페이지 599 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PDTC144TS,126	NXP	TRANS PREBIAS NPN 500MW TO92-3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 47k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	재고4,352
PDTC115TS,126	NXP	TRANS PREBIAS NPN 500MW TO92-3 Transistor Type: NPN - Pre-Biased Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 50V Resistor - Base (R1) (Ohms): 100k Resistor - Emitter Base (R2) (Ohms): - DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA Current - Collector Cutoff (Max): 1µA Frequency - Transition: - Power - Max: 500mW Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	재고3,488
BY329X-1200,127	NXP	DIODE GEN PURP 1.2KV 8A TO220F Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 1200V Current - Average Rectified (Io): 8A Voltage - Forward (Vf) (Max) @ If: 1.85V @ 20A Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 145ns Current - Reverse Leakage @ Vr: 1mA @ 1000V Capacitance @ Vr, F: - Mounting Type: Through Hole Package / Case: TO-220-2 Full Pack, Isolated Tab Supplier Device Package: TO-220FP Operating Temperature - Junction: 150°C (Max)	패키지: TO-220-2 Full Pack, Isolated Tab	재고6,032
1PS184,135	NXP	DIODE ARRAY GP 80V 215MA SMT3 Diode Configuration: 1 Pair Common Cathode Diode Type: Standard Voltage - DC Reverse (Vr) (Max): 80V Current - Average Rectified (Io) (per Diode): 215mA (DC) Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA Speed: Fast Recovery =< 500ns, > 200mA (Io) Reverse Recovery Time (trr): 4ns Current - Reverse Leakage @ Vr: 500nA @ 80V Operating Temperature - Junction: 150°C (Max) Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고2,208
TEA19162CT/1J	NXP	IC CTRLR PFC 8SOIC Mode: - Frequency - Switching: - Current - Startup: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,384
CBTS3384PW,112	NXP	IC BUS SWITCH 10BIT 24TSSOP Type: Bus Switch Circuit: 5 x 1:1 Independent Circuits: 2 Current - Output High, Low: - Voltage Supply Source: Single Supply Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	패키지: 24-TSSOP (0.173", 4.40mm Width)	재고7,424
74ALVT162241DL,118	NXP	IC BUFF DVR TRI-ST 16BIT 48SSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 48-SSOP	패키지: 48-BSSOP (0.295", 7.50mm Width)	재고3,616
UJA1066TW/3V3/T,51	NXP	IC CAN/LIN FAIL-SAFE HS 32HTSSOP Applications: Networking Interface: SPI Voltage - Supply: 3.3 V ~ 5 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	재고7,152
SC16IS762IBS,157	NXP	IC DUAL UART 64BYTE 32HVQFN Protocol: RS232, RS485 Function: Controller Interface: I2C, SPI, UART Standards: - Voltage - Supply: 2.5V, 3.3V Current - Supply: 2mA Operating Temperature: -40°C ~ 95°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고2,560
P1013PSN2LFA	NXP	IC MPU Q OR IQ 1.067GHZ 689TBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: LCD Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고3,072
MPC8547VTAUJB	NXP	IC MPU MPC85XX 1.333GHZ 783BGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SPE RAM Controllers: DDR, DDR2, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,360
MPC755CPX350LE	NXP	IC MPU MPC7XX 350MHZ 360FCBGA Core Processor: PowerPC Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 360-BBGA, FCCBGA Supplier Device Package: 360-FCPBGA (25x25)	패키지: 360-BBGA, FCCBGA	재고6,768
MPC5200CVR266	NXP	IC MPU MPC52XX 266MHZ 272BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1) SATA: - USB: USB 1.1 (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27x27)	패키지: 272-BBGA	재고5,904
P1021NXE2FFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고5,328
MC9S12DJ128BCFU	NXP	IC MCU 16BIT 128KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 59 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고4,768
MCF5270VM100	NXP	IC MCU 32BIT ROMLESS 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 61 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V Data Converters: - Oscillator Type: External Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-LBGA	재고4,640
KMSC8122TVT6400	NXP	DSP 16BIT QUAD CORE 431FCBGA Type: SC140 Core Interface: DSI, Ethernet, RS-232 Clock Rate: 400MHz Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 431-BFBGA, FCBGA Supplier Device Package: 431-FCPBGA (20x20)	패키지: 431-BFBGA, FCBGA	재고5,872
MPL115A1	NXP	IC BAROMETER SPI DGTL MINI 8LGA Pressure Type: Absolute Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa) Output Type: SPI Output: 10 b Accuracy: ±0.145 PSI (±1 kPa) Voltage - Supply: 2.375 V ~ 5.5 V Port Size: - Port Style: No Port Features: Shutdown Mode, Standby Mode Termination Style: PCB Maximum Pressure: 145.04 PSI (1000 kPa) Operating Temperature: -40°C ~ 105°C Package / Case: 8-TLGA Supplier Device Package: 8-LGA	패키지: 8-TLGA	재고6,642
NXQ1TXH5/101J	NXP	IC WIRELESS PWR TX 32HVQFN Frequency: 110kHz ~ 205kHz Applications: General Purpose Modulation or Protocol: - Data Rate (Max): - Power - Output: - Current - Transmitting: 20mA Data Interface: I2C Antenna Connector: - Memory Size: - Features: - Voltage - Supply: 1.8V Operating Temperature: -20°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad	패키지: 32-VFQFN Exposed Pad	재고7,866
MC13233C	NXP	IC RF TXRX+MCU 802.15.4 48-VFQFN Type: TxRx + MCU RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: O-QPSK Frequency: 2.4GHz Data Rate (Max): 250kbps Power - Output: 2dBm Sensitivity: -94dBm Memory Size: 82kB Flash, 5kB RAM Serial Interfaces: I2C, SPI, UART GPIO: 32 Voltage - Supply: 1.8 V ~ 3.6 V Current - Receiving: 22.3mA ~ 34.2mA Current - Transmitting: 26.6mA Operating Temperature: -40°C ~ 85°C Package / Case: 48-VFQFN Exposed Pad	패키지: 48-VFQFN Exposed Pad	재고6,426
TJF1052IT/5Y	NXP	DGTL ISOLATOR 5KV 2CH CAN 16SO Technology: Capacitive Coupling Type: CAN Isolated Power: No Number of Channels: 2 Inputs - Side 1/Side 2: 1/1 Channel Type: Unidirectional Voltage - Isolation: 5000Vrms Common Mode Transient Immunity (Min): 20kV/µs Data Rate: 2Mbps Propagation Delay tpLH / tpHL (Max): - Pulse Width Distortion (Max): - Rise / Fall Time (Typ): - Voltage - Supply: 3 V ~ 5.25 V Operating Temperature: -40°C ~ 105°C Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.295", 7.50mm Width)	재고8,442
S912XEG384F0VAL	NXP	16-BIT MCU S12X CORE 384KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 91 Program Memory Size: 384KB (384K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 24K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고6,448
S912ZVC12F0MKH	NXP	MAGNIV 16-BIT MCU S12Z CORE 12 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 42 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 16x10b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Exposed Pad Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP Exposed Pad	재고2,768
MC56F82733MFM	NXP	32-BIT DSC 56800EX CORE 48KB F Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: I²C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 26 Program Memory Size: 48KB (24K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 6x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고7,472
S9S12VR48AAVLCR	NXP	IC MCU 16BIT 48KB FLASH 32LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 48KB (48K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V Data Converters: A/D 2x10b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: -	Request a Quote
SAF4000EL-101S53CK	NXP	SOFTWARE DEFINED RADIO Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
MC9S08PB8MTJ	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LINbus, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 12x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: -	재고2,325
FS32K146HRT0MLLT	NXP	IC MCU 32BIT 1MB FLASH 100LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 80MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: -	Request a Quote

PDTC144TS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 47k
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

재고4,352

PDTC115TS,126

NXP

TRANS PREBIAS NPN 500MW TO92-3

Transistor Type: NPN - Pre-Biased
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Resistor - Base (R1) (Ohms): 100k
Resistor - Emitter Base (R2) (Ohms): -
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 1mA, 5V
Vce Saturation (Max) @ Ib, Ic: 150mV @ 250µA, 5mA
Current - Collector Cutoff (Max): 1µA
Frequency - Transition: -
Power - Max: 500mW
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

재고3,488

BY329X-1200,127

NXP

DIODE GEN PURP 1.2KV 8A TO220F

Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 1200V
Current - Average Rectified (Io): 8A
Voltage - Forward (Vf) (Max) @ If: 1.85V @ 20A
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 145ns
Current - Reverse Leakage @ Vr: 1mA @ 1000V
Capacitance @ Vr, F: -
Mounting Type: Through Hole
Package / Case: TO-220-2 Full Pack, Isolated Tab
Supplier Device Package: TO-220FP
Operating Temperature - Junction: 150°C (Max)

패키지: TO-220-2 Full Pack, Isolated Tab

재고6,032

1PS184,135

NXP

DIODE ARRAY GP 80V 215MA SMT3

Diode Configuration: 1 Pair Common Cathode
Diode Type: Standard
Voltage - DC Reverse (Vr) (Max): 80V
Current - Average Rectified (Io) (per Diode): 215mA (DC)
Voltage - Forward (Vf) (Max) @ If: 1.2V @ 100mA
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 4ns
Current - Reverse Leakage @ Vr: 500nA @ 80V
Operating Temperature - Junction: 150°C (Max)
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고2,208

TEA19162CT/1J

NXP

IC CTRLR PFC 8SOIC

Mode: -
Frequency - Switching: -
Current - Startup: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,384

CBTS3384PW,112

NXP

IC BUS SWITCH 10BIT 24TSSOP

Type: Bus Switch
Circuit: 5 x 1:1
Independent Circuits: 2
Current - Output High, Low: -
Voltage Supply Source: Single Supply
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

패키지: 24-TSSOP (0.173", 4.40mm Width)

재고7,424

74ALVT162241DL,118

NXP

IC BUFF DVR TRI-ST 16BIT 48SSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 48-SSOP

패키지: 48-BSSOP (0.295", 7.50mm Width)

재고3,616

UJA1066TW/3V3/T,51

NXP

IC CAN/LIN FAIL-SAFE HS 32HTSSOP

Applications: Networking
Interface: SPI
Voltage - Supply: 3.3 V ~ 5 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

재고7,152

SC16IS762IBS,157

NXP

IC DUAL UART 64BYTE 32HVQFN

Protocol: RS232, RS485
Function: Controller
Interface: I2C, SPI, UART
Standards: -
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Operating Temperature: -40°C ~ 95°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고2,560

P1013PSN2LFA

NXP

IC MPU Q OR IQ 1.067GHZ 689TBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: LCD
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고3,072

MPC8547VTAUJB

NXP

IC MPU MPC85XX 1.333GHZ 783BGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SPE
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,360

MPC755CPX350LE

NXP

IC MPU MPC7XX 350MHZ 360FCBGA

Core Processor: PowerPC
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 350MHz
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BBGA, FCCBGA
Supplier Device Package: 360-FCPBGA (25x25)

패키지: 360-BBGA, FCCBGA

재고6,768

MPC5200CVR266

NXP

IC MPU MPC52XX 266MHZ 272BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 1.1 (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 272-BBGA
Supplier Device Package: 272-PBGA (27x27)

패키지: 272-BBGA

재고5,904

P1021NXE2FFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고5,328

MC9S12DJ128BCFU

NXP

IC MCU 16BIT 128KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 59
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고4,768

MCF5270VM100

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 100MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 61
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 1.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-LBGA

재고4,640

KMSC8122TVT6400

NXP

DSP 16BIT QUAD CORE 431FCBGA

Type: SC140 Core
Interface: DSI, Ethernet, RS-232
Clock Rate: 400MHz
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 431-BFBGA, FCBGA
Supplier Device Package: 431-FCPBGA (20x20)

패키지: 431-BFBGA, FCBGA

재고5,872

MPL115A1

NXP

IC BAROMETER SPI DGTL MINI 8LGA

Pressure Type: Absolute
Operating Pressure: 7.25 PSI ~ 16.68 PSI (50 kPa ~ 115 kPa)
Output Type: SPI
Output: 10 b
Accuracy: ±0.145 PSI (±1 kPa)
Voltage - Supply: 2.375 V ~ 5.5 V
Port Size: -
Port Style: No Port
Features: Shutdown Mode, Standby Mode
Termination Style: PCB
Maximum Pressure: 145.04 PSI (1000 kPa)
Operating Temperature: -40°C ~ 105°C
Package / Case: 8-TLGA
Supplier Device Package: 8-LGA

패키지: 8-TLGA

재고6,642

NXQ1TXH5/101J

NXP

IC WIRELESS PWR TX 32HVQFN

Frequency: 110kHz ~ 205kHz
Applications: General Purpose
Modulation or Protocol: -
Data Rate (Max): -
Power - Output: -
Current - Transmitting: 20mA
Data Interface: I2C
Antenna Connector: -
Memory Size: -
Features: -
Voltage - Supply: 1.8V
Operating Temperature: -20°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad

패키지: 32-VFQFN Exposed Pad

재고7,866

MC13233C

NXP

IC RF TXRX+MCU 802.15.4 48-VFQFN

Type: TxRx + MCU
RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: O-QPSK
Frequency: 2.4GHz
Data Rate (Max): 250kbps
Power - Output: 2dBm
Sensitivity: -94dBm
Memory Size: 82kB Flash, 5kB RAM
Serial Interfaces: I2C, SPI, UART
GPIO: 32
Voltage - Supply: 1.8 V ~ 3.6 V
Current - Receiving: 22.3mA ~ 34.2mA
Current - Transmitting: 26.6mA
Operating Temperature: -40°C ~ 85°C
Package / Case: 48-VFQFN Exposed Pad

패키지: 48-VFQFN Exposed Pad

재고6,426

TJF1052IT/5Y

NXP

DGTL ISOLATOR 5KV 2CH CAN 16SO

Technology: Capacitive Coupling
Type: CAN
Isolated Power: No
Number of Channels: 2
Inputs - Side 1/Side 2: 1/1
Channel Type: Unidirectional
Voltage - Isolation: 5000Vrms
Common Mode Transient Immunity (Min): 20kV/µs
Data Rate: 2Mbps
Propagation Delay tpLH / tpHL (Max): -
Pulse Width Distortion (Max): -
Rise / Fall Time (Typ): -
Voltage - Supply: 3 V ~ 5.25 V
Operating Temperature: -40°C ~ 105°C
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.295", 7.50mm Width)

재고8,442

S912XEG384F0VAL

NXP

16-BIT MCU S12X CORE 384KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 91
Program Memory Size: 384KB (384K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 24K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고6,448

S912ZVC12F0MKH

NXP

MAGNIV 16-BIT MCU S12Z CORE 12

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 42
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 16x10b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP Exposed Pad
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP Exposed Pad

재고2,768

MC56F82733MFM

NXP

32-BIT DSC 56800EX CORE 48KB F

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 100MHz
Connectivity: I²C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 26
Program Memory Size: 48KB (24K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 16
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 6x12b; D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고7,472

S9S12VR48AAVLCR

NXP

IC MCU 16BIT 48KB FLASH 32LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 48KB (48K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.5V ~ 40V
Data Converters: A/D 2x10b
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: -

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SAF4000EL-101S53CK

NXP

SOFTWARE DEFINED RADIO

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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MC9S08PB8MTJ

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 12x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: -

재고2,325

FS32K146HRT0MLLT

NXP

IC MCU 32BIT 1MB FLASH 100LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 80MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: -

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