페이지 622 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PBSS2540E,115	NXP	TRANS NPN 40V 0.5A SC75 Transistor Type: NPN Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V Power - Max: 250mW Frequency - Transition: 450MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	패키지: SC-75, SOT-416	재고4,304
PZM11NB2A,115	NXP	DIODE ZENER 11V 220MW SMT3 Voltage - Zener (Nom) (Vz): 11V Tolerance: ±2% Power - Max: 220mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 8V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: - Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	패키지: TO-236-3, SC-59, SOT-23-3	재고6,960
SC16C654BIEC,528	NXP	IC QUAD UART 64BYTE 64LFBGA Features: - Number of Channels: 4, QUART FIFO's: 64 Byte Protocol: - Data Rate (Max): 5Mbps Voltage - Supply: 2.5V, 3.3V, 5V With Auto Flow Control: Yes With IrDA Encoder/Decoder: Yes With False Start Bit Detection: Yes With Modem Control: Yes Mounting Type: Surface Mount Package / Case: 64-LFBGA Supplier Device Package: 64-LFBGA (6x6)	패키지: 64-LFBGA	재고4,128
SC16IS752IBS,128	NXP	IC UART DUAL I2C/SPI 32-HVQFN Protocol: RS232, RS485 Function: Controller Interface: I2C, SPI, UART Standards: - Voltage - Supply: 2.5V, 3.3V Current - Supply: 2mA Operating Temperature: -40°C ~ 95°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고6,448
MC8640THX1067NE	NXP	IC MPU MPC86XX 1.067GHZ 994BGA Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.067GHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 994-BCBGA, FCCBGA Supplier Device Package: 994-FCCBGA (33x33)	패키지: 994-BCBGA, FCCBGA	재고3,680
MPC8358ZUAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	패키지: 740-LBGA	재고7,312
MPC8280CVVQLDA	NXP	IC MPU MPC82XX 333MHZ 408TBGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 333MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	패키지: 480-LBGA	재고6,048
SPC5673KFF0VMM1	NXP	IC MCU 32BIT 1MB FLASH 257MAPBGA Core Processor: e200z7d Core Size: 32-Bit Speed: 150MHz Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: - Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V Data Converters: A/D 22x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 257-LFBGA Supplier Device Package: 257-MAPBGA (14x14)	패키지: 257-LFBGA	재고18,984
MC68HC908SR12CB	NXP	IC MCU 8BIT 12KB FLASH 42PSDIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: I2C, SCI Peripherals: LVD, POR, PWM, Temp Sensor Number of I/O: 29 Program Memory Size: 12KB (12K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 11x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 42-SDIP (0.600", 15.24mm) Supplier Device Package: 42-PSDIP	패키지: 42-SDIP (0.600", 15.24mm)	재고114,168
MMC2113CFCVF33	NXP	IC MCU 32BIT 128KB FLASH 196BGA Core Processor: M210 Core Size: 32-Bit Speed: 33MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-LBGA	재고5,712
MK64FN1M0CAJ12R	NXP	IC MCU 32BIT 1MB FLASH 142WLCSP Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 120MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 100 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 41x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 142-UFBGA, WLCSP Supplier Device Package: 142-WLCSP (4.83x5.58)	패키지: 142-UFBGA, WLCSP	재고6,976
MK10DN512ZVMC10	NXP	IC MCU 32BIT 512KB FLASH 121BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 90 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 42x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 121-LFBGA Supplier Device Package: 121-MAPBGA (8x8)	패키지: 121-LFBGA	재고7,232
MC56F8367MPYE	NXP	IC MCU 16BIT 512KB FLASH 160LQFP Core Processor: 56800E Core Size: 16-Bit Speed: 60MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Number of I/O: 76 Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 18K x 16 Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V Data Converters: A/D 16x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 160-LQFP Supplier Device Package: 160-LQFP (24x24)	패키지: 160-LQFP	재고7,424
MM912F634BV1AER2	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (32 KB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	패키지: 48-LQFP Exposed Pad	재고6,016
SPAKDSP321VL240	NXP	IC DSP 24BIT 240MHZ 196-MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 240MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 576kB Voltage - I/O: 3.30V Voltage - Core: 1.60V Operating Temperature: -40°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 196-BGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-BGA	재고6,128
KTY82/250,215	NXP	IC TMEP SENSOR SOT23 Resistance in Ohms @ 25°C: 2k Resistance Tolerance: - Operating Temperature: -55°C ~ 150°C Power - Max: - Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: TO-236AB (SOT23)	패키지: TO-236-3, SC-59, SOT-23-3	재고3,762
SX1534PKVWT1	NXP	ACCELEROMETER Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고8,784
MMA6222EGR2	NXP	ACCELEROMETER 20G ANALOG 20SOIC Type: Analog Axis: X, Y Acceleration Range: ±20g Sensitivity (LSB/g): - Sensitivity (mV/g): 23.40mV/V/g Bandwidth: 3kHz Output Type: Analog Voltage Voltage - Supply: 3.15 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SOIC	패키지: 20-SOIC (0.295", 7.50mm Width)	재고2,556
MFRX85201HD/D4110:	NXP	MOD SECURITY READER CUST 48HLQFN Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: - Voltage - Supply: 3.3 V ~ 5 V Operating Temperature: -25°C ~ 85°C Package / Case: 48-LFQFN Exposed Pad Supplier Device Package: 48-HLQFN (7x7)	패키지: 48-LFQFN Exposed Pad	재고4,410
PN5120A0HN1/C1,157	NXP	IC TRANSMISSION MOD 32-HVQFN Type: RFID Reader/Transponder Frequency: 13.56MHz Standards: FeliCa, ISO 14443, MIFARE, NFC Interface: I2C, SPI, UART Voltage - Supply: 2.5 V ~ 3.6 V Operating Temperature: -40°C ~ 90°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고4,194
BGA3031X	NXP	IC MMIC 20HVQFN Frequency: 5MHz ~ 85MHz P1dB: - Gain: 34dB Noise Figure: 3.5dB RF Type: CATV Voltage - Supply: 5V Current - Supply: 325mA Test Frequency: - Package / Case: 20-VQFN Exposed Pad Supplier Device Package: 20-HVQFN (5x5)	패키지: 20-VQFN Exposed Pad	재고2,862
BGA6489,135	NXP	IC MMIC AMPLIFIER SOT89 Frequency: 500MHz ~ 3.5GHz P1dB: 17dBm (50.1mW) Gain: 16dB Noise Figure: 3.3dB RF Type: PCS, CDPD, Broadcast Television Voltage - Supply: 5.1 V ~ 6 V Current - Supply: 78mA ~ 150mA Test Frequency: 1.95GHz Package / Case: TO-243AA Supplier Device Package: SOT-89-3	패키지: TO-243AA	재고2,016
MCIMX6S6AVM08AD	NXP	I.MX6SOLO ROM PERF ENHAN Core Processor: ARM® Cortex®-A9 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-LFBGA Supplier Device Package: 624-MAPBGA (21x21)	패키지: 624-LFBGA	재고4,176
PS32V234CMN1AVUB	NXP	PRE-QUAL ISP GPU NO CSE1GHZ Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Speed: 1.0GHz, 133MHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU Ethernet: 1 Gbps SATA: - USB: - Voltage - I/O: 1.0V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17x17)	패키지: 621-FBGA, FCBGA	재고7,824
SPC5606BF1VLU6	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 149 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 80K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 29x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 176-LQFP Supplier Device Package: 176-LQFP (24x24)	패키지: 176-LQFP	재고6,900
TJA1128CTK-1Z	NXP	LIN MINI SYSTEM BASIS CHIP WITH Applications: System Basis Chip Interface: SPI Voltage - Supply: 3V ~ 28V Package / Case: 14-VDFN Exposed Pad Supplier Device Package: 14-HVSON (3x4.5) Mounting Type: Surface Mount	패키지: -	재고18,000
MC33FS8435G0ESR2	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	패키지: -	Request a Quote
SAF775CHV-N208Q-AY	NXP	CAR RADIO TUNER & AUDIO DSP Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 176-LQFP Exposed Pad Supplier Device Package: 176-HLQFP (24x24)	패키지: -	Request a Quote

PBSS2540E,115

NXP

TRANS NPN 40V 0.5A SC75

Transistor Type: NPN
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 250mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 100mA, 2V
Power - Max: 250mW
Frequency - Transition: 450MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

패키지: SC-75, SOT-416

재고4,304

PZM11NB2A,115

NXP

DIODE ZENER 11V 220MW SMT3

Voltage - Zener (Nom) (Vz): 11V
Tolerance: ±2%
Power - Max: 220mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 8V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

패키지: TO-236-3, SC-59, SOT-23-3

재고6,960

SC16C654BIEC,528

NXP

IC QUAD UART 64BYTE 64LFBGA

Features: -
Number of Channels: 4, QUART
FIFO's: 64 Byte
Protocol: -
Data Rate (Max): 5Mbps
Voltage - Supply: 2.5V, 3.3V, 5V
With Auto Flow Control: Yes
With IrDA Encoder/Decoder: Yes
With False Start Bit Detection: Yes
With Modem Control: Yes
Mounting Type: Surface Mount
Package / Case: 64-LFBGA
Supplier Device Package: 64-LFBGA (6x6)

패키지: 64-LFBGA

재고4,128

SC16IS752IBS,128

NXP

IC UART DUAL I2C/SPI 32-HVQFN

Protocol: RS232, RS485
Function: Controller
Interface: I2C, SPI, UART
Standards: -
Voltage - Supply: 2.5V, 3.3V
Current - Supply: 2mA
Operating Temperature: -40°C ~ 95°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고6,448

MC8640THX1067NE

NXP

IC MPU MPC86XX 1.067GHZ 994BGA

Core Processor: PowerPC e600
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.067GHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 994-BCBGA, FCCBGA
Supplier Device Package: 994-FCCBGA (33x33)

패키지: 994-BCBGA, FCCBGA

재고3,680

MPC8358ZUAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

패키지: 740-LBGA

재고7,312

MPC8280CVVQLDA

NXP

IC MPU MPC82XX 333MHZ 408TBGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 333MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

재고6,048

SPC5673KFF0VMM1

NXP

IC MCU 32BIT 1MB FLASH 257MAPBGA

Core Processor: e200z7d
Core Size: 32-Bit
Speed: 150MHz
Connectivity: CAN, EBI/EMI, Ethernet, FlexRay, I2C, LIN, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
Data Converters: A/D 22x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 257-LFBGA
Supplier Device Package: 257-MAPBGA (14x14)

패키지: 257-LFBGA

재고18,984

MC68HC908SR12CB

NXP

IC MCU 8BIT 12KB FLASH 42PSDIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: I2C, SCI
Peripherals: LVD, POR, PWM, Temp Sensor
Number of I/O: 29
Program Memory Size: 12KB (12K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 11x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 42-SDIP (0.600", 15.24mm)
Supplier Device Package: 42-PSDIP

패키지: 42-SDIP (0.600", 15.24mm)

재고114,168

MMC2113CFCVF33

NXP

IC MCU 32BIT 128KB FLASH 196BGA

Core Processor: M210
Core Size: 32-Bit
Speed: 33MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-LBGA

재고5,712

MK64FN1M0CAJ12R

NXP

IC MCU 32BIT 1MB FLASH 142WLCSP

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 120MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 100
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 41x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 142-UFBGA, WLCSP
Supplier Device Package: 142-WLCSP (4.83x5.58)

패키지: 142-UFBGA, WLCSP

재고6,976

MK10DN512ZVMC10

NXP

IC MCU 32BIT 512KB FLASH 121BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 90
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 42x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 121-LFBGA
Supplier Device Package: 121-MAPBGA (8x8)

패키지: 121-LFBGA

재고7,232

MC56F8367MPYE

NXP

IC MCU 16BIT 512KB FLASH 160LQFP

Core Processor: 56800E
Core Size: 16-Bit
Speed: 60MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, Temp Sensor, WDT
Number of I/O: 76
Program Memory Size: 512KB (256K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 18K x 16
Voltage - Supply (Vcc/Vdd): 2.25 V ~ 3.6 V
Data Converters: A/D 16x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 160-LQFP
Supplier Device Package: 160-LQFP (24x24)

패키지: 160-LQFP

재고7,424

MM912F634BV1AER2

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

Applications: Automotive
Core Processor: S12
Program Memory Type: FLASH (32 KB)
Controller Series: HCS12
RAM Size: 2K x 8
Interface: LIN, SCI
Number of I/O: 9
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

패키지: 48-LQFP Exposed Pad

재고6,016

SPAKDSP321VL240

NXP

IC DSP 24BIT 240MHZ 196-MAPBGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 240MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Operating Temperature: -40°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 196-BGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-BGA

재고6,128

KTY82/250,215

NXP

IC TMEP SENSOR SOT23

Resistance in Ohms @ 25°C: 2k
Resistance Tolerance: -
Operating Temperature: -55°C ~ 150°C
Power - Max: -
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: TO-236AB (SOT23)

패키지: TO-236-3, SC-59, SOT-23-3

재고3,762

SX1534PKVWT1

NXP

ACCELEROMETER

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고8,784

MMA6222EGR2

NXP

ACCELEROMETER 20G ANALOG 20SOIC

Type: Analog
Axis: X, Y
Acceleration Range: ±20g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 23.40mV/V/g
Bandwidth: 3kHz
Output Type: Analog Voltage
Voltage - Supply: 3.15 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SOIC

패키지: 20-SOIC (0.295", 7.50mm Width)

재고2,556

MFRX85201HD/D4110:

NXP

MOD SECURITY READER CUST 48HLQFN

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: -
Voltage - Supply: 3.3 V ~ 5 V
Operating Temperature: -25°C ~ 85°C
Package / Case: 48-LFQFN Exposed Pad
Supplier Device Package: 48-HLQFN (7x7)

패키지: 48-LFQFN Exposed Pad

재고4,410

PN5120A0HN1/C1,157

NXP

IC TRANSMISSION MOD 32-HVQFN

Type: RFID Reader/Transponder
Frequency: 13.56MHz
Standards: FeliCa, ISO 14443, MIFARE, NFC
Interface: I2C, SPI, UART
Voltage - Supply: 2.5 V ~ 3.6 V
Operating Temperature: -40°C ~ 90°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고4,194

BGA3031X

NXP

IC MMIC 20HVQFN

Frequency: 5MHz ~ 85MHz
P1dB: -
Gain: 34dB
Noise Figure: 3.5dB
RF Type: CATV
Voltage - Supply: 5V
Current - Supply: 325mA
Test Frequency: -
Package / Case: 20-VQFN Exposed Pad
Supplier Device Package: 20-HVQFN (5x5)

패키지: 20-VQFN Exposed Pad

재고2,862

BGA6489,135

NXP

IC MMIC AMPLIFIER SOT89

Frequency: 500MHz ~ 3.5GHz
P1dB: 17dBm (50.1mW)
Gain: 16dB
Noise Figure: 3.3dB
RF Type: PCS, CDPD, Broadcast Television
Voltage - Supply: 5.1 V ~ 6 V
Current - Supply: 78mA ~ 150mA
Test Frequency: 1.95GHz
Package / Case: TO-243AA
Supplier Device Package: SOT-89-3

패키지: TO-243AA

재고2,016

MCIMX6S6AVM08AD

NXP

I.MX6SOLO ROM PERF ENHAN

Core Processor: ARM® Cortex®-A9
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Multimedia; NEON™ SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-LFBGA
Supplier Device Package: 624-MAPBGA (21x21)

패키지: 624-LFBGA

재고4,176

PS32V234CMN1AVUB

NXP

PRE-QUAL ISP GPU NO CSE1GHZ

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
Speed: 1.0GHz, 133MHz
Co-Processors/DSP: Multimedia; NEON™ MPE
RAM Controllers: LPDDR2, DDR3, DDR3L
Graphics Acceleration: Yes
Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, MIPICSI2, VIU
Ethernet: 1 Gbps
SATA: -
USB: -
Voltage - I/O: 1.0V, 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Package / Case: 621-FBGA, FCBGA
Supplier Device Package: 621-FCPBGA (17x17)

패키지: 621-FBGA, FCBGA

재고7,824

SPC5606BF1VLU6

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 149
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 80K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 29x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 176-LQFP
Supplier Device Package: 176-LQFP (24x24)

패키지: 176-LQFP

재고6,900

TJA1128CTK-1Z

NXP

LIN MINI SYSTEM BASIS CHIP WITH

Applications: System Basis Chip
Interface: SPI
Voltage - Supply: 3V ~ 28V
Package / Case: 14-VDFN Exposed Pad
Supplier Device Package: 14-HVSON (3x4.5)
Mounting Type: Surface Mount

패키지: -

재고18,000

MC33FS8435G0ESR2

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

패키지: -

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SAF775CHV-N208Q-AY

NXP

CAR RADIO TUNER & AUDIO DSP

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Supplier Device Package: 176-HLQFP (24x24)

패키지: -

Request a Quote