페이지 764 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PQJ7911AHN/C0C,515	NXP	IC TXRX ISM/SRD VAND 32HVQFN Type: - Applications: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고3,376
LD6836TD/12P,125	NXP	IC REG LINEAR 1.2V 300MA 5TSOP Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 1.2V Voltage - Output (Max): - Voltage Dropout (Max): 0.2V @ 300mA Current - Output: 300mA Current - Quiescent (Iq): - Current - Supply (Max): 100µA ~ 250µA PSRR: 55dB (1kHz) Control Features: Enable Protection Features: Over Current, Over Temperature Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: SC-74A, SOT-753 Supplier Device Package: 5-TSOP	패키지: SC-74A, SOT-753	재고5,312
PCF8576CHL/1,157	NXP	IC LCD DRIVER 40SEG I2C 64LQFP Display Type: LCD Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix Interface: I2C, 2-Wire Serial Digits or Characters: 10 Characters, 20 Characters, 160 Elements Current - Supply: 120µA Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고6,768
N74F109N,602	NXP	IC JK TYPE POS TRG DUAL 16DIP Function: Set(Preset) and Reset Type: JK Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 125MHz Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 1mA, 20mA Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Iq): 17mA Input Capacitance: - Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm)	패키지: 16-DIP (0.300", 7.62mm)	재고6,528
TDA19995HL/C1,551	NXP	IC DVI/HDMI SWITCH 100LQFP Type: HDMI 1.4 Applications: HDTV Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고3,952
UJA1076ATW/5V0/WD,	NXP	IC SBC CAN/LIN 5.0V HS 32HTSSOP Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	재고7,888
MPC8347EZQADD	NXP	IC MPU MPC83XX 266MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	패키지: 620-BBGA Exposed Pad	재고4,640
BSC9132NSN7MNMB	NXP	IC MPU Q OR IQ 1.333GHZ 780FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.333GHz Co-Processors/DSP: Signal Processing; SC3850 - Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 780-BFBGA, FCBGA Supplier Device Package: 780-FCBGA (23x23)	패키지: 780-BFBGA, FCBGA	재고4,448
MCF5271CVM100J	NXP	IC MCU 32BIT ROMLESS 196MAPBGA Core Processor: Coldfire V2 Core Size: 32-Bit Speed: 100MHz Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART Peripherals: DMA, WDT Number of I/O: 61 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-LBGA	재고2,464
MC68332GMEH16	NXP	IC MCU 32BIT ROMLESS 132QFP Core Processor: CPU32 Core Size: 32-Bit Speed: 16MHz Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 15 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (24.13x24.13)	패키지: 132-BQFP Bumpered	재고5,008
MVF30NS152CKU26	NXP	IC MCU 32BIT ROMLESS 176LQFP Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 266MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,960
MK10DX128ZVMD10	NXP	IC MCU 32BIT 128KB FLASH 144BGA Core Processor: ARM? Cortex?-M4 Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 46x16b, D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LBGA Supplier Device Package: 144-MAPBGA (13x13)	패키지: 144-LBGA	재고7,680
MC9S12C32MFUE25	NXP	IC MCU 16BIT 32KB FLASH 80QFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 60 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고15,348
MSC8144SVT800A	NXP	IC DSP QUAD 800MHZ 783FCBGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 800MHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 105°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,280
MPXY8040A6U	NXP	SENSOR TIRE PRESS MONITOR 8-SSOP Sensor Type: - Output Type: - Operating Temperature: -	패키지: -	재고7,596
MPX5050GP	NXP	SENSOR GAUGE PRESS 7.25 PSI MAX Pressure Type: Vented Gauge Operating Pressure: 7.25 PSI (50 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±2.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: Male - 0.19" (4.93mm) Tube Port Style: Barbed Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 29.01 PSI (200 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	패키지: 6-SIP Module	재고10,944
MMA6828AKGWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: - Axis: - Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: - Voltage - Supply: - Features: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고8,748
CLRC66302HN,557	NXP	IC NFC CONTACTLESS TXRX 32HVQFN Type: RFID Reader Frequency: 13.56MHz Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC Interface: I2C, SPI, UART Voltage - Supply: 3 V ~ 5.5 V Operating Temperature: -25°C ~ 85°C Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-HVQFN (5x5)	패키지: 32-VFQFN Exposed Pad	재고8,136
HTSICC4801EW/C7,02	NXP	TRANSPONDER RFIC HITAG S UNCASED Type: RFID Transponder Frequency: 100kHz ~ 150kHz Standards: - Interface: - Voltage - Supply: 3.5V Operating Temperature: -25°C ~ 85°C Package / Case: Die Supplier Device Package: Die	패키지: Die	재고2,826
JN5139-Z01-M/04R1T	NXP	RF TXRX MODULE 802.15.4 U.FL ANT RF Family/Standard: 802.15.4 Protocol: Zigbee? Modulation: - Frequency: 2.4GHz Data Rate: - Power - Output: 19dBm Sensitivity: -100dBm Serial Interfaces: I2C, SPI, UART Antenna Type: Not Included, U.FL Memory Size: 192kB ROM, 96kB RAM Voltage - Supply: 2.2 V ~ 3.6 V Current - Receiving: 45mA Current - Transmitting: 125mA Mounting Type: Surface Mount Operating Temperature: -40°C ~ 85°C Package / Case: Module	패키지: Module	재고3,960
BGF944,127	NXP	POWER MODULE GSM900 EDGE SOT365C Frequency: 920MHz ~ 960MHz P1dB: - Gain: 30dB Noise Figure: - RF Type: GSM, EDGE Voltage - Supply: 30V Current - Supply: 280mA Test Frequency: - Package / Case: SOT-365C Supplier Device Package: SOT-365C	패키지: SOT-365C	재고3,186
FS32K148HST0MLQT	NXP	S32K148 144 LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Speed: 80MHz Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART Peripherals: I²S, POR, PWM, WDT Number of I/O: - Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 256K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 32x12b, D/A 1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고6,720
S9S12P96J0CQK	NXP	16-BIT MCU S12 CORE 96KB FLASH Core Processor: HCS12 Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 64 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고7,616
S32K324NHT1MPBST	NXP	S32K324 ARM CORTEX-M7, 160 MHZ, Core Processor: ARM® Cortex®-M7 Core Size: 32-Bit Dual-Core Speed: 160MHz Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART Peripherals: DMA, I2S, Serial Audio, WDT Number of I/O: 218 Program Memory Size: 4MB (4M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 172-QFP Supplier Device Package: 172-QFP (16x16)	패키지: -	Request a Quote
MC35FS6517CAE	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	패키지: -	Request a Quote
SAF775DHV-N208W-SY	NXP	CAR DISP Type: - Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
S912ZVL64AVFM	NXP	S12Z CPU, 64K FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
MC33FS6515LAER2	NXP	SYSTEM BASIS CHIP, DCDC 1.5A VCO Applications: System Basis Chip Current - Supply: - Voltage - Supply: 1V ~ 5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-HLQFP (7x7)	패키지: -	Request a Quote

PQJ7911AHN/C0C,515

NXP

IC TXRX ISM/SRD VAND 32HVQFN

Type: -
Applications: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고3,376

LD6836TD/12P,125

NXP

IC REG LINEAR 1.2V 300MA 5TSOP

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 1.2V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.2V @ 300mA
Current - Output: 300mA
Current - Quiescent (Iq): -
Current - Supply (Max): 100µA ~ 250µA
PSRR: 55dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Over Temperature
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: SC-74A, SOT-753
Supplier Device Package: 5-TSOP

패키지: SC-74A, SOT-753

재고5,312

PCF8576CHL/1,157

NXP

IC LCD DRIVER 40SEG I2C 64LQFP

Display Type: LCD
Configuration: 7 Segment + DP, 14 Segment + DP + AP, Dot Matrix
Interface: I2C, 2-Wire Serial
Digits or Characters: 10 Characters, 20 Characters, 160 Elements
Current - Supply: 120µA
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고6,768

N74F109N,602

NXP

IC JK TYPE POS TRG DUAL 16DIP

Function: Set(Preset) and Reset
Type: JK Type
Output Type: Differential
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 125MHz
Max Propagation Delay @ V, Max CL: 8ns @ 5V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 1mA, 20mA
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Iq): 17mA
Input Capacitance: -
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)

패키지: 16-DIP (0.300", 7.62mm)

재고6,528

TDA19995HL/C1,551

NXP

IC DVI/HDMI SWITCH 100LQFP

Type: HDMI 1.4
Applications: HDTV
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고3,952

UJA1076ATW/5V0/WD,

NXP

IC SBC CAN/LIN 5.0V HS 32HTSSOP

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

재고7,888

MPC8347EZQADD

NXP

IC MPU MPC83XX 266MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

패키지: 620-BBGA Exposed Pad

재고4,640

BSC9132NSN7MNMB

NXP

IC MPU Q OR IQ 1.333GHZ 780FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.333GHz
Co-Processors/DSP: Signal Processing; SC3850 - Dual
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 780-BFBGA, FCBGA
Supplier Device Package: 780-FCBGA (23x23)

패키지: 780-BFBGA, FCBGA

재고4,448

MCF5271CVM100J

NXP

IC MCU 32BIT ROMLESS 196MAPBGA

Core Processor: Coldfire V2
Core Size: 32-Bit
Speed: 100MHz
Connectivity: EBI/EMI, Ethernet, I2C, SPI, UART/USART
Peripherals: DMA, WDT
Number of I/O: 61
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 1.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-LBGA

재고2,464

MC68332GMEH16

NXP

IC MCU 32BIT ROMLESS 132QFP

Core Processor: CPU32
Core Size: 32-Bit
Speed: 16MHz
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 15
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 132-BQFP Bumpered
Supplier Device Package: 132-PQFP (24.13x24.13)

패키지: 132-BQFP Bumpered

재고5,008

MVF30NS152CKU26

NXP

IC MCU 32BIT ROMLESS 176LQFP

Core Processor: ARM? Cortex?-A5
Core Size: 32-Bit Single-Core
Speed: 266MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,960

MK10DX128ZVMD10

NXP

IC MCU 32BIT 128KB FLASH 144BGA

Core Processor: ARM? Cortex?-M4
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 46x16b, D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LBGA
Supplier Device Package: 144-MAPBGA (13x13)

패키지: 144-LBGA

재고7,680

MC9S12C32MFUE25

NXP

IC MCU 16BIT 32KB FLASH 80QFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 60
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고15,348

MSC8144SVT800A

NXP

IC DSP QUAD 800MHZ 783FCBGA

Type: SC3400 Core
Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
Clock Rate: 800MHz
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 105°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,280

MPXY8040A6U

NXP

SENSOR TIRE PRESS MONITOR 8-SSOP

Sensor Type: -
Output Type: -
Operating Temperature: -

패키지: -

재고7,596

MPX5050GP

NXP

SENSOR GAUGE PRESS 7.25 PSI MAX

Pressure Type: Vented Gauge
Operating Pressure: 7.25 PSI (50 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±2.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: Male - 0.19" (4.93mm) Tube
Port Style: Barbed
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 29.01 PSI (200 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 6-SIP Module
Supplier Device Package: -

패키지: 6-SIP Module

재고10,944

MMA6828AKGWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: -
Axis: -
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: -
Voltage - Supply: -
Features: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고8,748

CLRC66302HN,557

NXP

IC NFC CONTACTLESS TXRX 32HVQFN

Type: RFID Reader
Frequency: 13.56MHz
Standards: ISO 14443, ISO 15693, 18000-3, MIFARE, NFC
Interface: I2C, SPI, UART
Voltage - Supply: 3 V ~ 5.5 V
Operating Temperature: -25°C ~ 85°C
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-HVQFN (5x5)

패키지: 32-VFQFN Exposed Pad

재고8,136

HTSICC4801EW/C7,02

NXP

TRANSPONDER RFIC HITAG S UNCASED

Type: RFID Transponder
Frequency: 100kHz ~ 150kHz
Standards: -
Interface: -
Voltage - Supply: 3.5V
Operating Temperature: -25°C ~ 85°C
Package / Case: Die
Supplier Device Package: Die

패키지: Die

재고2,826

JN5139-Z01-M/04R1T

NXP

RF TXRX MODULE 802.15.4 U.FL ANT

RF Family/Standard: 802.15.4
Protocol: Zigbee?
Modulation: -
Frequency: 2.4GHz
Data Rate: -
Power - Output: 19dBm
Sensitivity: -100dBm
Serial Interfaces: I2C, SPI, UART
Antenna Type: Not Included, U.FL
Memory Size: 192kB ROM, 96kB RAM
Voltage - Supply: 2.2 V ~ 3.6 V
Current - Receiving: 45mA
Current - Transmitting: 125mA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Package / Case: Module

패키지: Module

재고3,960

BGF944,127

NXP

POWER MODULE GSM900 EDGE SOT365C

Frequency: 920MHz ~ 960MHz
P1dB: -
Gain: 30dB
Noise Figure: -
RF Type: GSM, EDGE
Voltage - Supply: 30V
Current - Supply: 280mA
Test Frequency: -
Package / Case: SOT-365C
Supplier Device Package: SOT-365C

패키지: SOT-365C

재고3,186

FS32K148HST0MLQT

NXP

S32K148 144 LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit
Speed: 80MHz
Connectivity: CANbus, Ethernet, FlexIO, I²C, LINbus, SPI, UART/USART
Peripherals: I²S, POR, PWM, WDT
Number of I/O: -
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 256K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 32x12b, D/A 1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고6,720

S9S12P96J0CQK

NXP

16-BIT MCU S12 CORE 96KB FLASH

Core Processor: HCS12
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 64
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 6K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고7,616

S32K324NHT1MPBST

NXP

S32K324 ARM CORTEX-M7, 160 MHZ,

Core Processor: ARM® Cortex®-M7
Core Size: 32-Bit Dual-Core
Speed: 160MHz
Connectivity: CANbus, Ethernet, FlexIO, I2C, I3C, LIN, QSPI, SAI, SPI, UART/USART
Peripherals: DMA, I2S, Serial Audio, WDT
Number of I/O: 218
Program Memory Size: 4MB (4M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 172-QFP
Supplier Device Package: 172-QFP (16x16)

패키지: -

Request a Quote

MC35FS6517CAE

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

패키지: -

Request a Quote

SAF775DHV-N208W-SY

NXP

CAR DISP

Type: -
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

S912ZVL64AVFM

NXP

S12Z CPU, 64K FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

MC33FS6515LAER2

NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: 1V ~ 5V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-HLQFP (7x7)

패키지: -

Request a Quote