페이지 519 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BUK762R6-40E/GFJ	NXP	MOSFET N-CH D2PAK Transistor Type: - Current - Collector (Ic) (Max): - Voltage - Collector Emitter Breakdown (Max): - Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): - DC Current Gain (hFE) (Min) @ Ic, Vce: - Power - Max: - Frequency - Transition: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고3,200
PVR100AZ-B3V0,115	NXP	TRANS NPN 45V 0.1A SOT223 Transistor Type: NPN + Zener Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 45V Vce Saturation (Max) @ Ib, Ic: - Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V Power - Max: 550mW Frequency - Transition: - Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-261-4, TO-261AA Supplier Device Package: SOT-223	패키지: TO-261-4, TO-261AA	재고5,200
PBSS3515E,135	NXP	TRANS PNP 15V 0.5A SC75 Transistor Type: PNP Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 15V Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V Power - Max: 250mW Frequency - Transition: 280MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	패키지: SC-75, SOT-416	재고5,072
DC6M501X6/18S,135	NXP	IC REG BCK 1.8V 0.5A SYNC 6WLCSP Function: Step-Down Output Configuration: Positive Topology: Buck Output Type: Fixed Number of Outputs: 1 Voltage - Input (Min): 2.3V Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.8V Voltage - Output (Max): - Current - Output: 500mA Frequency - Switching: 6MHz Synchronous Rectifier: Yes Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 6-XFBGA, WLCSP Supplier Device Package: 6-WLCSP (1.36x0.96)	패키지: 6-XFBGA, WLCSP	재고6,816
IP4770CZ16,118	NXP	IC VGA INTERFACE 16-SSOP Type: Signal Conditioner Applications: Graphic Cards, VGA Interfaces Mounting Type: Surface Mount Package / Case: 16-SSOP (0.154", 3.90mm Width) Supplier Device Package: 16-SSOP	패키지: 16-SSOP (0.154", 3.90mm Width)	재고110,376
SA58632BS,118	NXP	IC AMP AUDIO 2.2W STER 20HVQFN Type: Class AB Output Type: 2-Channel (Stereo) Max Output Power x Channels @ Load: 2.2W x 2 @ 8 Ohm Voltage - Supply: 2.2 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: 20-HVQFN (5x6) Package / Case: 20-VQFN Exposed Pad	패키지: 20-VQFN Exposed Pad	재고4,240
SC16C850LIET,115	NXP	IC UART SINGLE W/FIFO 36TFBGA Features: - Number of Channels: 1, UART FIFO's: 128 Byte Protocol: RS485 Data Rate (Max): 5Mbps Voltage - Supply: 1.8V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 36-TFBGA Supplier Device Package: 36-TFBGA (3.5x3.5)	패키지: 36-TFBGA	재고7,760
PCA9555HF,118	NXP	IC I/O EXPANDER I2C 16B 24HWQFN Number of I/O: 16 Interface: I2C, SMBus Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 10mA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-WFQFN Exposed Pad Supplier Device Package: 24-HWQFN (4x4)	패키지: 24-WFQFN Exposed Pad	재고3,360
UDA1342TS/N1,518	NXP	IC AUDIO CODEC 24BIT 28SSOP Type: Stereo Audio Data Interface: Serial Resolution (Bits): 24 b Number of ADCs / DACs: 4 / 2 Sigma Delta: No S/N Ratio, ADCs / DACs (db) Typ: 100 / 100 Dynamic Range, ADCs / DACs (db) Typ: - Voltage - Supply, Analog: 2.7 V ~ 3.6 V Voltage - Supply, Digital: 2.7 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 28-SSOP (0.209", 5.30mm Width) Supplier Device Package: 28-SSOP	패키지: 28-SSOP (0.209", 5.30mm Width)	재고6,016
P1022NXN2EFB	NXP	IC MPU Q OR IQ 1.055GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.055GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고5,904
MC7448VU600ND	NXP	IC MPU MPC74XX 600MHZ 360FCCBGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-CBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	패키지: 360-CBGA, FCCBGA	재고6,000
KXPC8255CVVIFBC	NXP	IC MPU MPC82XX 200MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 200MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	패키지: 480-LBGA	재고2,944
KMPC8271CVRTIEA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	패키지: 516-BBGA	재고6,880
MPC8255ACZUMHBB	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	패키지: 480-LBGA	재고7,668
MC9S08SV16CBM	NXP	IC MCU 8BIT 16KB FLASH 32SDIP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 30 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-SDIP (0.400", 10.16mm) Supplier Device Package: 32-SDIP	패키지: 32-SDIP (0.400", 10.16mm)	재고6,240
MC68HC711E20CFN2	NXP	IC MCU 8BIT 20KB OTP 52PLCC Core Processor: HC11 Core Size: 8-Bit Speed: 2MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 52-LCC (J-Lead) Supplier Device Package: 52-PLCC (19.1x19.1)	패키지: 52-LCC (J-Lead)	재고14,412
LPC1114FHN33/203,5	NXP	IC MCU 32BIT 32KB FLASH 33HVQFN Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 28 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VQFN Exposed Pad Supplier Device Package: 32-HVQFN (7x7)	패키지: 32-VQFN Exposed Pad	재고7,872
MC9S08DV32ACLF	NXP	IC MCU 8BIT 32KB FLASH 48LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고17,424
MM908E625ACPEKR2	NXP	IC QUAD HALF-BRIDGE 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	패키지: 54-SOIC (0.295", 7.50mm Width) Exposed Pad	재고4,448
SAA7709H/N105,557	NXP	IC DSP CAR RADIO 80QFP Type: Car Signal Processor Interface: I2C, I2S, LSB, SPDIF Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: 3.30V Voltage - Core: 3.30V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 80-BQFP Supplier Device Package: 80-PQFP (14x20)	패키지: 80-BQFP	재고5,328
PCKEP14D,112	NXP	IC CLK BUFFER 2:5 2GHZ 20SO Type: Fanout Buffer (Distribution), Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:5 Differential - Input:Output: Yes/Yes Input: ECL, HSTL, LVDS, PECL Output: PECL Frequency - Max: 2GHz Voltage - Supply: 2.375 V ~ 3.8 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	패키지: 20-SOIC (0.295", 7.50mm Width)	재고4,784
LS1043AXN8MQB	NXP	QORIQ 4XCPU 64-BIT ARM ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,816
LS1012AXN7HKB	NXP	LS1012A XT 800MHZ RV2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,228
MCIMX283DVM4C	NXP	IC MPU I.MX28 454MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 454MHz Co-Processors/DSP: Data; DCP RAM Controllers: LVDDR, LVDDR2, DDR2 Graphics Acceleration: No Display & Interface Controllers: Keyboard, LCD, Touchscreen Ethernet: 10/100Mbps (1) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -20°C ~ 70°C (TA) Security Features: Boot Security, Cryptography, Hardware ID Package / Case: 289-LFBGA Supplier Device Package: 289-MAPBGA (14x14)	패키지: 289-LFBGA	재고4,192
CBTL04083BBS-558	NXP	3.3 V, 4 DIFFERENTIAL CHANNEL, 2 Applications: DisplayPort, PCIe, USB Multiplexer/Demultiplexer Circuit: 2:1 Switch Circuit: SPDT Number of Channels: 4 On-State Resistance (Max): 6Ohm (Typ) Voltage - Supply, Single (V+): 3V ~ 3.6V Voltage - Supply, Dual (V±): - -3db Bandwidth: 8GHz Features: Bi-Directional, SATA Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 42-VFQFN Exposed Pad Supplier Device Package: 42-HVQFN (3.5x9)	패키지: -	Request a Quote
MPF5024AMBA0ES	NXP	POWER MANAGEMENT IC, PRE-PROG, 4 Applications: High Performance i.MX 8, S32x Processor Based Current - Supply: 10µA Voltage - Supply: 2.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 40-VFQFN Exposed Pad Supplier Device Package: 40-HVQFN (6x6)	패키지: -	재고1,470
NAFE73388B40BSK	NXP	UNIVERSAL 25 V 8-INPUT LOW POWER Number of Bits: 24 Number of Channels: 8 Power (Watts): 160 mW Voltage - Supply, Analog: 3V ~ 3.6V Voltage - Supply, Digital: 3V ~ 3.6V Package / Case: 64-VFQFN Exposed Pad Supplier Device Package: 64-HVQFN (9x9)	패키지: -	Request a Quote
S32G254AABK1VUCR	NXP	S32G254A ARM CORTEX-M7 AND -A53, Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1/2.5Gbps (4) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	패키지: -	Request a Quote

BUK762R6-40E/GFJ

NXP

MOSFET N-CH D2PAK

Transistor Type: -
Current - Collector (Ic) (Max): -
Voltage - Collector Emitter Breakdown (Max): -
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): -
DC Current Gain (hFE) (Min) @ Ic, Vce: -
Power - Max: -
Frequency - Transition: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고3,200

PVR100AZ-B3V0,115

NXP

TRANS NPN 45V 0.1A SOT223

Transistor Type: NPN + Zener
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 45V
Vce Saturation (Max) @ Ib, Ic: -
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 160 @ 100mA, 1V
Power - Max: 550mW
Frequency - Transition: -
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Supplier Device Package: SOT-223

패키지: TO-261-4, TO-261AA

재고5,200

PBSS3515E,135

NXP

TRANS PNP 15V 0.5A SC75

Transistor Type: PNP
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 15V
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Power - Max: 250mW
Frequency - Transition: 280MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

패키지: SC-75, SOT-416

재고5,072

DC6M501X6/18S,135

NXP

IC REG BCK 1.8V 0.5A SYNC 6WLCSP

Function: Step-Down
Output Configuration: Positive
Topology: Buck
Output Type: Fixed
Number of Outputs: 1
Voltage - Input (Min): 2.3V
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.8V
Voltage - Output (Max): -
Current - Output: 500mA
Frequency - Switching: 6MHz
Synchronous Rectifier: Yes
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 6-XFBGA, WLCSP
Supplier Device Package: 6-WLCSP (1.36x0.96)

패키지: 6-XFBGA, WLCSP

재고6,816

IP4770CZ16,118

NXP

IC VGA INTERFACE 16-SSOP

Type: Signal Conditioner
Applications: Graphic Cards, VGA Interfaces
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.154", 3.90mm Width)
Supplier Device Package: 16-SSOP

패키지: 16-SSOP (0.154", 3.90mm Width)

재고110,376

SA58632BS,118

NXP

IC AMP AUDIO 2.2W STER 20HVQFN

Type: Class AB
Output Type: 2-Channel (Stereo)
Max Output Power x Channels @ Load: 2.2W x 2 @ 8 Ohm
Voltage - Supply: 2.2 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 20-HVQFN (5x6)
Package / Case: 20-VQFN Exposed Pad

패키지: 20-VQFN Exposed Pad

재고4,240

SC16C850LIET,115

NXP

IC UART SINGLE W/FIFO 36TFBGA

Features: -
Number of Channels: 1, UART
FIFO's: 128 Byte
Protocol: RS485
Data Rate (Max): 5Mbps
Voltage - Supply: 1.8V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 36-TFBGA
Supplier Device Package: 36-TFBGA (3.5x3.5)

패키지: 36-TFBGA

재고7,760

PCA9555HF,118

NXP

IC I/O EXPANDER I2C 16B 24HWQFN

Number of I/O: 16
Interface: I2C, SMBus
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 10mA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-WFQFN Exposed Pad
Supplier Device Package: 24-HWQFN (4x4)

패키지: 24-WFQFN Exposed Pad

재고3,360

UDA1342TS/N1,518

NXP

IC AUDIO CODEC 24BIT 28SSOP

Type: Stereo Audio
Data Interface: Serial
Resolution (Bits): 24 b
Number of ADCs / DACs: 4 / 2
Sigma Delta: No
S/N Ratio, ADCs / DACs (db) Typ: 100 / 100
Dynamic Range, ADCs / DACs (db) Typ: -
Voltage - Supply, Analog: 2.7 V ~ 3.6 V
Voltage - Supply, Digital: 2.7 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 28-SSOP

패키지: 28-SSOP (0.209", 5.30mm Width)

재고6,016

P1022NXN2EFB

NXP

IC MPU Q OR IQ 1.055GHZ 689TBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.055GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고5,904

MC7448VU600ND

NXP

IC MPU MPC74XX 600MHZ 360FCCBGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-CBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

패키지: 360-CBGA, FCCBGA

재고6,000

KXPC8255CVVIFBC

NXP

IC MPU MPC82XX 200MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 200MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

재고2,944

KMPC8271CVRTIEA

NXP

IC MPU MPC82XX 400MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

패키지: 516-BBGA

재고6,880

MPC8255ACZUMHBB

NXP

IC MPU MPC82XX 266MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

재고7,668

MC9S08SV16CBM

NXP

IC MCU 8BIT 16KB FLASH 32SDIP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 30
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-SDIP (0.400", 10.16mm)
Supplier Device Package: 32-SDIP

패키지: 32-SDIP (0.400", 10.16mm)

재고6,240

MC68HC711E20CFN2

NXP

IC MCU 8BIT 20KB OTP 52PLCC

Core Processor: HC11
Core Size: 8-Bit
Speed: 2MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: 20KB (20K x 8)
Program Memory Type: OTP
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 52-LCC (J-Lead)
Supplier Device Package: 52-PLCC (19.1x19.1)

패키지: 52-LCC (J-Lead)

재고14,412

LPC1114FHN33/203,5

NXP

IC MCU 32BIT 32KB FLASH 33HVQFN

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 28
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VQFN Exposed Pad
Supplier Device Package: 32-HVQFN (7x7)

패키지: 32-VQFN Exposed Pad

재고7,872

MC9S08DV32ACLF

NXP

IC MCU 8BIT 32KB FLASH 48LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고17,424

MM908E625ACPEKR2

NXP

IC QUAD HALF-BRIDGE 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 13
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-SOIC (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOIC

패키지: 54-SOIC (0.295", 7.50mm Width) Exposed Pad

재고4,448

SAA7709H/N105,557

NXP

IC DSP CAR RADIO 80QFP

Type: Car Signal Processor
Interface: I2C, I2S, LSB, SPDIF
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 80-BQFP
Supplier Device Package: 80-PQFP (14x20)

패키지: 80-BQFP

재고5,328

PCKEP14D,112

NXP

IC CLK BUFFER 2:5 2GHZ 20SO

Type: Fanout Buffer (Distribution), Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 2:5
Differential - Input:Output: Yes/Yes
Input: ECL, HSTL, LVDS, PECL
Output: PECL
Frequency - Max: 2GHz
Voltage - Supply: 2.375 V ~ 3.8 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

패키지: 20-SOIC (0.295", 7.50mm Width)

재고4,784

LS1043AXN8MQB

NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,816

LS1012AXN7HKB

NXP

LS1012A XT 800MHZ RV2

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,228

MCIMX283DVM4C

NXP

IC MPU I.MX28 454MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 454MHz
Co-Processors/DSP: Data; DCP
RAM Controllers: LVDDR, LVDDR2, DDR2
Graphics Acceleration: No
Display & Interface Controllers: Keyboard, LCD, Touchscreen
Ethernet: 10/100Mbps (1)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -20°C ~ 70°C (TA)
Security Features: Boot Security, Cryptography, Hardware ID
Package / Case: 289-LFBGA
Supplier Device Package: 289-MAPBGA (14x14)

패키지: 289-LFBGA

재고4,192

CBTL04083BBS-558

NXP

3.3 V, 4 DIFFERENTIAL CHANNEL, 2

Applications: DisplayPort, PCIe, USB
Multiplexer/Demultiplexer Circuit: 2:1
Switch Circuit: SPDT
Number of Channels: 4
On-State Resistance (Max): 6Ohm (Typ)
Voltage - Supply, Single (V+): 3V ~ 3.6V
Voltage - Supply, Dual (V±): -
-3db Bandwidth: 8GHz
Features: Bi-Directional, SATA
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 42-VFQFN Exposed Pad
Supplier Device Package: 42-HVQFN (3.5x9)

패키지: -

Request a Quote

MPF5024AMBA0ES

NXP

POWER MANAGEMENT IC, PRE-PROG, 4

Applications: High Performance i.MX 8, S32x Processor Based
Current - Supply: 10µA
Voltage - Supply: 2.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 40-VFQFN Exposed Pad
Supplier Device Package: 40-HVQFN (6x6)

패키지: -

재고1,470

NAFE73388B40BSK

NXP

UNIVERSAL 25 V 8-INPUT LOW POWER

Number of Bits: 24
Number of Channels: 8
Power (Watts): 160 mW
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Package / Case: 64-VFQFN Exposed Pad
Supplier Device Package: 64-HVQFN (9x9)

패키지: -

Request a Quote

S32G254AABK1VUCR

NXP

S32G254A ARM CORTEX-M7 AND -A53,

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 3 Core, 64-Bit/2 Core, 32-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1/2.5Gbps (4)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.2V, 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

패키지: -

Request a Quote