페이지 163 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF8S26060HR3	NXP	FET RF 65V 2.69GHZ Transistor Type: LDMOS Frequency: 2.69GHz Gain: 16.3dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 450mA Power - Output: 15.5W Voltage - Rated: 65V Package / Case: NI-400-240 Supplier Device Package: NI-400-240	패키지: NI-400-240	재고5,968
BFT93W,115	NXP	TRANS PNP 12V 50MA SOT323 Transistor Type: PNP Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 4GHz Noise Figure (dB Typ @ f): 2.4dB ~ 3dB @ 500MHz ~ 1GHz Gain: - Power - Max: 300mW DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 30mA, 5V Current - Collector (Ic) (Max): 50mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-70, SOT-323 Supplier Device Package: SOT-323-3	패키지: SC-70, SOT-323	재고6,784
MMPF0200F4AEPR2	NXP	IC PWR MGMT I.MX6 56QFN Applications: Converter, i.MX6 Voltage - Input: 2.8 V ~ 4.5 V Number of Outputs: 11 Voltage - Output: Multiple Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-QFN (8x8)	패키지: 56-VFQFN Exposed Pad	재고4,352
MCZ33812AEK	NXP	IC DVR IGNITION/INJECTOR 32SOIC Applications: Automotive Current - Supply: 10mA Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	패키지: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	재고4,080
TDA3629T/N2,112	NXP	IC LIGHT POSITION CTRLR 16-SOIC Applications: Automotive Current - Supply: 6mA Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고2,672
NCX2202GW,125	NXP	IC COMPARATOR LOW VOLTAGE 5TSSOP Type: General Purpose Number of Elements: 1 Output Type: Rail-to-Rail Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V Voltage - Input Offset (Max): 30mV @ 5.5V Current - Input Bias (Max): 1pA Current - Output (Typ): - Current - Quiescent (Max): 6µA CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR Propagation Delay (Max): 0.8µs Hysteresis: 20mV Operating Temperature: -40°C ~ 85°C Package / Case: 5-TSSOP, SC-70-5, SOT-353 Mounting Type: Surface Mount Supplier Device Package: 5-TSSOP	패키지: 5-TSSOP, SC-70-5, SOT-353	재고44,508
NE58633BS,115	NXP	IC AMP AUDIO .04W STER D 32HVQFN Type: Class D Output Type: Headphones, 2-Channel (Stereo) Max Output Power x Channels @ Load: 40mW x 2 @ 16 Ohm Voltage - Supply: 0.9 V ~ 1.7 V Features: Depop, Differential Inputs, Microphone, Mute, Short-Circuit Protection Mounting Type: Surface Mount Operating Temperature: 0°C ~ 70°C (TA) Supplier Device Package: 32-HVQFN (5x5) Package / Case: 32-VFQFN Exposed Pad	패키지: 32-VFQFN Exposed Pad	재고5,904
PCA9514AD,118	NXP	IC BUFFER I2C/SMBUS HOTSWAP 8SO Type: Buffer, Accelerator Applications: I2C - Hotswap Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 1.9pF Voltage - Supply: 2.7 V ~ 5.5 V Current - Supply: 3.5mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고3,040
PCA9674TS,118	NXP	IC I/O EXPANDER I2C 8B 20SSOP Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 1MHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-SSOP	패키지: 20-LSSOP (0.173", 4.40mm Width)	재고2,832
CBTL06122BHF,518	NXP	IC MULTIPLEXER HEX 1X2 56HWQFN Applications: DisplayPort, PCIe Multiplexer/Demultiplexer Circuit: 2:1 Switch Circuit: - Number of Channels: 6 On-State Resistance (Max): - Voltage - Supply, Single (V+): 3 V ~ 3.6 V Voltage - Supply, Dual (V±): - -3db Bandwidth: 2.5GHz Features: Bi-Directional Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 56-WFQFN Exposed Pad Supplier Device Package: 56-HWQFN	패키지: 56-WFQFN Exposed Pad	재고4,400
MPC8572EVTAULE	NXP	IC MPU MPC85XX 1.333GHZ 1023BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	패키지: 1023-BFBGA, FCBGA	재고6,592
XPC8260CZUIFBC	NXP	IC MPU MPC82XX 200MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	패키지: 480-LBGA	재고11,028
KXPC823ZT81B2T	NXP	IC MPU MPC8XX 81MHZ 256BGA Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 81MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Video Ethernet: 10 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	패키지: 256-BBGA	재고6,544
MPC860DTZQ80D4	NXP	IC MPU MPC8XX 80MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 80MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (1) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고6,208
MPC8360EVVAGDGA	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	패키지: 740-LBGA	재고6,744
MCIMX6S4AVM08ABR	NXP	IC MPU I.MX6S 800MHZ 624MAPBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	패키지: 624-LFBGA	재고7,376
MPC870ZT66	NXP	IC MPU MPC8XX 66MHZ 256BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 66MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 256-BBGA Supplier Device Package: 256-PBGA (23x23)	패키지: 256-BBGA	재고21,792
MW5IC2030GMBR5	NXP	IC PWR AMP RF 26V 30W TO272-16GW Frequency: 1.93GHz ~ 1.99GHz P1dB: - Gain: 23dB Noise Figure: - RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Current - Supply: 160mA Test Frequency: - Package / Case: TO-272-16 Variant, Gull Wing Supplier Device Package: TO-272 WB-16 GULL	패키지: TO-272-16 Variant, Gull Wing	재고6,894
SPC5605BF1VLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 77 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 7x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고6,736
S9S08DZ60F2VLHR	NXP	8-BIT MCU S08 CORE 60KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 53 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고6,496
S9S08LG32J0CLKR	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LCD, LVD, POR, PWM, WDT Number of I/O: 69 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1.9K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-LQFP Supplier Device Package: 80-LQFP (14x14)	패키지: 80-LQFP	재고4,272
S9S12VR32F0CLC	NXP	MAGNIV 16-BIT MCU S12 CORE 32K Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 2x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고2,736
FS32K144ULT0VLLT	NXP	IC MCU 32BIT FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 112MHz Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: - Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 16x12b; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고21,780
SJA1110DEL-0Y	NXP	IC AUTO ETHERNET SWITCH BGA Protocol: Ethernet Function: Switch Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI Standards: 10/100 Base-T/TX PHY Voltage - Supply: - Current - Supply: - Operating Temperature: - Package / Case: 256-LFBGA Supplier Device Package: 256-LFBGA (14x14)	패키지: -	Request a Quote
MIMX8ML3CVNKZAB	NXP	IC MPU I.MX8ML 1.6GHZ 548LFBGA Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP RAM Controllers: DDR4, LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI Ethernet: GbE (2) SATA: - USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TJ) Security Features: ARM TZ, CAAM, RDC Package / Case: 548-LFBGA Supplier Device Package: 548-LFBGA (15x15)	패키지: -	Request a Quote
MPF5200AMBA2ES	NXP	POWER MANAGEMENT IC, PRE-PROG, 3 Applications: - Current - Supply: 40µA Voltage - Supply: 2.7V ~ 5.5V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount, Wettable Flank Package / Case: 32-PowerWFQFN Supplier Device Package: 32-HWQFN (5x5)	패키지: -	Request a Quote
MIMX8MN5DUCJZAA	NXP	NANO SOLOLITE I.MX 8M LFBGA486 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
A2T21H360-23NR6	NXP	RF MOSFET LDMOS 28V OM1230-42 Transistor Type: LDMOS Frequency: 2.11GHz ~ 2.2GHz Gain: 16.8dB Voltage - Test: 28 V Current Rating: 10µA Noise Figure: - Current - Test: 500 mA Power - Output: 373W Voltage - Rated: 65 V Package / Case: OM-1230-4L2L Supplier Device Package: OM-1230-4L2L	패키지: -	Request a Quote

MRF8S26060HR3

NXP

FET RF 65V 2.69GHZ

Transistor Type: LDMOS
Frequency: 2.69GHz
Gain: 16.3dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 450mA
Power - Output: 15.5W
Voltage - Rated: 65V
Package / Case: NI-400-240
Supplier Device Package: NI-400-240

패키지: NI-400-240

재고5,968

BFT93W,115

NXP

TRANS PNP 12V 50MA SOT323

Transistor Type: PNP
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 4GHz
Noise Figure (dB Typ @ f): 2.4dB ~ 3dB @ 500MHz ~ 1GHz
Gain: -
Power - Max: 300mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 30mA, 5V
Current - Collector (Ic) (Max): 50mA
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-70, SOT-323
Supplier Device Package: SOT-323-3

패키지: SC-70, SOT-323

재고6,784

MMPF0200F4AEPR2

NXP

IC PWR MGMT I.MX6 56QFN

Applications: Converter, i.MX6
Voltage - Input: 2.8 V ~ 4.5 V
Number of Outputs: 11
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-QFN (8x8)

패키지: 56-VFQFN Exposed Pad

재고4,352

MCZ33812AEK

NXP

IC DVR IGNITION/INJECTOR 32SOIC

Applications: Automotive
Current - Supply: 10mA
Voltage - Supply: 4.7 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

패키지: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

재고4,080

TDA3629T/N2,112

NXP

IC LIGHT POSITION CTRLR 16-SOIC

Applications: Automotive
Current - Supply: 6mA
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고2,672

NCX2202GW,125

NXP

IC COMPARATOR LOW VOLTAGE 5TSSOP

Type: General Purpose
Number of Elements: 1
Output Type: Rail-to-Rail
Voltage - Supply, Single/Dual (±): 1.3 V ~ 5.5 V
Voltage - Input Offset (Max): 30mV @ 5.5V
Current - Input Bias (Max): 1pA
Current - Output (Typ): -
Current - Quiescent (Max): 6µA
CMRR, PSRR (Typ): 70dB CMRR, 80dB PSRR
Propagation Delay (Max): 0.8µs
Hysteresis: 20mV
Operating Temperature: -40°C ~ 85°C
Package / Case: 5-TSSOP, SC-70-5, SOT-353
Mounting Type: Surface Mount
Supplier Device Package: 5-TSSOP

패키지: 5-TSSOP, SC-70-5, SOT-353

재고44,508

NE58633BS,115

NXP

IC AMP AUDIO .04W STER D 32HVQFN

Type: Class D
Output Type: Headphones, 2-Channel (Stereo)
Max Output Power x Channels @ Load: 40mW x 2 @ 16 Ohm
Voltage - Supply: 0.9 V ~ 1.7 V
Features: Depop, Differential Inputs, Microphone, Mute, Short-Circuit Protection
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C (TA)
Supplier Device Package: 32-HVQFN (5x5)
Package / Case: 32-VFQFN Exposed Pad

패키지: 32-VFQFN Exposed Pad

재고5,904

PCA9514AD,118

NXP

IC BUFFER I2C/SMBUS HOTSWAP 8SO

Type: Buffer, Accelerator
Applications: I2C - Hotswap
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 1
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 1.9pF
Voltage - Supply: 2.7 V ~ 5.5 V
Current - Supply: 3.5mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고3,040

PCA9674TS,118

NXP

IC I/O EXPANDER I2C 8B 20SSOP

Number of I/O: 8
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 1MHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-SSOP

패키지: 20-LSSOP (0.173", 4.40mm Width)

재고2,832

CBTL06122BHF,518

NXP

IC MULTIPLEXER HEX 1X2 56HWQFN

Applications: DisplayPort, PCIe
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: -
Number of Channels: 6
On-State Resistance (Max): -
Voltage - Supply, Single (V+): 3 V ~ 3.6 V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 2.5GHz
Features: Bi-Directional
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 56-WFQFN Exposed Pad
Supplier Device Package: 56-HWQFN

패키지: 56-WFQFN Exposed Pad

재고4,400

MPC8572EVTAULE

NXP

IC MPU MPC85XX 1.333GHZ 1023BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

패키지: 1023-BFBGA, FCBGA

재고6,592

XPC8260CZUIFBC

NXP

IC MPU MPC82XX 200MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

재고11,028

KXPC823ZT81B2T

NXP

IC MPU MPC8XX 81MHZ 256BGA

Core Processor: PowerPC
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 81MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Video
Ethernet: 10 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

패키지: 256-BBGA

재고6,544

MPC860DTZQ80D4

NXP

IC MPU MPC8XX 80MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 80MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고6,208

MPC8360EVVAGDGA

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

패키지: 740-LBGA

재고6,744

MCIMX6S4AVM08ABR

NXP

IC MPU I.MX6S 800MHZ 624MAPBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

패키지: 624-LFBGA

재고7,376

MPC870ZT66

NXP

IC MPU MPC8XX 66MHZ 256BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 66MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 256-BBGA
Supplier Device Package: 256-PBGA (23x23)

패키지: 256-BBGA

재고21,792

MW5IC2030GMBR5

NXP

IC PWR AMP RF 26V 30W TO272-16GW

Frequency: 1.93GHz ~ 1.99GHz
P1dB: -
Gain: 23dB
Noise Figure: -
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Current - Supply: 160mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Gull Wing
Supplier Device Package: TO-272 WB-16 GULL

패키지: TO-272-16 Variant, Gull Wing

재고6,894

SPC5605BF1VLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 77
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 7x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고6,736

S9S08DZ60F2VLHR

NXP

8-BIT MCU S08 CORE 60KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 53
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고6,496

S9S08LG32J0CLKR

NXP

8-BIT MCU S08 CORE 32KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Number of I/O: 69
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1.9K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-LQFP
Supplier Device Package: 80-LQFP (14x14)

패키지: 80-LQFP

재고4,272

S9S12VR32F0CLC

NXP

MAGNIV 16-BIT MCU S12 CORE 32K

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 2x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고2,736

FS32K144ULT0VLLT

NXP

IC MCU 32BIT FLASH 100LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 112MHz
Connectivity: CANbus, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: -
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 16x12b; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고21,780

SJA1110DEL-0Y

NXP

IC AUTO ETHERNET SWITCH BGA

Protocol: Ethernet
Function: Switch
Interface: GPIO, JTAG, MII, RGMII, RMII, SGMII, SPI
Standards: 10/100 Base-T/TX PHY
Voltage - Supply: -
Current - Supply: -
Operating Temperature: -
Package / Case: 256-LFBGA
Supplier Device Package: 256-LFBGA (14x14)

패키지: -

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MIMX8ML3CVNKZAB

NXP

IC MPU I.MX8ML 1.6GHZ 548LFBGA

Core Processor: ARM® Cortex®-A53
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 1.6GHz
Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
RAM Controllers: DDR4, LPDDR4
Graphics Acceleration: Yes
Display & Interface Controllers: HTML, LVDS, MIPI-CSI, MIPI-DSI
Ethernet: GbE (2)
SATA: -
USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TJ)
Security Features: ARM TZ, CAAM, RDC
Package / Case: 548-LFBGA
Supplier Device Package: 548-LFBGA (15x15)

패키지: -

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MPF5200AMBA2ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

Applications: -
Current - Supply: 40µA
Voltage - Supply: 2.7V ~ 5.5V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 32-PowerWFQFN
Supplier Device Package: 32-HWQFN (5x5)

패키지: -

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MIMX8MN5DUCJZAA

NXP

NANO SOLOLITE I.MX 8M LFBGA486

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

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A2T21H360-23NR6

NXP

RF MOSFET LDMOS 28V OM1230-42

Transistor Type: LDMOS
Frequency: 2.11GHz ~ 2.2GHz
Gain: 16.8dB
Voltage - Test: 28 V
Current Rating: 10µA
Noise Figure: -
Current - Test: 500 mA
Power - Output: 373W
Voltage - Rated: 65 V
Package / Case: OM-1230-4L2L
Supplier Device Package: OM-1230-4L2L

패키지: -

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