페이지 811 - NXP 제품 | Heisener Electronics
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NXP 제품

기록 26,590
페이지  811/950
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hot PMV16UN,215
NXP

MOSFET N-CH 20V 5.8A SOT23

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 20V
  • Current - Continuous Drain (Id) @ 25°C: 5.8A (Ta)
  • Drive Voltage (Max Rds On, Min Rds On): 1.8V, 4.5V
  • Vgs(th) (Max) @ Id: 1V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs: 11nC @ 4.5V
  • Input Capacitance (Ciss) (Max) @ Vds: 670pF @ 10V
  • Vgs (Max): ±8V
  • FET Feature: -
  • Power Dissipation (Max): 510mW (Ta)
  • Rds On (Max) @ Id, Vgs: 18 mOhm @ 5.8A, 4.5V
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: TO-236AB (SOT23)
  • Package / Case: TO-236-3, SC-59, SOT-23-3
패키지: TO-236-3, SC-59, SOT-23-3
재고148,080
MRF6P24190HR6
NXP

FET RF 68V 2.39GHZ NI-1230

  • Transistor Type: LDMOS
  • Frequency: 2.39GHz
  • Gain: 14dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 1.9A
  • Power - Output: 40W
  • Voltage - Rated: 68V
  • Package / Case: NI-1230
  • Supplier Device Package: NI-1230
패키지: NI-1230
재고7,552
TDA3683SD/N2S,112
NXP

IC REG MULTIPLE VOLTAGE RDBS23P

  • Applications: Ignition Buffer, Regulator
  • Current - Supply: 300µA
  • Voltage - Supply: 9 V ~ 18 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 23-SIP Formed Leads
  • Supplier Device Package: 23-DBS
패키지: 23-SIP Formed Leads
재고3,936
MC33SB0401ES
NXP

LOW SIDE DRIVER X2, WHEEL SPEED

  • Applications: Motorcycle Braking
  • Current - Supply: -
  • Voltage - Supply: 6 V ~ 20 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN (7x7)
패키지: 48-VFQFN Exposed Pad
재고7,716
PCF85132U/2DA/1,02
NXP

IC LCD DISPLAY DRVR UNCASED

  • Display Type: LCD
  • Configuration: Multiple
  • Interface: I2C
  • Digits or Characters: Any Digit Type
  • Current - Supply: 60µA
  • Voltage - Supply: 1.8 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: -
  • Package / Case: Die
  • Supplier Device Package: Die
패키지: Die
재고6,960
TEA18362LT/1J
NXP

IC CTRLR SMPS DCM/QR 8SOIC

  • Output Isolation: Isolated
  • Internal Switch(s): No
  • Voltage - Breakdown: -
  • Topology: Flyback
  • Voltage - Start Up: 14.9V
  • Voltage - Supply (Vcc/Vdd): 9.9 V ~ 30 V
  • Duty Cycle: -
  • Frequency - Switching: 25kHz ~ 132.5kHz
  • Power (Watts): 75W
  • Fault Protection: Over Power, Over Temperature, Over Voltage
  • Control Features: -
  • Operating Temperature: -40°C ~ 150°C (TJ)
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
  • Mounting Type: Surface Mount
패키지: 8-SOIC (0.154", 3.90mm Width)
재고3,504
CBTS3257DB,118
NXP

IC 4BIT 1OF2 MUX/DEMUX 16SSOP

  • Type: Multiplexer/Demultiplexer
  • Circuit: 4 x 2:1
  • Independent Circuits: 1
  • Current - Output High, Low: -
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 16-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 16-SSOP
패키지: 16-SSOP (0.209", 5.30mm Width)
재고4,320
N74F543D,623
NXP

IC TRANSCVR TRI-ST 8BIT 24SOIC

  • Logic Type: Transceiver, Non-Inverting
  • Number of Elements: 1
  • Number of Bits per Element: 8
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 3mA, 24mA; 15mA, 64mA
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 24-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 24-SO
패키지: 24-SOIC (0.295", 7.50mm Width)
재고4,080
PCA9559PW,112
NXP

IC I2C EEPROM 6BIT DIPSW 20TSSOP

  • Applications: PC's, PDA's
  • Interface: I2C
  • Voltage - Supply: 3 V ~ 3.6 V
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
  • Mounting Type: Surface Mount
패키지: 20-TSSOP (0.173", 4.40mm Width)
재고6,272
TJA1049T/3J
NXP

IC TRANSCEIVER CAN HS 8SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 300mV
  • Data Rate: 5Mbps
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
패키지: 8-SOIC (0.154", 3.90mm Width)
재고6,736
UDA1341TS/N1,512
NXP

IC AUDIO CODEC MINIDISC 28-SSOP

  • Type: Stereo Audio
  • Data Interface: Serial
  • Resolution (Bits): 20 b
  • Number of ADCs / DACs: 4 / 2
  • Sigma Delta: Yes
  • S/N Ratio, ADCs / DACs (db) Typ: 100 / 100
  • Dynamic Range, ADCs / DACs (db) Typ: -
  • Voltage - Supply, Analog: 2.4 V ~ 3.6 V
  • Voltage - Supply, Digital: 2.4 V ~ 3.6 V
  • Operating Temperature: -20°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 28-SSOP (0.209", 5.30mm Width)
  • Supplier Device Package: 28-SSOP
패키지: 28-SSOP (0.209", 5.30mm Width)
재고6,688
KMPC8250ACZUMHBC
NXP

IC MPU MPC82XX 266MHZ 408TBGA

  • Core Processor: PowerPC G2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 266MHz
  • Co-Processors/DSP: Communications; RISC CPM
  • RAM Controllers: DRAM, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100 Mbps (3)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 480-LBGA
  • Supplier Device Package: 408-TBGA (37.5x37.5)
패키지: 480-LBGA
재고5,472
hot MPC8541EPXAQF
NXP

IC MPU MPC85XX 1.0GHZ 783FCBGA

  • Core Processor: PowerPC e500
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: Security; SEC
  • RAM Controllers: DDR, SDRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (2)
  • SATA: -
  • USB: -
  • Voltage - I/O: 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
패키지: 783-BBGA, FCBGA
재고4,240
P1016NSE5FFB
NXP

IC MPU Q OR IQ 667MHZ 561TEBGA1

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 667MHz
  • Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
  • RAM Controllers: DDR2, DDR3
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 125°C (TA)
  • Security Features: Cryptography, Random Number Generator
  • Package / Case: 561-FBGA
  • Supplier Device Package: 561-TEPBGA1 (23x23)
패키지: 561-FBGA
재고6,256
P89LPC925FN,129
NXP

IC MCU 8BIT 8KB FLASH 20DIP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 18MHz
  • Connectivity: I2C, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 4x8b; D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-DIP (0.300", 7.62mm)
  • Supplier Device Package: 20-DIP
패키지: 20-DIP (0.300", 7.62mm)
재고6,272
LPC1813JBD144E
NXP

IC MCU 32BIT 512KB FLASH 144LQFP

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 83
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 16K x 8
  • RAM Size: 104K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: -
패키지: 144-LQFP
재고6,288
hot MC908QY1CDTER
NXP

IC MCU 8BIT 1.5KB FLASH 16TSSOP

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LVD, POR, PWM
  • Number of I/O: 13
  • Program Memory Size: 1.5KB (1.5K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: 16-TSSOP (0.173", 4.40mm Width)
재고5,712
hot MC9S08DZ16AMLF
NXP

IC MCU 8BIT 16KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP
재고15,000
MC912DG128ACPVE
NXP

IC MCU 16BIT 128KB FLASH 112LQFP

  • Core Processor: CPU12
  • Core Size: 16-Bit
  • Speed: 8MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 69
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 16x8/10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 112-LQFP
  • Supplier Device Package: 112-LQFP (20x20)
패키지: 112-LQFP
재고8,388
ADC1207S080HW/C1,1
NXP

IC ADC 12BIT PAR 80MHZ 48-HTQFP

  • Number of Bits: 12
  • Sampling Rate (Per Second): 80M
  • Number of Inputs: 1
  • Input Type: Differential
  • Data Interface: Parallel
  • Configuration: S/H-ADC
  • Ratio - S/H:ADC: 1:1
  • Number of A/D Converters: 1
  • Architecture: -
  • Reference Type: Internal
  • Voltage - Supply, Analog: 5V
  • Voltage - Supply, Digital: 5V
  • Features: -
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 48-TQFP Exposed Pad
  • Supplier Device Package: 48-HTQFP (7x7)
  • Mounting Type: -
패키지: 48-TQFP Exposed Pad
재고5,008
PCF8523TS/1,118
NXP

IC RTC CLK/CALENDAR I2C 14-TSSOP

  • Type: Clock/Calendar
  • Features: Alarm, Leap Year, Watchdog Timer
  • Memory Size: -
  • Time Format: HH:MM:SS (12/24 hr)
  • Date Format: YY-MM-DD-dd
  • Interface: I2C, 2-Wire Serial
  • Voltage - Supply: 1.6 V ~ 5.5 V
  • Voltage - Supply, Battery: 1.8 V ~ 5.5 V
  • Current - Timekeeping (Max): 0.5µA @ 2V ~ 5V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 14-TSSOP
패키지: 14-TSSOP (0.173", 4.40mm Width)
재고7,456
MCZ33903DP5EK
NXP

SYSTEM BASIS CHIP 2X 5.0 V/400M

  • Applications: System Basis Chip
  • Interface: CAN, LIN
  • Voltage - Supply: 5.5 V ~ 28 V
  • Package / Case: -
  • Supplier Device Package: -
  • Mounting Type: -
패키지: -
재고4,608
S912XDP512J1CAAR
NXP

3 CAN 512 FLASH 32K RAM

  • Core Processor: HCS12X
  • Core Size: 16-Bit
  • Speed: 80MHz
  • Connectivity: CANbus, I²C, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 59
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.5 V
  • Data Converters: A/D 8x10b, 16x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 80-QFP
  • Supplier Device Package: 80-QFP (14x14)
패키지: 80-QFP
재고3,888
MC9S08LL16CGTR
NXP

S08LL 8-BIT MCU S08 CORE 16KB

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I²C, SCI, SPI
  • Peripherals: LCD, LVD, POR, PWM, WDT
  • Number of I/O: 31
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN-EP (7x7)
패키지: 48-VFQFN Exposed Pad
재고5,472
FS32K146HFT0MLQR
NXP

IC MCU 32BIT 1MB FLASH 144LQFP

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit Single-Core
  • Speed: 80MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 128
  • Program Memory Size: 1MB (1M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 24x12b SAR; D/A1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
패키지: -
Request a Quote
S9KEAZN8ACTGR
NXP

KINETIS E 32-BIT MCU, ARM CORTEX

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit
  • Speed: 48MHz
  • Connectivity: I2C, LINbus, SPI, UART/USART
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 14
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 1K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 16x12b SAR
  • Oscillator Type: External, Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 16-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 16-TSSOP
패키지: -
Request a Quote
PCA2001U-AC-1-026
NXP

IC WATCH CIRCUIT WAFER

  • Type: Watch Circuit
  • Applications: Wrist Watches
  • Mounting Type: Surface Mount
  • Package / Case: Die
  • Supplier Device Package: Wafer
패키지: -
Request a Quote
TDA8924TH-N2-118
NXP

IC CLASS-D POWER AMP 24-HSOP

  • Type: Class D
  • Output Type: 2-Channel (Stereo)
  • Max Output Power x Channels @ Load: 120W x 2 @ 2Ohm
  • Voltage - Supply: ±12.5V ~ 30V
  • Features: Thermal Shutdown Protection
  • Mounting Type: Surface Mount
  • Operating Temperature: -
  • Supplier Device Package: 24-HSOP
  • Package / Case: 24-BSOP (0.433", 11.00mm Width) Exposed Pad
패키지: -
Request a Quote