC (J-Lead)

재고5,728

MC68EN360RC33L

NXP

IC MPU M683XX 33MHZ 241PGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 241-BEPGA
Supplier Device Package: 241-PGA (47.24x47.24)

패키지: 241-BEPGA

재고7,040

MC68360CVR25L

NXP

IC MPU M683XX 25MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고78,384

MC9328MXLVM15R2

NXP

IC MPU I.MXL 150MHZ 256MAPBGA

Core Processor: ARM920T
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 150MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: -
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 256-LFBGA
Supplier Device Package: -

패키지: 256-LFBGA

재고5,856

MC68711E20MFNE3

NXP

IC MCU 8BIT 20KB OTP 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 4MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: 20KB (20K x 8)
Program Memory Type: OTP
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

패키지: 52-LCC (J-Lead)

재고3,728

MC9S12GC96MFUE

NXP

IC MCU 16BIT 96KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고5,808

MC100ES6226AC

NXP

IC CLK BUFFER 1:9 3GHZ 32LQFP

Type: Fanout Buffer (Distribution), Divider
Number of Circuits: 1
Ratio - Input:Output: 1:9
Differential - Input:Output: Yes/Yes
Input: LVPECL
Output: LVCMOS, LVPECL
Frequency - Max: 3GHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: 0°C ~ 110°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고5,168

MPXV2053DP

NXP

SENSOR PRESSURE DIFF DUAL 8-SOP

Pressure Type: Differential
Operating Pressure: 7.25 PSI (50 kPa)
Output Type: Wheatstone Bridge
Output: 0 mV ~ 40 mV (10V)
Accuracy: -0.6% ~ 0.4%
Voltage - Supply: 10 V ~ 16 V
Port Size: Male - 0.13" (3.3mm) Tube, Dual
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 29.01 PSI (200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SMD Module
Supplier Device Package: -

패키지: 8-SMD Module

재고8,412

MC33493DTBE

NXP

IC RF TRANSMITTER UHF 14-TSSOP

Frequency: 315 ~ 434MHz, 868 ~ 928MHz
Applications: General Data Transfer
Modulation or Protocol: FSK, OOK
Data Rate (Max): 10 kbps
Power - Output: -3dBm
Current - Transmitting: 11.6mA
Data Interface: PCB, Surface Mount
Antenna Connector: PCB, Surface Mount
Memory Size: -
Features: -
Voltage - Supply: 1.9 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C
Package / Case: 14-TSSOP (0.173", 4.40mm Width)

패키지: 14-TSSOP (0.173", 4.40mm Width)

재고2,448

JN516X-EK001Z

NXP

EVAL KIT JN516X

Type: -
Frequency: -
For Use With/Related Products: -
Supplied Contents: -

패키지: -

재고3,436

MC33FS6512CAER2

NXP

SYSTEM BASIS CHIP DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP Exposed Pad

재고7,568

S912XDP512J1MALR

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 80MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b, 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고5,024

SPC5603BK0VLL4

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고5,856

S9S12XS256J0VAAR

NXP

16-BIT MCU S12X CORE 256KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 40MHz
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 8x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고2,656

MK02FN64VFM10R

NXP

KINETIS K 32-BIT MCU ARM CORTEX

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: I²C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM
Number of I/O: 26
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 12x16b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고2,480

MC33PF8100EQESR2

NXP

POWER MANAGEMENT IC I.MX8 PRE-PR

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: -
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

패키지: -

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SPC5606BAMLQ6R

NXP

NXP 32-BIT MCU, POWER ARCH CORE

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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S32G274AABK0VUCR

NXP

S32G274A ARM CORTEX-M7 AND -A53,

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 64-Bit/4 Core, 32-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: GbE (4)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

패키지: -

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