페이지 796 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
BUK9608-55,118	NXP	MOSFET N-CH 55V 75A D2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 55V Current - Continuous Drain (Id) @ 25°C: 75A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V Vgs(th) (Max) @ Id: 2V @ 1mA Gate Charge (Qg) (Max) @ Vgs: - Input Capacitance (Ciss) (Max) @ Vds: 6900pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 187W (Tc) Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 5V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: D2PAK Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB	재고7,856
MRF5S4125NBR1	NXP	FET RF 65V 465MHZ TO-272-4 Transistor Type: LDMOS Frequency: 465MHz Gain: 23dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.1A Power - Output: 25W Voltage - Rated: 65V Package / Case: TO-272BB Supplier Device Package: TO-272 WB-4	패키지: TO-272BB	재고3,552
TDA3681ATH/N1S,518	NXP	IC REG MULTIPLE VOLTAGE 20HSOP Applications: Ignition Buffer, Regulator Current - Supply: 110µA Voltage - Supply: 9.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad Supplier Device Package: 20-HSOP	패키지: 20-SOIC (0.433", 11.00mm Width) Exposed Pad	재고5,456
MC06XS4200FK	NXP	IC SWITCH HIGH SIDE 23PQFN Switch Type: General Purpose Number of Outputs: 2 Ratio - Input:Output: 1:1 Output Configuration: High Side Output Type: N-Channel Interface: SPI Voltage - Load: 8 V ~ 36 V Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Current - Output (Max): 9A Rds On (Typ): 6 mOhm (Max) Input Type: - Features: Internal PWM, Slew Rate Controlled Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 23-PowerQFN Supplier Device Package: 23-PQFN (12x12)	패키지: 23-PowerQFN	재고6,752
HEF40193BT,652	NXP	IC COUNTER BINARY UP/DOWN 16SOIC Logic Type: Binary Counter Direction: Up, Down Number of Elements: 1 Number of Bits per Element: 4 Reset: Asynchronous Timing: Synchronous Count Rate: 18MHz Trigger Type: Positive Edge Voltage - Supply: 3 V ~ 20 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고6,704
74ABT623PW,118	NXP	IC TRANSCVR TRI-ST 8BIT 20TSSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고6,160
TDA8568Q/N3,112	NXP	IC AMP AUDIO PWR 35W QUAD 23SIL Type: Class B Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS23P Package / Case: 23-SIP Formed Leads	패키지: 23-SIP Formed Leads	재고5,760
PCA9540BDP,118	NXP	IC I2C MUX 2CH 8-TSSOP Applications: 2-Channel I2C Multiplexer Interface: I2C Voltage - Supply: 2.3 V ~ 5.5 V Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP Mounting Type: Surface Mount	패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	재고42,888
PCA9514ADP,118	NXP	IC ACCELERATR I2C HOTSWAP 8TSSOP Type: Buffer, Accelerator Applications: I2C - Hotswap Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 1.9pF Voltage - Supply: 2.7 V ~ 5.5 V Current - Supply: 3.5mA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	재고2,784
AU5790D14/N,112	NXP	IC CAN TRANSCEIVER 14-SOIC Type: Transceiver Protocol: CAN Number of Drivers/Receivers: 1/1 Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: 5.3 V ~ 27 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Supplier Device Package: 14-SO	패키지: 14-SOIC (0.154", 3.90mm Width)	재고6,448
MPC8378VRAJF	NXP	IC MPU MPC83XX 533MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: - USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고5,568
MC7448THX1267ND	NXP	IC MPU MPC74XX 1.267GHZ 360BGA Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD RAM Controllers: - Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25x25)	패키지: 360-BCBGA, FCCBGA	재고4,144
MPC8255AZUMHBB	NXP	IC MPU MPC82XX 266MHZ 408TBGA Core Processor: PowerPC G2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 266MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (3) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 480-LBGA Supplier Device Package: 408-TBGA (37.5x37.5)	패키지: 480-LBGA	재고8,892
MPC8536ECVJAKGA	NXP	IC MPU MPC85XX 600MHZ 783FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 (3) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,632
P2010NXE2MHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고4,080
MPC880CVR133	NXP	IC MPU MPC8XX 133MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 133MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (2), 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: -40°C ~ 100°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고4,784
MC908AZ60AVFUE	NXP	IC MCU 8BIT 60KB FLASH 64QFP Core Processor: HC08 Core Size: 8-Bit Speed: 8.4MHz Connectivity: CAN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 52 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 15x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고5,664
LPC18S50FET180E	NXP	IC MCU 32BIT ROMLESS 180TFBGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 118 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	패키지: 180-TFBGA	재고6,768
MPC9653FA	NXP	IC CLOCK GEN PLL LV 1:8 32-LQFP Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer PLL: Yes with Bypass Input: LVCMOS, LVPECL Output: LVCMOS Number of Circuits: 1 Ratio - Input:Output: 1:8 Differential - Input:Output: Yes/No Frequency - Max: 125MHz Divider/Multiplier: Yes/No Voltage - Supply: 3.135 V ~ 3.465 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고7,072
MF1S5001XDUD,005	NXP	IC SMART CARD FFC UNCASED Type: RFID Transponder Frequency: 13.56MHz Standards: ISO 14443, MIFARE Interface: UART Voltage - Supply: - Operating Temperature: -25°C ~ 70°C Package / Case: Die Supplier Device Package: Die	패키지: Die	재고2,322
MW7IC2425GNR1	NXP	IC PWR AMP RF 2400MHZ4W TO270-16 Frequency: 2.45GHz P1dB: - Gain: 27.7dB Noise Figure: - RF Type: ISM Voltage - Supply: 28V Current - Supply: 195mA Test Frequency: 2.45GHz Package / Case: TO-270-16 Variant, Gull Wing Supplier Device Package: TO-270 WBL-16 GULL	패키지: TO-270-16 Variant, Gull Wing	재고5,454
MMPF0100FBANESR2	NXP	POWER MANAGEMENT IC I.MX6 NO-P Applications: - Voltage - Input: - Number of Outputs: - Voltage - Output: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고3,696
LS1084ASE7MQA	NXP	LS1084A 1200/1600 ST WE Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,608
SPC5604CF2VLL6R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 79 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 48K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 28x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고7,216
S912ZVML31F1MKFR	NXP	MAGNIV 16-BIT MCU S12Z CORE 32 Core Processor: S12Z Core Size: 16-Bit Speed: 50MHz Connectivity: LINbus, SCI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 4x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	패키지: 48-LQFP Exposed Pad	재고7,728
S9S12ZVLS1F0CFMR	NXP	MAGNIV 16-BIT MCU S12Z CORE 16 Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 19 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 6x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN-EP (5x5)	패키지: 32-VFQFN Exposed Pad	재고4,560
PCA9306DC1Z	NXP	IC TRANSLTR BIDIRECTIONAL 8VSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1 V ~ 3.6 V Voltage - VCCB: 1.8 V ~ 5.5 V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 105°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-VFSOP (0.091", 2.30mm Width) Supplier Device Package: 8-VSSOP	패키지: -	Request a Quote
MKV42F64VLF16R	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 168MHz Connectivity: CANbus, I2C, SPI, UART/USART Peripherals: DMA, LVD, POR, PWM, WDT Number of I/O: 38 Program Memory Size: 64KB (64K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V Data Converters: A/D 21x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote

BUK9608-55,118

NXP

MOSFET N-CH 55V 75A D2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 55V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V
Vgs(th) (Max) @ Id: 2V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: -
Input Capacitance (Ciss) (Max) @ Vds: 6900pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 187W (Tc)
Rds On (Max) @ Id, Vgs: 8 mOhm @ 25A, 5V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: D2PAK
Package / Case: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

패키지: TO-263-3, D2Pak (2 Leads + Tab), TO-263AB

재고7,856

MRF5S4125NBR1

NXP

FET RF 65V 465MHZ TO-272-4

Transistor Type: LDMOS
Frequency: 465MHz
Gain: 23dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.1A
Power - Output: 25W
Voltage - Rated: 65V
Package / Case: TO-272BB
Supplier Device Package: TO-272 WB-4

패키지: TO-272BB

재고3,552

TDA3681ATH/N1S,518

NXP

IC REG MULTIPLE VOLTAGE 20HSOP

Applications: Ignition Buffer, Regulator
Current - Supply: 110µA
Voltage - Supply: 9.5 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Supplier Device Package: 20-HSOP

패키지: 20-SOIC (0.433", 11.00mm Width) Exposed Pad

재고5,456

MC06XS4200FK

NXP

IC SWITCH HIGH SIDE 23PQFN

Switch Type: General Purpose
Number of Outputs: 2
Ratio - Input:Output: 1:1
Output Configuration: High Side
Output Type: N-Channel
Interface: SPI
Voltage - Load: 8 V ~ 36 V
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Current - Output (Max): 9A
Rds On (Typ): 6 mOhm (Max)
Input Type: -
Features: Internal PWM, Slew Rate Controlled
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 23-PowerQFN
Supplier Device Package: 23-PQFN (12x12)

패키지: 23-PowerQFN

재고6,752

HEF40193BT,652

NXP

IC COUNTER BINARY UP/DOWN 16SOIC

Logic Type: Binary Counter
Direction: Up, Down
Number of Elements: 1
Number of Bits per Element: 4
Reset: Asynchronous
Timing: Synchronous
Count Rate: 18MHz
Trigger Type: Positive Edge
Voltage - Supply: 3 V ~ 20 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고6,704

74ABT623PW,118

NXP

IC TRANSCVR TRI-ST 8BIT 20TSSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고6,160

TDA8568Q/N3,112

NXP

IC AMP AUDIO PWR 35W QUAD 23SIL

Type: Class B
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS23P
Package / Case: 23-SIP Formed Leads

패키지: 23-SIP Formed Leads

재고5,760

PCA9540BDP,118

NXP

IC I2C MUX 2CH 8-TSSOP

Applications: 2-Channel I2C Multiplexer
Interface: I2C
Voltage - Supply: 2.3 V ~ 5.5 V
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP
Mounting Type: Surface Mount

패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

재고42,888

PCA9514ADP,118

NXP

IC ACCELERATR I2C HOTSWAP 8TSSOP

Type: Buffer, Accelerator
Applications: I2C - Hotswap
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 1
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 1.9pF
Voltage - Supply: 2.7 V ~ 5.5 V
Current - Supply: 3.5mA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

재고2,784

AU5790D14/N,112

NXP

IC CAN TRANSCEIVER 14-SOIC

Type: Transceiver
Protocol: CAN
Number of Drivers/Receivers: 1/1
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: 5.3 V ~ 27 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 14-SO

패키지: 14-SOIC (0.154", 3.90mm Width)

재고6,448

MPC8378VRAJF

NXP

IC MPU MPC83XX 533MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: -
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고5,568

MC7448THX1267ND

NXP

IC MPU MPC74XX 1.267GHZ 360BGA

Core Processor: PowerPC G4
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.267GHz
Co-Processors/DSP: Multimedia; SIMD
RAM Controllers: -
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 360-BCBGA, FCCBGA
Supplier Device Package: 360-FCCBGA (25x25)

패키지: 360-BCBGA, FCCBGA

재고4,144

MPC8255AZUMHBB

NXP

IC MPU MPC82XX 266MHZ 408TBGA

Core Processor: PowerPC G2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 266MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (3)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 480-LBGA
Supplier Device Package: 408-TBGA (37.5x37.5)

패키지: 480-LBGA

재고8,892

MPC8536ECVJAKGA

NXP

IC MPU MPC85XX 600MHZ 783FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 600MHz
Co-Processors/DSP: Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 (3)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,632

P2010NXE2MHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고4,080

MPC880CVR133

NXP

IC MPU MPC8XX 133MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 133MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (2), 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: -40°C ~ 100°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고4,784

MC908AZ60AVFUE

NXP

IC MCU 8BIT 60KB FLASH 64QFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8.4MHz
Connectivity: CAN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 52
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 15x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고5,664

LPC18S50FET180E

NXP

IC MCU 32BIT ROMLESS 180TFBGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 118
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

패키지: 180-TFBGA

재고6,768

MPC9653FA

NXP

IC CLOCK GEN PLL LV 1:8 32-LQFP

Type: Clock Generator, Fanout Distribution, Multiplexer, Zero Delay Buffer
PLL: Yes with Bypass
Input: LVCMOS, LVPECL
Output: LVCMOS
Number of Circuits: 1
Ratio - Input:Output: 1:8
Differential - Input:Output: Yes/No
Frequency - Max: 125MHz
Divider/Multiplier: Yes/No
Voltage - Supply: 3.135 V ~ 3.465 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고7,072

MF1S5001XDUD,005

NXP

IC SMART CARD FFC UNCASED

Type: RFID Transponder
Frequency: 13.56MHz
Standards: ISO 14443, MIFARE
Interface: UART
Voltage - Supply: -
Operating Temperature: -25°C ~ 70°C
Package / Case: Die
Supplier Device Package: Die

패키지: Die

재고2,322

MW7IC2425GNR1

NXP

IC PWR AMP RF 2400MHZ4W TO270-16

Frequency: 2.45GHz
P1dB: -
Gain: 27.7dB
Noise Figure: -
RF Type: ISM
Voltage - Supply: 28V
Current - Supply: 195mA
Test Frequency: 2.45GHz
Package / Case: TO-270-16 Variant, Gull Wing
Supplier Device Package: TO-270 WBL-16 GULL

패키지: TO-270-16 Variant, Gull Wing

재고5,454

MMPF0100FBANESR2

NXP

POWER MANAGEMENT IC I.MX6 NO-P

Applications: -
Voltage - Input: -
Number of Outputs: -
Voltage - Output: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고3,696

LS1084ASE7MQA

NXP

LS1084A 1200/1600 ST WE

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,608

SPC5604CF2VLL6R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 79
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 48K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 28x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고7,216

S912ZVML31F1MKFR

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

Core Processor: S12Z
Core Size: 16-Bit
Speed: 50MHz
Connectivity: LINbus, SCI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 4x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

패키지: 48-LQFP Exposed Pad

재고7,728

S9S12ZVLS1F0CFMR

NXP

MAGNIV 16-BIT MCU S12Z CORE 16

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 19
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 6x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN-EP (5x5)

패키지: 32-VFQFN Exposed Pad

재고4,560

PCA9306DC1Z

NXP

IC TRANSLTR BIDIRECTIONAL 8VSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 3.6 V
Voltage - VCCB: 1.8 V ~ 5.5 V
Input Signal: -
Output Signal: -
Output Type: Open Drain
Data Rate: -
Operating Temperature: -40°C ~ 105°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 8-VFSOP (0.091", 2.30mm Width)
Supplier Device Package: 8-VSSOP

패키지: -

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MKV42F64VLF16R

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Speed: 168MHz
Connectivity: CANbus, I2C, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Number of I/O: 38
Program Memory Size: 64KB (64K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Data Converters: A/D 21x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

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