페이지 692 - NXP 제품 | Heisener Electronics
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NXP 제품

기록 26,590
페이지  692/950
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BUK9E3R2-40B,127
NXP

MOSFET N-CH 40V 100A I2PAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 40V
  • Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
  • Vgs(th) (Max) @ Id: 2V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 94nC @ 5V
  • Input Capacitance (Ciss) (Max) @ Vds: 10502pF @ 25V
  • Vgs (Max): ±15V
  • FET Feature: -
  • Power Dissipation (Max): 300W (Tc)
  • Rds On (Max) @ Id, Vgs: 2.8 mOhm @ 25A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Through Hole
  • Supplier Device Package: I2PAK
  • Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA
패키지: TO-262-3 Long Leads, I2Pak, TO-262AA
재고3,392
HEF4049BP,652
NXP

IC INVERTER HEX 1INPUT 16DIP

  • Logic Type: Inverter
  • Number of Circuits: 6
  • Number of Inputs: 6
  • Features: -
  • Voltage - Supply: 3 V ~ 15 V
  • Current - Quiescent (Max): 16µA
  • Current - Output High, Low: 3mA, 20mA
  • Logic Level - Low: 1.5 V ~ 4 V
  • Logic Level - High: 3.5 V ~ 11 V
  • Max Propagation Delay @ V, Max CL: 40ns @ 15V, 50pF
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Supplier Device Package: 16-DIP
  • Package / Case: 16-DIP (0.300", 7.62mm)
패키지: 16-DIP (0.300", 7.62mm)
재고4,928
74ABT241N,602
NXP

IC BUFF/DVR TRI-ST DUAL 20DIP

  • Logic Type: Buffer, Non-Inverting
  • Number of Elements: 2
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 32mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 20-DIP (0.300", 7.62mm)
  • Supplier Device Package: 20-DIP
패키지: 20-DIP (0.300", 7.62mm)
재고5,216
PCAL6524HEHP
NXP

IC I/O EXPANDER 24BIT 32HUQFN

  • Number of I/O: 24
  • Interface: I2C
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Open Drain, Push-Pull
  • Current - Output Source/Sink: -
  • Clock Frequency: 1MHz
  • Voltage - Supply: 1.65 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 32-UFQFN Exposed Pad
  • Supplier Device Package: 32-HUQFN (5x5)
패키지: 32-UFQFN Exposed Pad
재고6,320
SAA7114E/V2,518
NXP

IC VIDEO DECODER W/FILTR 156-BGA

  • Type: Video Decoder
  • Applications: Desktop, Processing, Video
  • Voltage - Supply, Analog: 3.1 V ~ 3.5 V
  • Voltage - Supply, Digital: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Package / Case: 156-LBGA
  • Supplier Device Package: 156-LBGA (15x15)
패키지: 156-LBGA
재고6,496
NX3V1T66GW,125
NXP

IC ANALOG SWITCH SPST 5TSSOP

  • Switch Circuit: SPST - NO
  • Multiplexer/Demultiplexer Circuit: 1:1
  • Number of Circuits: 1
  • On-State Resistance (Max): 450 mOhm
  • Channel-to-Channel Matching (ΔRon): -
  • Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): 28ns, 20ns
  • -3db Bandwidth: 25MHz
  • Charge Injection: 12pC
  • Channel Capacitance (CS(off), CD(off)): 70pF
  • Current - Leakage (IS(off)) (Max): 10nA
  • Crosstalk: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 5-TSSOP, SC-70-5, SOT-353
  • Supplier Device Package: 5-TSSOP
패키지: 5-TSSOP, SC-70-5, SOT-353
재고3,760
T2080NSN7MQB
NXP

IC SOC 64BIT 8X1.2GHZ 896FCBGA

  • Core Processor: PowerPC e6500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.8GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (8), 2.5 Gbps (4), 10 Gbps (4)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 896-FBGA, FCBGA
  • Supplier Device Package: 896-FCPBGA (25x25)
패키지: 896-FBGA, FCBGA
재고3,520
MPC8544DVTANG
NXP

IC MPU MPC85XX 800MHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 800MHz
  • Co-Processors/DSP: Signal Processing; SPE
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
패키지: 783-BBGA, FCBGA
재고7,584
MPC8547EVJATGD
NXP

IC MPU MPC85XX 1.2GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.2GHz
  • Co-Processors/DSP: Signal Processing; SPE, Security; SEC
  • RAM Controllers: DDR, DDR2, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (4)
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BFBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
패키지: 783-BFBGA, FCBGA
재고6,768
T1040NSN7MQB
NXP

IC SOC 4CORE 1200MHZ SW 780FCBGA

  • Core Processor: PowerPC e5500
  • Number of Cores/Bus Width: 4 Core, 64-Bit
  • Speed: 1.4GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3L/4
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (12)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 780-FBGA, FCBGA
  • Supplier Device Package: 780-FCPBGA (23x23)
패키지: 780-FBGA, FCBGA
재고7,472
MK60DN512ZAB10R
NXP

IC MCU 32BIT 512KB FLASH 120CSP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: -
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 38x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 120-UFBGA, WLCSP
  • Supplier Device Package: 120-WLCSP (5.29x5.28)
패키지: 120-UFBGA, WLCSP
재고5,488
MC908QY4ACDTER
NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: 16-TSSOP (0.173", 4.40mm Width)
재고3,504
hot MC908QY4ACDTE
NXP

IC MCU 8BIT 4KB FLASH 16TSSOP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 6x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: 16-TSSOP (0.173", 4.40mm Width)
재고153,444
MC68HC908GR16VFA
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 37
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP
재고3,488
MC9S08QE8CTGR
NXP

IC MCU 8BIT 8KB FLASH 16TSSOP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, LIN, SCI, SPI
  • Peripherals: LVD, PWM, WDT
  • Number of I/O: 12
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: 16-TSSOP (0.173", 4.40mm Width)
재고2,272
SAA7709H/N103S/S42
NXP

IC DSP CAR RADIO 80QFP

  • Type: Car Signal Processor
  • Interface: I2C, I2S, LSB, SPDIF
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: 3.30V
  • Voltage - Core: 3.30V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 80-BQFP
  • Supplier Device Package: 80-PQFP (14x20)
패키지: 80-BQFP
재고4,576
MPX5100A
NXP

SENSOR ABS PRESS 16.7 PSI MAX

  • Pressure Type: Absolute
  • Operating Pressure: 2.18 PSI ~ 16.68 PSI (15 kPa ~ 115 kPa)
  • Output Type: Analog Voltage
  • Output: 0.2 V ~ 4.7 V
  • Accuracy: ±2.5%
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Port Size: -
  • Port Style: No Port
  • Features: Temperature Compensated
  • Termination Style: PCB
  • Maximum Pressure: 58.02 PSI (400 kPa)
  • Operating Temperature: -40°C ~ 125°C
  • Package / Case: 6-SIP Module
  • Supplier Device Package: -
패키지: 6-SIP Module
재고3,780
MMA6823AKW
NXP

ACCELEROMETER 16QFN

  • Type: Digital
  • Axis: X, Y
  • Acceleration Range: ±50g
  • Sensitivity (LSB/g): -
  • Sensitivity (mV/g): -
  • Bandwidth: -
  • Output Type: SPI
  • Voltage - Supply: 3.135 V ~ 5.25 V
  • Features: -
  • Operating Temperature: -40°C ~ 105°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-QFN Exposed Pad
  • Supplier Device Package: 16-QFN (6x6)
패키지: 16-QFN Exposed Pad
재고6,318
MC32PF3000A1EPR2
NXP

POWER MANAGEMENT IC I.MX7 PRE-

  • Applications: i.MX Processors
  • Current - Supply: -
  • Voltage - Supply: 2.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고5,232
LS1088ASE7PTA
NXP

LS1088A 1400/1800 WE RVA

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고3,808
LS1043ASN8MNLB
NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고5,728
LS1043ASN7KNLB
NXP

QORIQ 4XCPU 64-BIT ARM ARCH 1.

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고2,464
S912XDQ256F1VAA
NXP

16-BIT MCU S12X CORE 256KB FLA

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b, 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
패키지: 80-QFP
재고5,280
MC9S08PA16AVLCR
NXP

S08PA 8-BIT MCU S08 CORE 16KB

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I²C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 28
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 256 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
패키지: 32-LQFP
재고6,576
MGD3160AM315EKR2
NXP

EV INVERTER CONTROL; IGBT & SIC

  • Output Configuration: Half Bridge
  • Applications: General Purpose
  • Interface: PWM, SPI
  • Load Type: Inductive
  • Technology: IGBT
  • Rds On (Typ): 500mOhm LS, 500mOhm HS
  • Current - Output / Channel: 15A
  • Current - Peak Output: 15A
  • Voltage - Supply: 4.5V ~ 40V
  • Voltage - Load: 4.5V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Features: -
  • Fault Protection: Over Temperature, Short Circuit
  • Mounting Type: Surface Mount
  • Package / Case: 32-BSSOP (0.295", 7.50mm Width)
  • Supplier Device Package: 32-SOIC
패키지: -
Request a Quote
SPC5746CFK1AMKU6
NXP

IC MCU 32BIT 3MB FLASH 176LQFP

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz, 160MHz
  • Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SAI, SPI
  • Peripherals: DMA, I2S, LVD/HVD, POR, WDT
  • Number of I/O: 129
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 128K x 8
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
  • Data Converters: A/D 68x10b, 31x12b SAR
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
패키지: -
Request a Quote
MFS2613AMDA0ADR2
NXP

SAFETY SYSTEM BASIS CHIP WITH LO

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: 3.2V ~ 40V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-LQFP-EP (7x7)
패키지: -
Request a Quote
MIMX8UD3DVP08SC
NXP

I.MX8ULP, DUAL 800MHZ

  • Core Processor: -
  • Number of Cores/Bus Width: -
  • Speed: -
  • Co-Processors/DSP: -
  • RAM Controllers: -
  • Graphics Acceleration: -
  • Display & Interface Controllers: -
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: -
  • Operating Temperature: -
  • Security Features: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
Request a Quote