페이지 817 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRF9060NBR1	NXP	FET RF 65V 945MHZ TO272-2 Transistor Type: LDMOS Frequency: 945MHz Gain: 18dB Voltage - Test: 26V Current Rating: - Noise Figure: - Current - Test: 450mA Power - Output: 60W Voltage - Rated: 65V Package / Case: TO-272-2 Supplier Device Package: TO-272-2	패키지: TO-272-2	재고7,984
A2I25H060NR1	NXP	IC RF LDMOS AMP Transistor Type: LDMOS (Dual) Frequency: 2.59GHz Gain: 26.1dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 26mA Power - Output: 10.5W Voltage - Rated: 65V Package / Case: TO-270-17 Variant, Flat Leads Supplier Device Package: TO-270WB-17	패키지: TO-270-17 Variant, Flat Leads	재고7,424
MPS3904,126	NXP	TRANS NPN 40V 0.1A TO92 Transistor Type: NPN Current - Collector (Ic) (Max): 100mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA Current - Collector Cutoff (Max): 50nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V Power - Max: 500mW Frequency - Transition: 180MHz Operating Temperature: 150°C (TJ) Mounting Type: Through Hole Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads) Supplier Device Package: TO-92-3	패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)	재고6,176
TDA3629/YWU	NXP	IC LIGHT POSITION CTRLR 8-DIP Applications: Automotive Current - Supply: 6mA Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 105°C Mounting Type: Through Hole Package / Case: 8-DIP (0.300", 7.62mm) Supplier Device Package: 8-DIP	패키지: 8-DIP (0.300", 7.62mm)	재고6,608
MC10XS6325EK	NXP	IC SWITCH HIGH SIDE 32SOIC Switch Type: General Purpose Number of Outputs: 3 Ratio - Input:Output: - Output Configuration: High Side Output Type: - Interface: SPI Voltage - Load: 7 V ~ 18 V Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Current - Output (Max): 3.8A, 9A Rds On (Typ): 10 mOhm, 25 mOhm Input Type: - Features: Status Flag Fault Protection: Open Load Detect, Over Temperature Operating Temperature: -40°C ~ 125°C (TA) Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP	패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	재고4,800
N74F10N,602	NXP	IC GATE NAND 3CH 3-INP 14-DIP Logic Type: NAND Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 4.5 V ~ 5.5 V Current - Quiescent (Max): - Current - Output High, Low: 1mA, 20mA Logic Level - Low: 0.8V Logic Level - High: 2V Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF Operating Temperature: 0°C ~ 70°C Mounting Type: Through Hole Supplier Device Package: 14-DIP Package / Case: 14-DIP (0.300", 7.62mm)	패키지: 14-DIP (0.300", 7.62mm)	재고6,048
74ALVT162244DGG,51	NXP	IC BUFF DVR TRI-ST 16BIT 48TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 4 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 12mA, 12mA Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	패키지: 48-TFSOP (0.240", 6.10mm Width)	재고5,888
PCA8574APW,118	NXP	IC I/O EXPANDER I2C 8B 16TSSOP Number of I/O: 8 Interface: I2C Interrupt Output: Yes Features: POR Output Type: Push-Pull Current - Output Source/Sink: 100µA, 25mA Clock Frequency: 400kHz Voltage - Supply: 2.3 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-TSSOP	패키지: 16-TSSOP (0.173", 4.40mm Width)	재고7,472
MPC8572EPXAVNE	NXP	IC MPU MPC85XX 1.5GHZ 1023FCBGA Core Processor: PowerPC e500 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.5GHz Co-Processors/DSP: Signal Processing; SPE, Security; SEC RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (4) SATA: - USB: - Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 1023-BFBGA, FCBGA Supplier Device Package: 1023-FCPBGA (33x33)	패키지: 1023-BFBGA, FCBGA	재고4,640
MPC860SRZQ50D4R2	NXP	IC MPU MPC8XX 50MHZ 357BGA Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (4) SATA: - USB: - Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 95°C (TA) Security Features: - Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BBGA	재고5,344
MC68EN360ZP33L	NXP	IC MPU M683XX 33MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BGA	재고2,112
T1040NSE7MQB	NXP	IC SOC 4CORE 1200MHZ SW 780FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.4GHz Co-Processors/DSP: - RAM Controllers: DDR3L/4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (12) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23x23)	패키지: 780-FBGA, FCBGA	재고2,752
MC68711E20CFUE4	NXP	IC MCU 8BIT 20KB OTP 64QFP Core Processor: HC11 Core Size: 8-Bit Speed: 4MHz Connectivity: SCI, SPI Peripherals: POR, WDT Number of I/O: 38 Program Memory Size: 20KB (20K x 8) Program Memory Type: OTP EEPROM Size: 512 x 8 RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	패키지: 64-QFP	재고24,144
MVF50NN152CMK40	NXP	IC MCU 32BIT ROMLESS 364MAPBGA Core Processor: ARM? Cortex?-A5 Core Size: 32-Bit Single-Core Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG Peripherals: DMA, LVD, WDT Number of I/O: - Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 1.5MB Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V Data Converters: A/D Dual x 12b, D/A Dual x 12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고2,000
MC9S08QE8CFM	NXP	IC MCU 8BIT 8KB FLASH 32QFN Core Processor: S08 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, PWM, WDT Number of I/O: 26 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 10x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 32-VFQFN Exposed Pad Supplier Device Package: 32-QFN (4x4)	패키지: 32-VFQFN Exposed Pad	재고7,072
S9S12ZVL32F0VLF	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고7,040
LPC822M101JDH20J	NXP	IC MCU 32BIT 16KB FLASH 20TSSOP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 30MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT Number of I/O: 16 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고4,032
MKE14F512VLL16	NXP	IC MCU 32BIT 512KB FLASH 100LQFP Core Processor: ARM? Cortex?-M4F Core Size: 32-Bit Speed: 168MHz Connectivity: I2C, SPI, UART/USART Peripherals: DMA, LVD, PWM, WDT Number of I/O: 89 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 3x12b, D/A 1x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고7,140
MKL26Z128VLH4	NXP	IC MCU 32BIT 128KB FLASH 64LQFP Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT Number of I/O: 50 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 16K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D - 16bit, D/A - 12bit Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고4,496
MMA8210EGR2	NXP	ACCEL 100G DSI/SPI 16SOIC Type: Digital Axis: X Acceleration Range: ±100g Sensitivity (LSB/g): 4 Sensitivity (mV/g): - Bandwidth: - Output Type: DSI, SPI Voltage - Supply: 6.3 V ~ 30 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고3,096
MMA2202EGR2	NXP	ACCELEROMETER 56.3G ANAL 16SOIC Type: Analog Axis: X Acceleration Range: ±56.3g Sensitivity (LSB/g): - Sensitivity (mV/g): 40 Bandwidth: 400Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고8,946
MMA7260QT	NXP	ACCELEROMETER 1.5-6G ANAL 16QFN Type: Analog Axis: X, Y, Z Acceleration Range: ±1.5g, 2g, 4g, 6g Sensitivity (LSB/g): - Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g) Bandwidth: 350Hz (X,Y), 150Hz (Z) Output Type: Analog Voltage Voltage - Supply: 2.2 V ~ 3.6 V Features: Selectable Scale, Sleep Mode Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-LQFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	패키지: 16-LQFN Exposed Pad	재고5,832
OM5569/NT322EM	NXP	NTAG 12C PLUS EXPLORER KIT Type: Near Field Communication Frequency: 13.56MHz For Use With/Related Products: NT3H1101 Supplied Contents: Board	패키지: -	재고6,120
BGU7003,132	NXP	IC WIDEBAND AMP LN MMIC 6-XSON Frequency: 40MHz ~ 6GHz P1dB: -20.1dBm Gain: - Noise Figure: 0.8dB RF Type: General Purpose Voltage - Supply: 2.2 V ~ 2.85 V Current - Supply: 3mA ~ 15mA Test Frequency: 1.575GHz Package / Case: 6-XFDFN Supplier Device Package: 6-XSON, SOT891 (1x1)	패키지: 6-XFDFN	재고3,060
LX2120CC72232B	NXP	LAYERSCAPE 64-BIT ARM CORTEX-A72 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCPBGA (40x40)	패키지: -	Request a Quote
S32G378ASAK1VUCR	NXP	MICROPROCESSORS - MPU 4X CORTEX- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7 Number of Cores/Bus Width: 4 Core, 32/64-Bit Speed: 400MHz, 1GHz Co-Processors/DSP: Multimedia; NEON RAM Controllers: DDR3L, LPDDR4 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 2.5Gbps (3) SATA: - USB: USB 2.0 OTG (1) Voltage - I/O: 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC Package / Case: 525-FBGA, FCBGA Supplier Device Package: 525-FCPBGA (19x19)	패키지: -	Request a Quote
FB32K146HFT0VLHT	NXP	S32K146, M4F, FLASH 1M, RAM 128K Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
SAF775DEL-N208-K1K	NXP	CAR RADIO TUNER & AUDIO DSP Type: Audio, Car Signal Processor Interface: - Clock Rate: - Non-Volatile Memory: - On-Chip RAM: - Voltage - I/O: - Voltage - Core: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 267-LFBGA Supplier Device Package: 267-LFBGA (17x17)	패키지: -	Request a Quote

MRF9060NBR1

NXP

FET RF 65V 945MHZ TO272-2

Transistor Type: LDMOS
Frequency: 945MHz
Gain: 18dB
Voltage - Test: 26V
Current Rating: -
Noise Figure: -
Current - Test: 450mA
Power - Output: 60W
Voltage - Rated: 65V
Package / Case: TO-272-2
Supplier Device Package: TO-272-2

패키지: TO-272-2

재고7,984

A2I25H060NR1

NXP

IC RF LDMOS AMP

Transistor Type: LDMOS (Dual)
Frequency: 2.59GHz
Gain: 26.1dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 26mA
Power - Output: 10.5W
Voltage - Rated: 65V
Package / Case: TO-270-17 Variant, Flat Leads
Supplier Device Package: TO-270WB-17

패키지: TO-270-17 Variant, Flat Leads

재고7,424

MPS3904,126

NXP

TRANS NPN 40V 0.1A TO92

Transistor Type: NPN
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Current - Collector Cutoff (Max): 50nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Power - Max: 500mW
Frequency - Transition: 180MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
Supplier Device Package: TO-92-3

패키지: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)

재고6,176

TDA3629/YWU

NXP

IC LIGHT POSITION CTRLR 8-DIP

Applications: Automotive
Current - Supply: 6mA
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Supplier Device Package: 8-DIP

패키지: 8-DIP (0.300", 7.62mm)

재고6,608

MC10XS6325EK

NXP

IC SWITCH HIGH SIDE 32SOIC

Switch Type: General Purpose
Number of Outputs: 3
Ratio - Input:Output: -
Output Configuration: High Side
Output Type: -
Interface: SPI
Voltage - Load: 7 V ~ 18 V
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Current - Output (Max): 3.8A, 9A
Rds On (Typ): 10 mOhm, 25 mOhm
Input Type: -
Features: Status Flag
Fault Protection: Open Load Detect, Over Temperature
Operating Temperature: -40°C ~ 125°C (TA)
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP

패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

재고4,800

N74F10N,602

NXP

IC GATE NAND 3CH 3-INP 14-DIP

Logic Type: NAND Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 4.5 V ~ 5.5 V
Current - Quiescent (Max): -
Current - Output High, Low: 1mA, 20mA
Logic Level - Low: 0.8V
Logic Level - High: 2V
Max Propagation Delay @ V, Max CL: 5ns @ 5V, 50pF
Operating Temperature: 0°C ~ 70°C
Mounting Type: Through Hole
Supplier Device Package: 14-DIP
Package / Case: 14-DIP (0.300", 7.62mm)

패키지: 14-DIP (0.300", 7.62mm)

재고6,048

74ALVT162244DGG,51

NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 4
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 12mA, 12mA
Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

패키지: 48-TFSOP (0.240", 6.10mm Width)

재고5,888

PCA8574APW,118

NXP

IC I/O EXPANDER I2C 8B 16TSSOP

Number of I/O: 8
Interface: I2C
Interrupt Output: Yes
Features: POR
Output Type: Push-Pull
Current - Output Source/Sink: 100µA, 25mA
Clock Frequency: 400kHz
Voltage - Supply: 2.3 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-TSSOP

패키지: 16-TSSOP (0.173", 4.40mm Width)

재고7,472

MPC8572EPXAVNE

NXP

IC MPU MPC85XX 1.5GHZ 1023FCBGA

Core Processor: PowerPC e500
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.5GHz
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 1023-BFBGA, FCBGA
Supplier Device Package: 1023-FCPBGA (33x33)

패키지: 1023-BFBGA, FCBGA

재고4,640

MPC860SRZQ50D4R2

NXP

IC MPU MPC8XX 50MHZ 357BGA

Core Processor: MPC8xx
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 50MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (4)
SATA: -
USB: -
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 95°C (TA)
Security Features: -
Package / Case: 357-BBGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BBGA

재고5,344

MC68EN360ZP33L

NXP

IC MPU M683XX 33MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BGA

재고2,112

T1040NSE7MQB

NXP

IC SOC 4CORE 1200MHZ SW 780FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 4 Core, 64-Bit
Speed: 1.4GHz
Co-Processors/DSP: -
RAM Controllers: DDR3L/4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (12)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 780-FBGA, FCBGA
Supplier Device Package: 780-FCPBGA (23x23)

패키지: 780-FBGA, FCBGA

재고2,752

MC68711E20CFUE4

NXP

IC MCU 8BIT 20KB OTP 64QFP

Core Processor: HC11
Core Size: 8-Bit
Speed: 4MHz
Connectivity: SCI, SPI
Peripherals: POR, WDT
Number of I/O: 38
Program Memory Size: 20KB (20K x 8)
Program Memory Type: OTP
EEPROM Size: 512 x 8
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

패키지: 64-QFP

재고24,144

MVF50NN152CMK40

NXP

IC MCU 32BIT ROMLESS 364MAPBGA

Core Processor: ARM? Cortex?-A5
Core Size: 32-Bit Single-Core
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
Peripherals: DMA, LVD, WDT
Number of I/O: -
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 1.5MB
Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
Data Converters: A/D Dual x 12b, D/A Dual x 12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고2,000

MC9S08QE8CFM

NXP

IC MCU 8BIT 8KB FLASH 32QFN

Core Processor: S08
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, PWM, WDT
Number of I/O: 26
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 10x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 32-VFQFN Exposed Pad
Supplier Device Package: 32-QFN (4x4)

패키지: 32-VFQFN Exposed Pad

재고7,072

S9S12ZVL32F0VLF

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: I2C, IrDA, LIN, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 5.5 V ~ 18 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고7,040

LPC822M101JDH20J

NXP

IC MCU 32BIT 16KB FLASH 20TSSOP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 30MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number of I/O: 16
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고4,032

MKE14F512VLL16

NXP

IC MCU 32BIT 512KB FLASH 100LQFP

Core Processor: ARM? Cortex?-M4F
Core Size: 32-Bit
Speed: 168MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Number of I/O: 89
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 3x12b, D/A 1x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고7,140

MKL26Z128VLH4

NXP

IC MCU 32BIT 128KB FLASH 64LQFP

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, LIN, SPI, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT
Number of I/O: 50
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 16K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D - 16bit, D/A - 12bit
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고4,496

MMA8210EGR2

NXP

ACCEL 100G DSI/SPI 16SOIC

Type: Digital
Axis: X
Acceleration Range: ±100g
Sensitivity (LSB/g): 4
Sensitivity (mV/g): -
Bandwidth: -
Output Type: DSI, SPI
Voltage - Supply: 6.3 V ~ 30 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고3,096

MMA2202EGR2

NXP

ACCELEROMETER 56.3G ANAL 16SOIC

Type: Analog
Axis: X
Acceleration Range: ±56.3g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 40
Bandwidth: 400Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고8,946

MMA7260QT

NXP

ACCELEROMETER 1.5-6G ANAL 16QFN

Type: Analog
Axis: X, Y, Z
Acceleration Range: ±1.5g, 2g, 4g, 6g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g)
Bandwidth: 350Hz (X,Y), 150Hz (Z)
Output Type: Analog Voltage
Voltage - Supply: 2.2 V ~ 3.6 V
Features: Selectable Scale, Sleep Mode
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-LQFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

패키지: 16-LQFN Exposed Pad

재고5,832

OM5569/NT322EM

NXP

NTAG 12C PLUS EXPLORER KIT

Type: Near Field Communication
Frequency: 13.56MHz
For Use With/Related Products: NT3H1101
Supplied Contents: Board

패키지: -

재고6,120

BGU7003,132

NXP

IC WIDEBAND AMP LN MMIC 6-XSON

Frequency: 40MHz ~ 6GHz
P1dB: -20.1dBm
Gain: -
Noise Figure: 0.8dB
RF Type: General Purpose
Voltage - Supply: 2.2 V ~ 2.85 V
Current - Supply: 3mA ~ 15mA
Test Frequency: 1.575GHz
Package / Case: 6-XFDFN
Supplier Device Package: 6-XSON, SOT891 (1x1)

패키지: 6-XFDFN

재고3,060

LX2120CC72232B

NXP

LAYERSCAPE 64-BIT ARM CORTEX-A72

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCPBGA (40x40)

패키지: -

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S32G378ASAK1VUCR

NXP

MICROPROCESSORS - MPU 4X CORTEX-

Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
Number of Cores/Bus Width: 4 Core, 32/64-Bit
Speed: 400MHz, 1GHz
Co-Processors/DSP: Multimedia; NEON
RAM Controllers: DDR3L, LPDDR4
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 2.5Gbps (3)
SATA: -
USB: USB 2.0 OTG (1)
Voltage - I/O: 1.8V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
Package / Case: 525-FBGA, FCBGA
Supplier Device Package: 525-FCPBGA (19x19)

패키지: -

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FB32K146HFT0VLHT

NXP

S32K146, M4F, FLASH 1M, RAM 128K

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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SAF775DEL-N208-K1K

NXP

CAR RADIO TUNER & AUDIO DSP

Type: Audio, Car Signal Processor
Interface: -
Clock Rate: -
Non-Volatile Memory: -
On-Chip RAM: -
Voltage - I/O: -
Voltage - Core: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 267-LFBGA
Supplier Device Package: 267-LFBGA (17x17)

패키지: -

Request a Quote