페이지 842 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
PBSS3540E,115	NXP	TRANS PNP 40V 0.5A SC75 Transistor Type: PNP Current - Collector (Ic) (Max): 500mA Voltage - Collector Emitter Breakdown (Max): 40V Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA Current - Collector Cutoff (Max): 100nA (ICBO) DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V Power - Max: 250mW Frequency - Transition: 300MHz Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: SC-75, SOT-416 Supplier Device Package: SC-75	패키지: SC-75, SOT-416	재고3,344
BFU530R	NXP	TRANS RF NPN 12V 40MA SOT-143B Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 12V Frequency - Transition: 11GHz Noise Figure (dB Typ @ f): 0.6dB @ 900MHz Gain: 21.5dB Power - Max: 450mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V Current - Collector (Ic) (Max): 40mA Operating Temperature: -40°C ~ 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	패키지: TO-253-4, TO-253AA	재고7,376
BZX284-C15,135	NXP	DIODE ZENER 15V 400MW SOD2 Voltage - Zener (Nom) (Vz): 15V Tolerance: ±5% Power - Max: 400mW Impedance (Max) (Zzt): 15 Ohms Current - Reverse Leakage @ Vr: 50nA @ 10.5V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: -65°C ~ 150°C Mounting Type: Surface Mount Package / Case: SOD-110 Supplier Device Package: SOD110	패키지: SOD-110	재고5,760
PCA9306DP1,125	NXP	IC LEVEL TRANSLATOR 8-TSSOP Translator Type: Voltage Level Channel Type: Bidirectional Number of Circuits: 1 Channels per Circuit: 2 Voltage - VCCA: 1V ~ 3.6V Voltage - VCCB: 1.8V ~ 5.5V Input Signal: - Output Signal: - Output Type: Open Drain Data Rate: - Operating Temperature: -40°C ~ 85°C (TA) Features: Auto-Direction Sensing Mounting Type: Surface Mount Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	재고309,120
74LVC841APW,118	NXP	IC 10BIT TRANSP LATCH 24TSSOP Logic Type: D-Type Transparent Latch Circuit: 10:10 Output Type: Tri-State Voltage - Supply: 2.7 V ~ 3.6 V Independent Circuits: 1 Delay Time - Propagation: 1.5ns Current - Output High, Low: 24mA, 24mA Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	패키지: 24-TSSOP (0.173", 4.40mm Width)	재고4,640
74HC75N,652	NXP	IC LATCH QUAD BISTABLE 16DIP Logic Type: D-Type Transparent Latch Circuit: 2:2 Output Type: Differential Voltage - Supply: 2 V ~ 6 V Independent Circuits: 2 Delay Time - Propagation: 11ns Current - Output High, Low: 5.2mA, 5.2mA Operating Temperature: -40°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm) Supplier Device Package: 16-DIP	패키지: 16-DIP (0.300", 7.62mm)	재고3,440
74ABT543APW,118	NXP	IC TRANSCVR 3ST 8BIT 24TSSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 24-TSSOP	패키지: 24-TSSOP (0.173", 4.40mm Width)	재고7,280
M83241G13	NXP	IC C1K 450MHZ VOIP 448BGA Function: - Interface: - Number of Circuits: - Voltage - Supply: - Current - Supply: - Power (Watts): - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	재고7,328
KMPC8343CVRAGDB	NXP	IC MPU MPC83XX 400MHZ 620BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 620-BBGA Exposed Pad Supplier Device Package: 620-PBGA (29x29)	패키지: 620-BBGA Exposed Pad	재고2,096
MPC8360VVAGDG	NXP	IC MPU MPC83XX 400MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	패키지: 740-LBGA	재고3,984
MC68MH360ZP33LR2	NXP	IC MPU M683XX 33MHZ 357BGA Core Processor: CPU32+ Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 33MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10 Mbps (1) SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 357-BGA Supplier Device Package: 357-PBGA (25x25)	패키지: 357-BGA	재고6,352
KMPC8248VRTMFA	NXP	IC MPU MPC82XX 400MHZ 516BGA Core Processor: PowerPC G2_LE Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (2) SATA: - USB: USB 2.0 (1) Voltage - I/O: 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 516-BBGA Supplier Device Package: 516-FPBGA (27x27)	패키지: 516-BBGA	재고5,520
P5021NSE7VNC	NXP	IC SOC 64BIT 2X2.0GHZ 1295FCBGA Core Processor: PowerPC e5500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 1 Gbps (10), 10 Gbps (2) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (2) Voltage - I/O: 1.0V, 1.1V Operating Temperature: 0°C ~ 105°C (TA) Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage Package / Case: 1295-BBGA, FCBGA Supplier Device Package: 1295-FCPBGA (37.5x37.5)	패키지: 1295-BBGA, FCBGA	재고8,232
P2010NSE2HHC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: 0°C ~ 125°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고4,576
P1010NXN5DFB	NXP	IC MPU Q OR IQ 1.0GHZ 425TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: - RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: SATA 3Gbps (2) USB: USB 2.0 + PHY (1) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: - Package / Case: 425-FBGA Supplier Device Package: 425-TEPBGA I (19x19)	패키지: 425-FBGA	재고6,672
P2010NXN2HFC	NXP	IC MPU Q OR IQ 1.2GHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.2GHz Co-Processors/DSP: - RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고5,536
MCHLC705KJ1CDWE	NXP	IC MCU 8BIT 1.2KB OTP 16SOIC Core Processor: HC05 Core Size: 8-Bit Speed: 4MHz Connectivity: - Peripherals: POR, WDT Number of I/O: 10 Program Memory Size: 1.2KB (1.2K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 64 x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고3,824
MC908KX2VDWE	NXP	IC MCU 8BIT 2KB FLASH 16SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI Peripherals: LVD, POR, PWM Number of I/O: 13 Program Memory Size: 2KB (2K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 192 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고3,888
MC9S12DG128MPVR2	NXP	IC MCU 16BIT 128KB FLASH 112LQFP Core Processor: HCS12 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: PWM, WDT Number of I/O: 91 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 112-LQFP Supplier Device Package: 112-LQFP (20x20)	패키지: 112-LQFP	재고4,944
LPC1830FET180,551	NXP	IC MCU 32BIT ROMLESS 180TFBGA Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Number of I/O: 118 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 200K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 180-TFBGA Supplier Device Package: 180-TFBGA (12x12)	패키지: 180-TFBGA	재고7,424
LPC11U13FBD48/201,	NXP	IC MCU 32BIT 24KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 40 Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 6K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고6,224
MC68908GZ8CFAE	NXP	IC MCU 8BIT 8KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고9,252
MC32PF3000A3EP	NXP	POWER MANAGEMENT IC I.MX7 PRE- Applications: i.MX Processors Current - Supply: - Voltage - Supply: 2.8 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN (7x7)	패키지: 48-VFQFN Exposed Pad	재고8,172
S9S08SL16F1VTL	NXP	8-BIT MCU S08 CORE 16KB FLASH Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I²C, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 22 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 256 x 8 RAM Size: 512 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: External Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 28-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 28-TSSOP	패키지: 28-TSSOP (0.173", 4.40mm Width)	재고4,368
NX30P0121UKZ	NXP	NX30P0121, HIGH-VOLTAGE BACK-TO- Switch Type: General Purpose Number of Outputs: 1 Ratio - Input:Output: 1:1 Output Configuration: - Output Type: N-Channel Interface: - Voltage - Load: 2.5V ~ 20V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 3A Rds On (Typ): 54mOhm Input Type: - Features: - Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO Operating Temperature: -40°C ~ 85°C (TA) Package / Case: 12-UFBGA, WLCSP Supplier Device Package: 12-WLCSP (1.65x1.25)	패키지: 12-UFBGA, WLCSP	재고95,028
LPC4088FBD208K	NXP	IC MCU 32BIT 512KB FLASH 208LQFP Core Processor: ARM® Cortex®-M4 Core Size: 32-Bit Single-Core Speed: 120MHz Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT Number of I/O: 165 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V Data Converters: A/D 8x12b SAR; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 208-LQFP Supplier Device Package: 208-LQFP (28x28)	패키지: -	재고894
A5G26S004NT6	NXP	RF MOSFET DFN Transistor Type: - Frequency: - Gain: - Voltage - Test: - Current Rating: - Noise Figure: - Current - Test: - Power - Output: - Voltage - Rated: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
TEF5100EL-V1Y	NXP	IC Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote

PBSS3540E,115

NXP

TRANS PNP 40V 0.5A SC75

Transistor Type: PNP
Current - Collector (Ic) (Max): 500mA
Voltage - Collector Emitter Breakdown (Max): 40V
Vce Saturation (Max) @ Ib, Ic: 350mV @ 50mA, 500mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 150 @ 100mA, 2V
Power - Max: 250mW
Frequency - Transition: 300MHz
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: SC-75, SOT-416
Supplier Device Package: SC-75

패키지: SC-75, SOT-416

재고3,344

BFU530R

NXP

TRANS RF NPN 12V 40MA SOT-143B

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 12V
Frequency - Transition: 11GHz
Noise Figure (dB Typ @ f): 0.6dB @ 900MHz
Gain: 21.5dB
Power - Max: 450mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 10mA, 8V
Current - Collector (Ic) (Max): 40mA
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

패키지: TO-253-4, TO-253AA

재고7,376

BZX284-C15,135

NXP

DIODE ZENER 15V 400MW SOD2

Voltage - Zener (Nom) (Vz): 15V
Tolerance: ±5%
Power - Max: 400mW
Impedance (Max) (Zzt): 15 Ohms
Current - Reverse Leakage @ Vr: 50nA @ 10.5V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -65°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: SOD-110
Supplier Device Package: SOD110

패키지: SOD-110

재고5,760

PCA9306DP1,125

NXP

IC LEVEL TRANSLATOR 8-TSSOP

Translator Type: Voltage Level
Channel Type: Bidirectional
Number of Circuits: 1
Channels per Circuit: 2
Voltage - VCCA: 1V ~ 3.6V
Voltage - VCCB: 1.8V ~ 5.5V
Input Signal: -
Output Signal: -
Output Type: Open Drain
Data Rate: -
Operating Temperature: -40°C ~ 85°C (TA)
Features: Auto-Direction Sensing
Mounting Type: Surface Mount
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

패키지: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

재고309,120

74LVC841APW,118

NXP

IC 10BIT TRANSP LATCH 24TSSOP

Logic Type: D-Type Transparent Latch
Circuit: 10:10
Output Type: Tri-State
Voltage - Supply: 2.7 V ~ 3.6 V
Independent Circuits: 1
Delay Time - Propagation: 1.5ns
Current - Output High, Low: 24mA, 24mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

패키지: 24-TSSOP (0.173", 4.40mm Width)

재고4,640

74HC75N,652

NXP

IC LATCH QUAD BISTABLE 16DIP

Logic Type: D-Type Transparent Latch
Circuit: 2:2
Output Type: Differential
Voltage - Supply: 2 V ~ 6 V
Independent Circuits: 2
Delay Time - Propagation: 11ns
Current - Output High, Low: 5.2mA, 5.2mA
Operating Temperature: -40°C ~ 125°C
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)
Supplier Device Package: 16-DIP

패키지: 16-DIP (0.300", 7.62mm)

재고3,440

74ABT543APW,118

NXP

IC TRANSCVR 3ST 8BIT 24TSSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 24-TSSOP

패키지: 24-TSSOP (0.173", 4.40mm Width)

재고7,280

M83241G13

NXP

IC C1K 450MHZ VOIP 448BGA

Function: -
Interface: -
Number of Circuits: -
Voltage - Supply: -
Current - Supply: -
Power (Watts): -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고7,328

KMPC8343CVRAGDB

NXP

IC MPU MPC83XX 400MHZ 620BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 620-BBGA Exposed Pad
Supplier Device Package: 620-PBGA (29x29)

패키지: 620-BBGA Exposed Pad

재고2,096

MPC8360VVAGDG

NXP

IC MPU MPC83XX 400MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

패키지: 740-LBGA

재고3,984

MC68MH360ZP33LR2

NXP

IC MPU M683XX 33MHZ 357BGA

Core Processor: CPU32+
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 33MHz
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10 Mbps (1)
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 357-BGA
Supplier Device Package: 357-PBGA (25x25)

패키지: 357-BGA

재고6,352

KMPC8248VRTMFA

NXP

IC MPU MPC82XX 400MHZ 516BGA

Core Processor: PowerPC G2_LE
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (2)
SATA: -
USB: USB 2.0 (1)
Voltage - I/O: 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 516-BBGA
Supplier Device Package: 516-FPBGA (27x27)

패키지: 516-BBGA

재고5,520

P5021NSE7VNC

NXP

IC SOC 64BIT 2X2.0GHZ 1295FCBGA

Core Processor: PowerPC e5500
Number of Cores/Bus Width: 2 Core, 64-Bit
Speed: 2.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 1 Gbps (10), 10 Gbps (2)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (2)
Voltage - I/O: 1.0V, 1.1V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
Package / Case: 1295-BBGA, FCBGA
Supplier Device Package: 1295-FCPBGA (37.5x37.5)

패키지: 1295-BBGA, FCBGA

재고8,232

P2010NSE2HHC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: 0°C ~ 125°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고4,576

P1010NXN5DFB

NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: -
RAM Controllers: DDR3, DDR3L
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: SATA 3Gbps (2)
USB: USB 2.0 + PHY (1)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: -
Package / Case: 425-FBGA
Supplier Device Package: 425-TEPBGA I (19x19)

패키지: 425-FBGA

재고6,672

P2010NXN2HFC

NXP

IC MPU Q OR IQ 1.2GHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 1.2GHz
Co-Processors/DSP: -
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고5,536

MCHLC705KJ1CDWE

NXP

IC MCU 8BIT 1.2KB OTP 16SOIC

Core Processor: HC05
Core Size: 8-Bit
Speed: 4MHz
Connectivity: -
Peripherals: POR, WDT
Number of I/O: 10
Program Memory Size: 1.2KB (1.2K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 64 x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고3,824

MC908KX2VDWE

NXP

IC MCU 8BIT 2KB FLASH 16SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI
Peripherals: LVD, POR, PWM
Number of I/O: 13
Program Memory Size: 2KB (2K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 192 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고3,888

MC9S12DG128MPVR2

NXP

IC MCU 16BIT 128KB FLASH 112LQFP

Core Processor: HCS12
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: PWM, WDT
Number of I/O: 91
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.35 V ~ 5.25 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 112-LQFP
Supplier Device Package: 112-LQFP (20x20)

패키지: 112-LQFP

재고4,944

LPC1830FET180,551

NXP

IC MCU 32BIT ROMLESS 180TFBGA

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Number of I/O: 118
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 200K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 180-TFBGA
Supplier Device Package: 180-TFBGA (12x12)

패키지: 180-TFBGA

재고7,424

LPC11U13FBD48/201,

NXP

IC MCU 32BIT 24KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 40
Program Memory Size: 24KB (24K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 6K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고6,224

MC68908GZ8CFAE

NXP

IC MCU 8BIT 8KB FLASH 48LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 37
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고9,252

MC32PF3000A3EP

NXP

POWER MANAGEMENT IC I.MX7 PRE-

Applications: i.MX Processors
Current - Supply: -
Voltage - Supply: 2.8 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN (7x7)

패키지: 48-VFQFN Exposed Pad

재고8,172

S9S08SL16F1VTL

NXP

8-BIT MCU S08 CORE 16KB FLASH

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 22
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 256 x 8
RAM Size: 512 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 28-TSSOP

패키지: 28-TSSOP (0.173", 4.40mm Width)

재고4,368

NX30P0121UKZ

NXP

NX30P0121, HIGH-VOLTAGE BACK-TO-

Switch Type: General Purpose
Number of Outputs: 1
Ratio - Input:Output: 1:1
Output Configuration: -
Output Type: N-Channel
Interface: -
Voltage - Load: 2.5V ~ 20V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3A
Rds On (Typ): 54mOhm
Input Type: -
Features: -
Fault Protection: Current Limiting (Adjustable), Over Temperature, Over Voltage, UVLO
Operating Temperature: -40°C ~ 85°C (TA)
Package / Case: 12-UFBGA, WLCSP
Supplier Device Package: 12-WLCSP (1.65x1.25)

패키지: 12-UFBGA, WLCSP

재고95,028

LPC4088FBD208K

NXP

IC MCU 32BIT 512KB FLASH 208LQFP

Core Processor: ARM® Cortex®-M4
Core Size: 32-Bit Single-Core
Speed: 120MHz
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, QEI, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O: 165
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Data Converters: A/D 8x12b SAR; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Supplier Device Package: 208-LQFP (28x28)

패키지: -

재고894

A5G26S004NT6

NXP

RF MOSFET DFN

Transistor Type: -
Frequency: -
Gain: -
Voltage - Test: -
Current Rating: -
Noise Figure: -
Current - Test: -
Power - Output: -
Voltage - Rated: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

TEF5100EL-V1Y

NXP

IC

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote