페이지 44 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PH6030L,115	NXP	MOSFET N-CH 30V 76.7A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 76.7A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 15.2nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 2260pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 62.5W (Tc) Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	패키지: SC-100, SOT-669	재고2,432
MRFG35010AR5	NXP	FET RF 15V 3.55GHZ NI360HF Transistor Type: pHEMT FET Frequency: 3.55GHz Gain: 10dB Voltage - Test: 12V Current Rating: - Noise Figure: - Current - Test: 140mA Power - Output: 1W Voltage - Rated: 15V Package / Case: NI-360HF Supplier Device Package: NI-360HF	패키지: NI-360HF	재고4,272
1PS181,135	NXP	DIODE ARRAY GP 80V 215MA SMT3 Diode Configuration: 1 Pair Common Anode Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 80V Current - Average Rectified (Io) (per Diode): 215mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 500nA @ 80V Operating Temperature - Junction: 150°C (Max) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고2,720
MC33908AE	NXP	IC SYSTEM BASIS CHIP CAN 48LQFP Applications: Power Supply, Automotive Applications Voltage - Input: -1 V ~ 40 V Number of Outputs: 6 Voltage - Output: Multiple Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	패키지: 48-LQFP Exposed Pad	재고10,392
TEA1761T/N2/DG,118	NXP	IC CTLR SMPS SW 8SO Applications: Secondary-Side Controller Voltage - Input: - Voltage - Supply: 8.6 V ~ 38 V Current - Supply: 1mA Operating Temperature: -20°C ~ 150°C Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-SO	패키지: 8-SOIC (0.154", 3.90mm Width)	재고3,392
MPC17511AEP	NXP	IC MOTOR DRIVER PAR 24QFN Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Function: Driver - Fully Integrated, Control and Power Stage Output Configuration: Half Bridge (2) Interface: Parallel Technology: CMOS Step Resolution: - Applications: General Purpose Current - Output: 1A Voltage - Supply: 2.7 V ~ 5.7 V Voltage - Load: 2 V ~ 6.8 V Operating Temperature: -20°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Supplier Device Package: 24-QFN-EP (4x4)	패키지: 24-VFQFN Exposed Pad	재고4,912
UBA2014P/N1,112	NXP	IC CNTL BALLAST 600V 16-DIP Type: Ballast Controller Frequency: 40.5kHz ~ 100kHz Voltage - Supply: 9.1 V ~ 13 V Current - Supply: 1.5mA Current - Output Source/Sink: - Dimming: No Operating Temperature: -25°C ~ 80°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고5,280
74LVU04PW,112	NXP	IC HEX INVERTER 14TSSOP Logic Type: Inverter Number of Circuits: 6 Number of Inputs: 6 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.2 V ~ 0.5 V Logic Level - High: 1 V ~ 2.4 V Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-TSSOP Package / Case: 14-TSSOP (0.173", 4.40mm Width)	패키지: 14-TSSOP (0.173", 4.40mm Width)	재고4,752
74LVU04DB,112	NXP	IC HEX INVERTER 14SSOP Logic Type: Inverter Number of Circuits: 6 Number of Inputs: 6 Features: - Voltage - Supply: 1 V ~ 5.5 V Current - Quiescent (Max): 40µA Current - Output High, Low: 12mA, 12mA Logic Level - Low: 0.2 V ~ 0.5 V Logic Level - High: 1 V ~ 2.4 V Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-SSOP Package / Case: 14-SSOP (0.209", 5.30mm Width)	패키지: 14-SSOP (0.209", 5.30mm Width)	재고7,520
PX1011B-EL1/N,551	NXP	IC PCI-EXPRESS X1 PHY 81-LFBGA Applications: PCI Express MAX to PCI Express PHY Interface: JTAG Voltage - Supply: 1.2V Package / Case: 81-LFBGA Supplier Device Package: 81-LFBGA (9x9) Mounting Type: Surface Mount	패키지: 81-LFBGA	재고7,344
PX1011A-EL1,551	NXP	IC PCI-EXPRESS X1 PHY 81-LFBGA Applications: PCI Express MAX to PCI Express PHY Interface: IEEE 1149.1 Voltage - Supply: 1.2V Package / Case: 81-LFBGA Supplier Device Package: 81-LFBGA (9x9) Mounting Type: Surface Mount	패키지: 81-LFBGA	재고6,576
KMPC8560CPX667JB	NXP	IC MPU MPC85XX 667MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 784-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 784-BBGA, FCBGA	재고6,832
MC68020CEH25E	NXP	IC MPU M680X0 25MHZ 132QFP Core Processor: 68020 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 25MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	패키지: 132-BQFP Bumpered	재고5,008
P1025NSN5DFB	NXP	IC MPU Q OR IQ 667MHZ 561TEBGA1 Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 561-FBGA Supplier Device Package: 561-TEPBGA1 (23x23)	패키지: 561-FBGA	재고4,784
MC68HC908GR16CFJ	NXP	IC MCU 8BIT 16KB FLASH 32LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: LIN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 21 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고7,568
MC9S12B64CFUE	NXP	IC MCU 16BIT 64KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 59 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고21,240
SPC5601PEF0MLH6	NXP	IC MCU 32BIT 192KB FLASH 64LQFP Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 45 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 16 RAM Size: 12K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고6,208
MCHC908QY4VDWE	NXP	IC MCU 8BIT 4KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고4,816
S9S12G192F0VLFR	NXP	IC MCU 16BIT 192KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 192KB (192K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 11K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고2,704
MPC940LFA	NXP	IC CLOCK DISTRIB LV 1:18 32-LQFP PLL: No Main Purpose: Intel CPU Servers Input: LVCMOS, LVPECL Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 2:18 Differential - Input:Output: Yes/No Frequency - Max: 250MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고11,760
MCIMX6D5EYM12AE	NXP	I.MX6Q ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -20°C ~ 105°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	패키지: 624-FBGA, FCBGA	재고6,288
S9S08DN32F2VLF	NXP	8-BIT MCU S08 CORE 32KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 1.5K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고2,912
FS32K148HET0MMHT	NXP	IC MCU 32BIT 2MB FLASH 100MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: I2S, POR, PWM, WDT Number of I/O: 89 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 32x12b SAR; D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	패키지: -	Request a Quote
S9S08DZ60F2CLCR	NXP	IC MCU 8BIT 60KB FLASH 32LQFP Core Processor: HCS08 Core Size: 8-Bit Speed: 40MHz Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: -	Request a Quote
SPC5606SF2CLU6R	NXP	IC MCU 32BIT 1MB FLASH 176LQFP Core Processor: e200z0h Core Size: 32-Bit Single-Core Speed: 64MHz Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI Peripherals: DMA, LCD, POR, PWM, WDT Number of I/O: 133 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	패키지: -	Request a Quote
MPC5554MVR80	NXP	IC Core Processor: e200z6 Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.35V ~ 5.25V Data Converters: A/D 40x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 416-BBGA Supplier Device Package: 416-PBGA (27x27)	패키지: -	Request a Quote
TJR1463ATK-0Z	NXP	IC 14HVSON Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5)	패키지: -	Request a Quote
FC32K146UAT0VLLR	NXP	S32K144 32-BIT MCU, ARM CORTEX-M Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

PH6030L,115

NXP

MOSFET N-CH 30V 76.7A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 76.7A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 15.2nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 2260pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 62.5W (Tc)
Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

패키지: SC-100, SOT-669

재고2,432

MRFG35010AR5

NXP

FET RF 15V 3.55GHZ NI360HF

Transistor Type: pHEMT FET
Frequency: 3.55GHz
Gain: 10dB
Voltage - Test: 12V
Current Rating: -
Noise Figure: -
Current - Test: 140mA
Power - Output: 1W
Voltage - Rated: 15V
Package / Case: NI-360HF
Supplier Device Package: NI-360HF

패키지: NI-360HF

재고4,272

1PS181,135

NXP

DIODE ARRAY GP 80V 215MA SMT3

Diode Configuration: 1 Pair Common Anode
Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 80V
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 500nA @ 80V
Operating Temperature - Junction: 150°C (Max)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고2,720

MC33908AE

NXP

IC SYSTEM BASIS CHIP CAN 48LQFP

Applications: Power Supply, Automotive Applications
Voltage - Input: -1 V ~ 40 V
Number of Outputs: 6
Voltage - Output: Multiple
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

패키지: 48-LQFP Exposed Pad

재고10,392

TEA1761T/N2/DG,118

NXP

IC CTLR SMPS SW 8SO

Applications: Secondary-Side Controller
Voltage - Input: -
Voltage - Supply: 8.6 V ~ 38 V
Current - Supply: 1mA
Operating Temperature: -20°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-SO

패키지: 8-SOIC (0.154", 3.90mm Width)

재고3,392

MPC17511AEP

NXP

IC MOTOR DRIVER PAR 24QFN

Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Function: Driver - Fully Integrated, Control and Power Stage
Output Configuration: Half Bridge (2)
Interface: Parallel
Technology: CMOS
Step Resolution: -
Applications: General Purpose
Current - Output: 1A
Voltage - Supply: 2.7 V ~ 5.7 V
Voltage - Load: 2 V ~ 6.8 V
Operating Temperature: -20°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Supplier Device Package: 24-QFN-EP (4x4)

패키지: 24-VFQFN Exposed Pad

재고4,912

UBA2014P/N1,112

NXP

IC CNTL BALLAST 600V 16-DIP

Type: Ballast Controller
Frequency: 40.5kHz ~ 100kHz
Voltage - Supply: 9.1 V ~ 13 V
Current - Supply: 1.5mA
Current - Output Source/Sink: -
Dimming: No
Operating Temperature: -25°C ~ 80°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고5,280

74LVU04PW,112

NXP

IC HEX INVERTER 14TSSOP

Logic Type: Inverter
Number of Circuits: 6
Number of Inputs: 6
Features: -
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Max): 40µA
Current - Output High, Low: 12mA, 12mA
Logic Level - Low: 0.2 V ~ 0.5 V
Logic Level - High: 1 V ~ 2.4 V
Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-TSSOP
Package / Case: 14-TSSOP (0.173", 4.40mm Width)

패키지: 14-TSSOP (0.173", 4.40mm Width)

재고4,752

74LVU04DB,112

NXP

IC HEX INVERTER 14SSOP

Logic Type: Inverter
Number of Circuits: 6
Number of Inputs: 6
Features: -
Voltage - Supply: 1 V ~ 5.5 V
Current - Quiescent (Max): 40µA
Current - Output High, Low: 12mA, 12mA
Logic Level - Low: 0.2 V ~ 0.5 V
Logic Level - High: 1 V ~ 2.4 V
Max Propagation Delay @ V, Max CL: 7ns @ 3.3V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SSOP
Package / Case: 14-SSOP (0.209", 5.30mm Width)

패키지: 14-SSOP (0.209", 5.30mm Width)

재고7,520

PX1011B-EL1/N,551

NXP

IC PCI-EXPRESS X1 PHY 81-LFBGA

Applications: PCI Express MAX to PCI Express PHY
Interface: JTAG
Voltage - Supply: 1.2V
Package / Case: 81-LFBGA
Supplier Device Package: 81-LFBGA (9x9)
Mounting Type: Surface Mount

패키지: 81-LFBGA

재고7,344

PX1011A-EL1,551

NXP

IC PCI-EXPRESS X1 PHY 81-LFBGA

Applications: PCI Express MAX to PCI Express PHY
Interface: IEEE 1149.1
Voltage - Supply: 1.2V
Package / Case: 81-LFBGA
Supplier Device Package: 81-LFBGA (9x9)
Mounting Type: Surface Mount

패키지: 81-LFBGA

재고6,576

KMPC8560CPX667JB

NXP

IC MPU MPC85XX 667MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 784-BBGA, FCBGA

재고6,832

MC68020CEH25E

NXP

IC MPU M680X0 25MHZ 132QFP

Core Processor: 68020
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 25MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

패키지: 132-BQFP Bumpered

재고5,008

P1025NSN5DFB

NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 561-FBGA
Supplier Device Package: 561-TEPBGA1 (23x23)

패키지: 561-FBGA

재고4,784

MC68HC908GR16CFJ

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: LIN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 21
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고7,568

MC9S12B64CFUE

NXP

IC MCU 16BIT 64KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 59
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고21,240

SPC5601PEF0MLH6

NXP

IC MCU 32BIT 192KB FLASH 64LQFP

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 45
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 16
RAM Size: 12K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고6,208

MCHC908QY4VDWE

NXP

IC MCU 8BIT 4KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고4,816

S9S12G192F0VLFR

NXP

IC MCU 16BIT 192KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 192KB (192K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 11K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고2,704

MPC940LFA

NXP

IC CLOCK DISTRIB LV 1:18 32-LQFP

PLL: No
Main Purpose: Intel CPU Servers
Input: LVCMOS, LVPECL
Output: LVCMOS
Number of Circuits: 1
Ratio - Input:Output: 2:18
Differential - Input:Output: Yes/No
Frequency - Max: 250MHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고11,760

MCIMX6D5EYM12AE

NXP

I.MX6Q ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -20°C ~ 105°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

패키지: 624-FBGA, FCBGA

재고6,288

S9S08DN32F2VLF

NXP

8-BIT MCU S08 CORE 32KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 1.5K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고2,912

FS32K148HET0MMHT

NXP

IC MCU 32BIT 2MB FLASH 100MAPBGA

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: I2S, POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 32x12b SAR; D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

패키지: -

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S9S08DZ60F2CLCR

NXP

IC MCU 8BIT 60KB FLASH 32LQFP

Core Processor: HCS08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: -

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SPC5606SF2CLU6R

NXP

IC MCU 32BIT 1MB FLASH 176LQFP

Core Processor: e200z0h
Core Size: 32-Bit Single-Core
Speed: 64MHz
Connectivity: CANbus, I2C, LINbus, QSPI, SCI, SPI
Peripherals: DMA, LCD, POR, PWM, WDT
Number of I/O: 133
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

패키지: -

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MPC5554MVR80

NXP

IC

Core Processor: e200z6
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.35V ~ 5.25V
Data Converters: A/D 40x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Supplier Device Package: 416-PBGA (27x27)

패키지: -

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TJR1463ATK-0Z

NXP

IC 14HVSON

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)

패키지: -

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FC32K146UAT0VLLR

NXP

S32K144 32-BIT MCU, ARM CORTEX-M

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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