페이지 189 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF8S21200HSR5	NXP	FET RF 2CH 65V 2.14GHZ NI-1230HS Transistor Type: LDMOS (Dual) Frequency: 2.14GHz Gain: 18.1dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 48W Voltage - Rated: 65V Package / Case: NI-1230S Supplier Device Package: NI-1230S	패키지: NI-1230S	재고7,408
MMRF1305HR5	NXP	FET RF 2CH 133V 512MHZ NI-780-4 Transistor Type: LDMOS (Dual) Frequency: 512MHz Gain: 26dB Voltage - Test: 50V Current Rating: - Noise Figure: - Current - Test: 100mA Power - Output: 100W Voltage - Rated: 133V Package / Case: NI-780-4 Supplier Device Package: NI-780-4	패키지: NI-780-4	재고4,080
NTB0101GM,115	NXP	TXRX TRANSLATING DUAL 6-XSON Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 1 Voltage - VCCA: 1.2V ~ 3.6V Voltage - VCCB: 1.65V ~ 5.5V Input Signal: - Output Signal: - Output Type: Tri-State, Non-Inverted Data Rate: 100Mbps Operating Temperature: -40°C ~ 125°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT886 (1.45x1)	패키지: 6-XFDFN	재고49,458
HEF4068BT,652	NXP	IC GATE NAND 1CH 8-INP 14-SO Logic Type: NAND Gate Number of Circuits: 1 Number of Inputs: 8 Features: - Voltage - Supply: 3 V ~ 15 V Current - Quiescent (Max): 4µA Current - Output High, Low: 3mA, 3mA Logic Level - Low: 1.5 V ~ 4 V Logic Level - High: 3.5 V ~ 11 V Max Propagation Delay @ V, Max CL: 65ns @ 15V, 50pF Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Supplier Device Package: 14-SO Package / Case: 14-SOIC (0.154", 3.90mm Width)	패키지: 14-SOIC (0.154", 3.90mm Width)	재고4,832
TDA1565TH/N1C,118	NXP	IC AMP AUDIO PWR 60W STER 20HSOP Type: Class AB Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 60W x 2 @ 2 Ohm Voltage - Supply: 6 V ~ 18 V Features: Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-HSOP Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	패키지: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	재고5,808
TDA8931T/N1,118	NXP	IC AMP/COMPARATOR 22W D 20SOIC Type: Class D Output Type: 1-Channel (Mono) Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm Voltage - Supply: 12 V ~ 35 V, ±6 V ~ 17.5 V Features: Depop, Short-Circuit and Thermal Protection Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-SO Package / Case: 20-SOIC (0.295", 7.50mm Width)	패키지: 20-SOIC (0.295", 7.50mm Width)	재고2,672
MC68VZ328VPR2	NXP	IC MPU M683XX 33MHZ 144MAPBGA Core Processor: FLX68000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: - RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: LCD, Touch Panel Ethernet: - SATA: - USB: - Voltage - I/O: 3.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	패키지: 144-LBGA	재고7,248
KMPC8548EVUATG	NXP	IC MPU MPC85XX 1.2GHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고7,360
MPC8541EPXAKE	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고6,432
MC68EC000AA12	NXP	IC MPU M680X0 12MHZ 64QFP Core Processor: EC000 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 12MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고6,432
MPC8536EBVJANGA	NXP	IC MPU MPC85XX 800MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고4,320
P2010NSE2KHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고2,864
MPC8347ECZQADDB	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	패키지: 620-BBGA Exposed Pad	재고2,144
MC9S08SH32MWL	NXP	IC MCU 8BIT 32KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 23 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	패키지: 28-SOIC (0.295", 7.50mm Width)	재고7,296
MC9S08SE8VWL	NXP	IC MCU 8BIT 8KB FLASH 28SOIC Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: LIN, SCI Peripherals: LVD, POR, PWM Number of I/O: 24 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 28-SOIC (0.295", 7.50mm Width) Supplier Device Package: 28-SOIC	패키지: 28-SOIC (0.295", 7.50mm Width)	재고3,664
MKE04Z64VLD4	NXP	IC MCU 32BIT 64KB FLASH 44LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: LVD, PWM, WDT Number of I/O: 38 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x12b, D/A 2x6b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 44-LQFP Supplier Device Package: 44-LQFP (10x10)	패키지: 44-LQFP	재고16,302
PCK3807ADB,112	NXP	IC CLK BUFFER 1:10 400MHZ 20SSOP Type: Fanout Buffer (Distribution) Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: No/No Input: LVCMOS, LVTTL Output: LVTTL Frequency - Max: 400MHz Voltage - Supply: 2.3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Supplier Device Package: 20-SSOP	패키지: 20-SSOP (0.209", 5.30mm Width)	재고3,104
MP3H6115A6T1	NXP	SENSOR PRESS 16.7PSI MAX 8-SSOP Pressure Type: Absolute Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa) Output Type: Analog Voltage Output: 0.12 V ~ 2.8 V Accuracy: ±1.5% Voltage - Supply: 2.7 V ~ 3.3 V Port Size: Male - 0.13" (3.3mm) Tube Port Style: Barbless Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 58.02 PSI (400 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 8-SOIC (0.295", 7.50mm Width) Supplier Device Package: 8-SSOP	패키지: 8-SOIC (0.295", 7.50mm Width)	재고47,220
1321XEVK	NXP	KIT EVALUATION FOR 1321X Type: Transceiver; 802.15.4 (ZigBee?) Frequency: 2.4GHz For Use With/Related Products: MC1321x Supplied Contents: 7 Boards	패키지: -	재고5,418
BGA2800,115	NXP	IC AMP MMIC WIDEBAND 6TSSOP Frequency: 0Hz ~ 2.2GHz P1dB: -2dBm (0.6mW) Gain: 20.2dB Noise Figure: 3.7dB RF Type: General Purpose Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 55mA Test Frequency: 2.15GHz Package / Case: 6-TSSOP, SC-88, SOT-363 Supplier Device Package: 6-TSSOP	패키지: 6-TSSOP, SC-88, SOT-363	재고7,632
MC7447AHX1333LB	NXP	APOLLO7PMRV1.11.3V105C Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,880
SPC5604BK0CLQ6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 123 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고5,184
SPC5602DF1MLL3	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 32MHz Connectivity: CANbus, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 33x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고4,000
SPC5603BF2VLL4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 48MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 28K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고4,048
MCIMX285AVM4C	NXP	IC MPU I.MX28 454MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: DDR2, LVDDR, LVDDR2 Graphics Acceleration: No Display & Interface Controllers: Keypad, LCD, Touchscreen Ethernet: 10/100Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: Boot Security, Cryptography, Hardware ID Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	패키지: -	Request a Quote
LPC54S016JBD100Y	NXP	POWER-EFFICIENT MICROCONTROLLERS Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Speed: 180MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 64 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 360K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 12x12b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: -	Request a Quote
MMRF1314H-1200	NXP	RF MOSFET LDMOS 52V NI1230 Transistor Type: LDMOS (Dual) Frequency: 1.2GHz ~ 1.4GHz Gain: 17.7dB Voltage - Test: 52 V Current Rating: 10µA Noise Figure: - Current - Test: 100 mA Power - Output: 1000W Voltage - Rated: 105 V Package / Case: SOT-979A Supplier Device Package: NI-1230-4H	패키지: -	Request a Quote
MWCT2016SHT0VPB	NXP	MWCT2016S,MAXQFP172 Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

MRF8S21200HSR5

NXP

FET RF 2CH 65V 2.14GHZ NI-1230HS

Transistor Type: LDMOS (Dual)
Frequency: 2.14GHz
Gain: 18.1dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 48W
Voltage - Rated: 65V
Package / Case: NI-1230S
Supplier Device Package: NI-1230S

패키지: NI-1230S

재고7,408

MMRF1305HR5

NXP

FET RF 2CH 133V 512MHZ NI-780-4

Transistor Type: LDMOS (Dual)
Frequency: 512MHz
Gain: 26dB
Voltage - Test: 50V
Current Rating: -
Noise Figure: -
Current - Test: 100mA
Power - Output: 100W
Voltage - Rated: 133V
Package / Case: NI-780-4
Supplier Device Package: NI-780-4

패키지: NI-780-4

재고4,080

NTB0101GM,115

NXP

TXRX TRANSLATING DUAL 6-XSON

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 1
Voltage - VCCA: 1.2V ~ 3.6V
Voltage - VCCB: 1.65V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Tri-State, Non-Inverted
Data Rate: 100Mbps
Operating Temperature: -40°C ~ 125°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT886 (1.45x1)

패키지: 6-XFDFN

재고49,458

HEF4068BT,652

NXP

IC GATE NAND 1CH 8-INP 14-SO

Logic Type: NAND Gate
Number of Circuits: 1
Number of Inputs: 8
Features: -
Voltage - Supply: 3 V ~ 15 V
Current - Quiescent (Max): 4µA
Current - Output High, Low: 3mA, 3mA
Logic Level - Low: 1.5 V ~ 4 V
Logic Level - High: 3.5 V ~ 11 V
Max Propagation Delay @ V, Max CL: 65ns @ 15V, 50pF
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SO
Package / Case: 14-SOIC (0.154", 3.90mm Width)

패키지: 14-SOIC (0.154", 3.90mm Width)

재고4,832

TDA1565TH/N1C,118

NXP

IC AMP AUDIO PWR 60W STER 20HSOP

Type: Class AB
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 60W x 2 @ 2 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-HSOP
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

패키지: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

재고5,808

TDA8931T/N1,118

NXP

IC AMP/COMPARATOR 22W D 20SOIC

Type: Class D
Output Type: 1-Channel (Mono)
Max Output Power x Channels @ Load: 22W x 1 @ 4 Ohm
Voltage - Supply: 12 V ~ 35 V, ±6 V ~ 17.5 V
Features: Depop, Short-Circuit and Thermal Protection
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-SO
Package / Case: 20-SOIC (0.295", 7.50mm Width)

패키지: 20-SOIC (0.295", 7.50mm Width)

재고2,672

MC68VZ328VPR2

NXP

IC MPU M683XX 33MHZ 144MAPBGA

Core Processor: FLX68000
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: -
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: LCD, Touch Panel
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 3.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 144-LBGA
Supplier Device Package: 144-MAPBGA (13x13)

패키지: 144-LBGA

재고7,248

KMPC8548EVUATG

NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고7,360

MPC8541EPXAKE

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고6,432

MC68EC000AA12

NXP

IC MPU M680X0 12MHZ 64QFP

Core Processor: EC000
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 12MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고6,432

MPC8536EBVJANGA

NXP

IC MPU MPC85XX 800MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고4,320

P2010NSE2KHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고2,864

MPC8347ECZQADDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

패키지: 620-BBGA Exposed Pad

재고2,144

MC9S08SH32MWL

NXP

IC MCU 8BIT 32KB FLASH 28SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 23
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

패키지: 28-SOIC (0.295", 7.50mm Width)

재고7,296

MC9S08SE8VWL

NXP

IC MCU 8BIT 8KB FLASH 28SOIC

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: LIN, SCI
Peripherals: LVD, POR, PWM
Number of I/O: 24
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 28-SOIC

패키지: 28-SOIC (0.295", 7.50mm Width)

재고3,664

MKE04Z64VLD4

NXP

IC MCU 32BIT 64KB FLASH 44LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: LVD, PWM, WDT
Number of I/O: 38
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x12b, D/A 2x6b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 44-LQFP
Supplier Device Package: 44-LQFP (10x10)

패키지: 44-LQFP

재고16,302

PCK3807ADB,112

NXP

IC CLK BUFFER 1:10 400MHZ 20SSOP

Type: Fanout Buffer (Distribution)
Number of Circuits: 1
Ratio - Input:Output: 1:10
Differential - Input:Output: No/No
Input: LVCMOS, LVTTL
Output: LVTTL
Frequency - Max: 400MHz
Voltage - Supply: 2.3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 20-SSOP

패키지: 20-SSOP (0.209", 5.30mm Width)

재고3,104

MP3H6115A6T1

NXP

SENSOR PRESS 16.7PSI MAX 8-SSOP

Pressure Type: Absolute
Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
Output Type: Analog Voltage
Output: 0.12 V ~ 2.8 V
Accuracy: ±1.5%
Voltage - Supply: 2.7 V ~ 3.3 V
Port Size: Male - 0.13" (3.3mm) Tube
Port Style: Barbless
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 58.02 PSI (400 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 8-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 8-SSOP

패키지: 8-SOIC (0.295", 7.50mm Width)

재고47,220

1321XEVK

NXP

KIT EVALUATION FOR 1321X

Type: Transceiver; 802.15.4 (ZigBee?)
Frequency: 2.4GHz
For Use With/Related Products: MC1321x
Supplied Contents: 7 Boards

패키지: -

재고5,418

BGA2800,115

NXP

IC AMP MMIC WIDEBAND 6TSSOP

Frequency: 0Hz ~ 2.2GHz
P1dB: -2dBm (0.6mW)
Gain: 20.2dB
Noise Figure: 3.7dB
RF Type: General Purpose
Voltage - Supply: 3 V ~ 3.6 V
Current - Supply: 55mA
Test Frequency: 2.15GHz
Package / Case: 6-TSSOP, SC-88, SOT-363
Supplier Device Package: 6-TSSOP

패키지: 6-TSSOP, SC-88, SOT-363

재고7,632

MC7447AHX1333LB

NXP

APOLLO7PMRV1.11.3V105C

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,880

SPC5604BK0CLQ6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 123
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고5,184

SPC5602DF1MLL3

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 32MHz
Connectivity: CANbus, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 33x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고4,000

SPC5603BF2VLL4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 48MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 28K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고4,048

MCIMX285AVM4C

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 454MHz
Co-Processors/DSP: Data; DCP
RAM Controllers: DDR2, LVDDR, LVDDR2
Graphics Acceleration: No
Display & Interface Controllers: Keypad, LCD, Touchscreen
Ethernet: 10/100Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: Boot Security, Cryptography, Hardware ID
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

패키지: -

Request a Quote

LPC54S016JBD100Y

NXP

POWER-EFFICIENT MICROCONTROLLERS

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 360K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 12x12b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: -

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MMRF1314H-1200

NXP

RF MOSFET LDMOS 52V NI1230

Transistor Type: LDMOS (Dual)
Frequency: 1.2GHz ~ 1.4GHz
Gain: 17.7dB
Voltage - Test: 52 V
Current Rating: 10µA
Noise Figure: -
Current - Test: 100 mA
Power - Output: 1000W
Voltage - Rated: 105 V
Package / Case: SOT-979A
Supplier Device Package: NI-1230-4H

패키지: -

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MWCT2016SHT0VPB

NXP

MWCT2016S,MAXQFP172

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote