NXP 제품

MRFE6S9201HSR5

NXP

FET RF 66V 880MHZ NI-780S

• Transistor Type: LDMOS
• Frequency: 880MHz
• Gain: 20.8dB
• Voltage - Test: 28V
• Current Rating: -
• Noise Figure: -
• Current - Test: 1.4A
• Power - Output: 40W
• Voltage - Rated: 66V
• Package / Case: NI-780S
• Supplier Device Package: NI-780S

패키지: NI-780S

MRF374A

NXP

FET RF 70V 863MHZ NI-650

• Transistor Type: LDMOS
• Frequency: 857MHz ~ 863MHz
• Gain: 17.3dB
• Voltage - Test: 32V
• Current Rating: -
• Noise Figure: -
• Current - Test: 400mA
• Power - Output: 130W
• Voltage - Rated: 70V
• Package / Case: NI-650
• Supplier Device Package: NI-650

패키지: NI-650

MC14489BDW

NXP

IC DRIVER LED/LAMP 5CH 20-SOIC

• Display Type: LED
• Configuration: 7 Segment
• Interface: Serial
• Digits or Characters: -
• Current - Supply: 5.5mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 130°C
• Mounting Type: Surface Mount
• Package / Case: 20-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 20-SOIC

패키지: 20-SOIC (0.295", 7.50mm Width)

SSTU32865ET,551

NXP

IC BUFFER 1.8V 28BIT SOT802-1

• Logic Type: 1:2 Registered Buffer with Parity
• Supply Voltage: 1.7 V ~ 1.9 V
• Number of Bits: 28
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 160-TFBGA
• Supplier Device Package: 160-TFBGA (9x13)

패키지: 160-TFBGA

BGD704,112

NXP

IC AMPLIFIER POWER SOT-115J

• Applications: CATV
• Output Type: -
• Number of Circuits: 1
• -3db Bandwidth: -
• Slew Rate: -
• Current - Supply: 425mA
• Current - Output / Channel: -
• Voltage - Supply, Single/Dual (±): -
• Mounting Type: -
• Package / Case: SOT-115J
• Supplier Device Package: SOT115J

패키지: SOT-115J

SC16C550IB48,128

NXP

IC UART 48LQFP

• Features: -
• Number of Channels: 1, UART
• FIFO's: 16 Byte
• Protocol: -
• Data Rate (Max): 3Mbps
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With IrDA Encoder/Decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

MCZ33903CD3EK

NXP

IC SBC CAN HS 3.3V 32SOIC

• Applications: System Basis Chip
• Interface: CAN, LIN
• Voltage - Supply: 5.5 V ~ 28 V
• Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
• Supplier Device Package: 32-SOIC EP
• Mounting Type: Surface Mount

패키지: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

P5020NSE1QMB

NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

• Core Processor: PowerPC e5500
• Number of Cores/Bus Width: 2 Core, 64-Bit
• Speed: 2.0GHz
• Co-Processors/DSP: Security; SEC 4.2
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 1 Gbps (5), 10 Gbps (1)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
• Package / Case: 1295-BBGA, FCBGA
• Supplier Device Package: 1295-FCPBGA (37.5x37.5)

패키지: 1295-BBGA, FCBGA

P2040NXN1FLB

NXP

IC MPU Q OR IQ 667MHZ 780FCBGA

• Core Processor: PowerPC e500mc
• Number of Cores/Bus Width: 4 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR3, DDR3L
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (5)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 1.0V, 1.35V, 1.5V, 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: -
• Package / Case: -
• Supplier Device Package: 780-FCPBGA (23x23)

패키지: -

KMPC8347ECZQAGDB

NXP

IC MPU MPC83XX 266MHZ 620BGA

• Core Processor: PowerPC e300
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 266MHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: -
• USB: USB 2.0 + PHY (2)
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography, Random Number Generator
• Package / Case: 620-BBGA Exposed Pad
• Supplier Device Package: 620-PBGA (29x29)

패키지: 620-BBGA Exposed Pad

MPC8540PX667LB

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: -
• RAM Controllers: DDR, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (1), 10/100/1000 Mbps (2)
• SATA: -
• USB: -
• Voltage - I/O: 2.5V, 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 784-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

패키지: 784-BBGA, FCBGA

MC7448VU667NC

NXP

IC MPU MPC74XX 667MHZ 360FCCBGA

• Core Processor: PowerPC G4
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 667MHz
• Co-Processors/DSP: Multimedia; SIMD
• RAM Controllers: -
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: -
• SATA: -
• USB: -
• Voltage - I/O: 1.5V, 1.8V, 2.5V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 360-CBGA, FCCBGA
• Supplier Device Package: 360-FCCBGA (25x25)

패키지: 360-CBGA, FCCBGA

XPC8255VVIFBC

NXP

IC MPU MPC82XX 200MHZ 408TBGA

• Core Processor: PowerPC G2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 200MHz
• Co-Processors/DSP: Communications; RISC CPM
• RAM Controllers: DRAM, SDRAM
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: -
• Voltage - I/O: 3.3V
• Operating Temperature: 0°C ~ 105°C (TA)
• Security Features: -
• Package / Case: 480-LBGA
• Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

MPC8536EAVJAULA

NXP

IC MPU SOC 32B 1.33GHZ 783FCBGA

• Core Processor: PowerPC e500
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 1.333GHz
• Co-Processors/DSP: Security; SEC
• RAM Controllers: DDR2, DDR3
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100/1000 Mbps (2)
• SATA: SATA 3Gbps (2)
• USB: USB 2.0 (3)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: 0°C ~ 90°C (TA)
• Security Features: Cryptography
• Package / Case: 783-BBGA, FCBGA
• Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

MPC8321ECVRAFDCA

NXP

IC MPU MPC83XX 333MHZ 516BGA

• Core Processor: PowerPC e300c2
• Number of Cores/Bus Width: 1 Core, 32-Bit
• Speed: 333MHz
• Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 2.2
• RAM Controllers: DDR, DDR2
• Graphics Acceleration: No
• Display & Interface Controllers: -
• Ethernet: 10/100 Mbps (3)
• SATA: -
• USB: USB 2.0 (1)
• Voltage - I/O: 1.8V, 2.5V, 3.3V
• Operating Temperature: -40°C ~ 105°C (TA)
• Security Features: Cryptography
• Package / Case: 516-BBGA
• Supplier Device Package: 516-FPBGA (27x27)

패키지: 516-BBGA

MPC565MZP56R2

NXP

IC MCU 32BIT 1MB FLASH 388BGA

• Core Processor: PowerPC
• Core Size: 32-Bit
• Speed: 56MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
• Peripherals: POR, PWM, WDT
• Number of I/O: 56
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 36K x 8
• Voltage - Supply (Vcc/Vdd): 2.5 V ~ 2.7 V
• Data Converters: A/D 40x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 388-BBGA
• Supplier Device Package: 388-PBGA (27x27)

패키지: 388-BBGA

DSP56852VFE

NXP

IC MCU 16BIT 12KB SRAM 81MAPBGA

• Core Processor: 56800E
• Core Size: 16-Bit
• Speed: 120MHz
• Connectivity: EBI/EMI, SCI, SPI, SSI
• Peripherals: POR, WDT
• Number of I/O: 11
• Program Memory Size: 12KB (6K x 16)
• Program Memory Type: SRAM
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.3 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 81-LFBGA
• Supplier Device Package: 81-MAPBGA (8x8)

패키지: 81-LFBGA

P89LPC903FD,112

NXP

IC MCU 8BIT 1KB FLASH 8SOIC

• Core Processor: 8051
• Core Size: 8-Bit
• Speed: 7.3728MHz
• Connectivity: UART/USART
• Peripherals: Brown-out Detect/Reset, LED, POR, WDT
• Number of I/O: 6
• Program Memory Size: 1KB (1K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128 x 8
• Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
• Data Converters: -
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

MC56F82736VLF

NXP

IC MCU 32BIT 48KB FLASH 48LQFP

• Core Processor: 56800EX
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, I2C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 39
• Program Memory Size: 48KB (24K x 16)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 4K x 16
• Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C (TA)
• Mounting Type: -
• Package / Case: 48-LQFP
• Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

MK53DN512ZCLQ10

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

• Core Processor: ARM? Cortex?-M4
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
• Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
• Number of I/O: 94
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 128K x 8
• Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
• Data Converters: A/D 41x16b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

TDA8766G/C1,151

NXP

IC ADC HIGH SPEED 10BIT 32LQFP

• Number of Bits: 10
• Sampling Rate (Per Second): 20M
• Number of Inputs: 1
• Input Type: Single Ended
• Data Interface: Parallel
• Configuration: ADC
• Ratio - S/H:ADC: -
• Number of A/D Converters: 1
• Architecture: Sigma-Delta
• Reference Type: External
• Voltage - Supply, Analog: 3 V ~ 5.25 V
• Voltage - Supply, Digital: 3 V ~ 5.25 V
• Features: -
• Operating Temperature: 20°C ~ 75°C
• Package / Case: 32-LQFP
• Supplier Device Package: 32-LQFP (5x5)
• Mounting Type: -

패키지: 32-LQFP

SPC5516EAMLQ48

NXP

NXP 32-BIT MCU POWER ARCH CORE

• Core Processor: e200z0, e200z1
• Core Size: 32-Bit Dual-Core
• Speed: 66MHz
• Connectivity: CANbus, EBI/EMI, I²C, SCI, SPI
• Peripherals: DMA, POR, PWM, WDT
• Number of I/O: 111
• Program Memory Size: 1MB (1M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 64K x 8
• Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.25 V
• Data Converters: A/D 40x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: -
• Package / Case: 144-LQFP
• Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

MPF5020CMBA0ESR2

NXP

POWER MANAGEMENT IC, PRE-PROG, 3

• Applications: High Performance i.MX 8, S32x Processor Based
• Current - Supply: -
• Voltage - Supply: -
• Operating Temperature: -
• Mounting Type: Surface Mount, Wettable Flank
• Package / Case: 40-VFQFN Exposed Pad
• Supplier Device Package: 40-HVQFN (6x6)

패키지: -

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A2T18S166W12SR3

NXP

RF MOSFET LDMOS NI780

• Transistor Type: LDMOS
• Frequency: 1.805GHz ~ 1.995GHz
• Gain: -
• Voltage - Test: -
• Current Rating: -
• Noise Figure: -
• Current - Test: -
• Power - Output: 38W
• Voltage - Rated: 28 V
• Package / Case: NI-780-2S2L
• Supplier Device Package: NI-780-2S2L

패키지: -

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FS32K116BRT0MFMT

NXP

IC MCU 32BIT 128KB FLASH 32HVQFN

• Core Processor: ARM® Cortex®-M0+
• Core Size: 32-Bit Single-Core
• Speed: 48MHz
• Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
• Peripherals: DMA, PWM, WDT
• Number of I/O: 28
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 2K x 8
• RAM Size: 17K x 8
• Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
• Data Converters: A/D 13x12b SAR; D/A 1x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 32-VFQFN Exposed Pad
• Supplier Device Package: 32-HVQFN (5x5)

패키지: -

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MIMXRT1064CVL5B

NXP

IC MCU 32BIT 4MB FLASH 196MAPBGA

• Core Processor: ARM® Cortex®-M7
• Core Size: 32-Bit Single-Core
• Speed: 528MHz
• Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number of I/O: 127
• Program Memory Size: 4MB (4M x 8)
• Program Memory Type: FLASH
• EEPROM Size: -
• RAM Size: 1M x 8
• Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
• Data Converters: A/D 20x12b
• Oscillator Type: External, Internal
• Operating Temperature: -40°C ~ 105°C (TJ)
• Mounting Type: Surface Mount
• Package / Case: 196-LFBGA
• Supplier Device Package: 196-MAPBGA (10x10)

패키지: -

S9S12G128J0CLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

• Core Processor: S12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CANbus, IrDA, LINbus, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number of I/O: 54
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• EEPROM Size: 4K x 8
• RAM Size: 8K x 8
• Voltage - Supply (Vcc/Vdd): 3.13V ~ 5.5V
• Data Converters: A/D 12x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C (TA)
• Mounting Type: Surface Mount
• Package / Case: 64-LQFP
• Supplier Device Package: 64-LQFP (10x10)

패키지: -

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MIMX8ML8DVNLZAB

NXP

IC MPU I.MX8ML 1.8GHZ 486LFBGA

• Core Processor: ARM® Cortex®-A53
• Number of Cores/Bus Width: 4 Core, 64-Bit
• Speed: 1.8GHz
• Co-Processors/DSP: ARM® Cortex®-M7, Multimedia; NEON™ MPE, Hi-Fi4 DSP
• RAM Controllers: DDR4, LPDDR4
• Graphics Acceleration: Yes
• Display & Interface Controllers: MIPI-CSI, MIPI-DSI
• Ethernet: GbE (2)
• SATA: -
• USB: USB 2.0 + PHY (2), USB 3.0 + PHY (2)
• Voltage - I/O: -
• Operating Temperature: 0°C ~ 95°C (TJ)
• Security Features: ARM TZ, CAAM, RDC
• Package / Case: 486-LFBGA
• Supplier Device Package: 486-LFBGA (14x14)

패키지: -

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