페이지 865 - NXP 제품 | Heisener Electronics
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NXP 제품

기록 26,590
페이지  865/950
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NX3008PBKT,115
NXP

MOSFET P-CH 30V SC-75

  • FET Type: P-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 30V
  • Current - Continuous Drain (Id) @ 25°C: 200mA (Ta)
  • Drive Voltage (Max Rds On, Min Rds On): 2.5V, 4.5V
  • Vgs(th) (Max) @ Id: 1.1V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs: 0.72nC @ 4.5V
  • Input Capacitance (Ciss) (Max) @ Vds: 46pF @ 15V
  • Vgs (Max): ±8V
  • FET Feature: -
  • Power Dissipation (Max): 250mW (Ta), 770mW (Tc)
  • Rds On (Max) @ Id, Vgs: 4.1 Ohm @ 200mA, 4.5V
  • Operating Temperature: -55°C ~ 150°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: SC-75
  • Package / Case: SC-75, SOT-416
패키지: SC-75, SOT-416
재고4,544
PH1955L,115
NXP

MOSFET N-CH 55V 40A LFPAK

  • FET Type: N-Channel
  • Technology: MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss): 55V
  • Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
  • Vgs(th) (Max) @ Id: 2V @ 1mA
  • Gate Charge (Qg) (Max) @ Vgs: 18nC @ 5V
  • Input Capacitance (Ciss) (Max) @ Vds: 1992pF @ 25V
  • Vgs (Max): ±15V
  • FET Feature: -
  • Power Dissipation (Max): 75W (Tc)
  • Rds On (Max) @ Id, Vgs: 17.3 mOhm @ 25A, 10V
  • Operating Temperature: -55°C ~ 175°C (TJ)
  • Mounting Type: Surface Mount
  • Supplier Device Package: LFPAK56, Power-SO8
  • Package / Case: SC-100, SOT-669
패키지: SC-100, SOT-669
재고2,352
hot MRF19085LR3
NXP

FET RF 65V 1.99GHZ NI-780

  • Transistor Type: LDMOS
  • Frequency: 1.93GHz ~ 1.99GHz
  • Gain: 13dB
  • Voltage - Test: 26V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 850mA
  • Power - Output: 18W
  • Voltage - Rated: 65V
  • Package / Case: NI-780
  • Supplier Device Package: NI-780
패키지: NI-780
재고6,880
MRF7S15100HSR3
NXP

FET RF 65V 1.51GHZ NI780S

  • Transistor Type: LDMOS
  • Frequency: 1.51GHz
  • Gain: 19.5dB
  • Voltage - Test: 28V
  • Current Rating: -
  • Noise Figure: -
  • Current - Test: 600mA
  • Power - Output: 23W
  • Voltage - Rated: 65V
  • Package / Case: NI-780S
  • Supplier Device Package: NI-780S
패키지: NI-780S
재고5,200
SSTV16857EV,151
NXP

IC REG DRIVER 14BIT 56VFBGA

  • Logic Type: Registered Buffer with SSTL_2 Compatible I/O for DDR
  • Supply Voltage: 2.3 V ~ 2.7 V
  • Number of Bits: 14
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Surface Mount
  • Package / Case: 56-VFBGA
  • Supplier Device Package: 56-VFBGA (4.5x7)
패키지: 56-VFBGA
재고2,832
N74F11N,602
NXP

IC GATE AND 3CH 3-INP 14-DIP

  • Logic Type: AND Gate
  • Number of Circuits: 3
  • Number of Inputs: 3
  • Features: -
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Current - Quiescent (Max): -
  • Current - Output High, Low: 1mA, 20mA
  • Logic Level - Low: 0.8V
  • Logic Level - High: 2V
  • Max Propagation Delay @ V, Max CL: 5.6ns @ 5V, 50pF
  • Operating Temperature: 0°C ~ 70°C
  • Mounting Type: Through Hole
  • Supplier Device Package: 14-DIP
  • Package / Case: 14-DIP (0.300", 7.62mm)
패키지: 14-DIP (0.300", 7.62mm)
재고4,944
74ALVCH16823DGG:11
NXP

IC D-TYPE POS TRG DUAL 56TSSOP

  • Function: Master Reset
  • Type: D-Type
  • Output Type: Tri-State
  • Number of Elements: 2
  • Number of Bits per Element: 9
  • Clock Frequency: 350MHz
  • Max Propagation Delay @ V, Max CL: 3.7ns @ 3.3V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 24mA, 24mA
  • Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
  • Current - Quiescent (Iq): -
  • Input Capacitance: 5pF
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 56-TFSOP (0.240", 6.10mm Width)
패키지: 56-TFSOP (0.240", 6.10mm Width)
재고5,616
PCA9555N,112
NXP

IC I/O EXPANDER I2C 16B 24DIP

  • Number of I/O: 16
  • Interface: I2C, SMBus
  • Interrupt Output: Yes
  • Features: POR
  • Output Type: Push-Pull
  • Current - Output Source/Sink: 10mA, 25mA
  • Clock Frequency: 400kHz
  • Voltage - Supply: 2.3 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 24-DIP (0.600", 15.24mm)
  • Supplier Device Package: 24-DIP
패키지: 24-DIP (0.600", 15.24mm)
재고3,568
PCA82C250T/N,115
NXP

IC CAN CNTRL INTERFACE SOT96-1

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: 150mV
  • Data Rate: -
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SO
패키지: 8-SOIC (0.154", 3.90mm Width)
재고3,088
NX3L1G66GW,125
NXP

IC ANALOG SWITCH SPST SOT353

  • Switch Circuit: SPST - NO
  • Multiplexer/Demultiplexer Circuit: 1:1
  • Number of Circuits: 1
  • On-State Resistance (Max): 750 mOhm
  • Channel-to-Channel Matching (ΔRon): -
  • Voltage - Supply, Single (V+): 1.4 V ~ 4.3 V
  • Voltage - Supply, Dual (V±): -
  • Switch Time (Ton, Toff) (Max): 23ns, 8ns
  • -3db Bandwidth: 60MHz
  • Charge Injection: 6pC
  • Channel Capacitance (CS(off), CD(off)): 35pF
  • Current - Leakage (IS(off)) (Max): 10nA
  • Crosstalk: -
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Package / Case: 5-TSSOP, SC-70-5, SOT-353
  • Supplier Device Package: 5-TSSOP
패키지: 5-TSSOP, SC-70-5, SOT-353
재고138,216
P5010NSE1TNB
NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

  • Core Processor: PowerPC e5500
  • Number of Cores/Bus Width: 1 Core, 64-Bit
  • Speed: 2.0GHz
  • Co-Processors/DSP: Security; SEC 4.2
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (5), 10 Gbps (1)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection
  • Package / Case: 1295-BBGA, FCBGA
  • Supplier Device Package: 1295-FCPBGA (37.5x37.5)
패키지: 1295-BBGA, FCBGA
재고5,664
hot S9S08DZ32F1MLF
NXP

IC MCU 8BIT 32KB FLASH 48LQFP

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 40MHz
  • Connectivity: CAN, I2C, LIN, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 39
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 1K x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 16x12b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
패키지: 48-LQFP
재고21,432
LH75411N0Q100C0,55
NXP

IC MCU 32BIT ROMLESS 144LQFP

  • Core Processor: ARM7?
  • Core Size: 32-Bit
  • Speed: 84MHz
  • Connectivity: EBI/EMI, SPI, SSI, SSP, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
  • Number of I/O: 76
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.7 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
패키지: 144-LQFP
재고2,016
hot MC908JB16DWE
NXP

IC MCU 8BIT 16KB FLASH 28SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 6MHz
  • Connectivity: SCI, USB
  • Peripherals: LED, LVD, POR, PWM
  • Number of I/O: 21
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 384 x 8
  • Voltage - Supply (Vcc/Vdd): 4 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: 0°C ~ 70°C (TA)
  • Mounting Type: -
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
패키지: 28-SOIC (0.295", 7.50mm Width)
재고30,492
SPC5676RDK3MVY1
NXP

IC MCU 32BIT 6MB FLASH 516FBGA

  • Core Processor: e200z7
  • Core Size: 32-Bit Dual-Core
  • Speed: 180MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI
  • Peripherals: DMA, POR, PWM
  • Number of I/O: -
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 384K x 8
  • Voltage - Supply (Vcc/Vdd): 1.14 V ~ 1.32 V
  • Data Converters: A/D 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BBGA
  • Supplier Device Package: 516-FPBGA (27x27)
패키지: 516-BBGA
재고2,320
SPC5746CSK1MMH6R
NXP

IC MCU 32BIT 3MB FLASH 100MAPBGA

  • Core Processor: e200z2, e200z4
  • Core Size: 32-Bit Dual-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: -
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 100-LBGA
  • Supplier Device Package: 100-MAPBGA (11x11)
패키지: 100-LBGA
재고5,232
LPC824M201JHI33Y
NXP

IC MCU 32BIT 32KB FLASH 32HVQFN

  • Core Processor: ARM? Cortex?-M0+
  • Core Size: 32-Bit
  • Speed: 30MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
  • Number of I/O: 29
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 12x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 32-VFQFN Exposed Pad
  • Supplier Device Package: 32-HVQFN (5x5)
패키지: 32-VFQFN Exposed Pad
재고7,440
MKV31F256VLH12P
NXP

IC MCU 32BIT 256KB FLASH 64LQFP

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 46
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 48K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 24x16b, D/A 1x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
패키지: 64-LQFP
재고7,104
hot MPC555LFMVR40
NXP

IC MCU 32BIT 448KB FLASH 272BGA

  • Core Processor: PowerPC
  • Core Size: 32-Bit
  • Speed: 40MHz
  • Connectivity: CAN, EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 101
  • Program Memory Size: 448KB (448K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 26K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: A/D 32x10b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 272-BBGA
  • Supplier Device Package: 272-PBGA (27x27)
패키지: 272-BBGA
재고5,280
ASC8850ET/M2,551
NXP

IC IP CAMERA MPU SXGA TFBGA

  • Applications: Embedded Multimedia Communication, Security and Entertainment
  • Core Processor: ARM9?
  • Program Memory Type: -
  • Controller Series: -
  • RAM Size: -
  • Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
  • Number of I/O: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: Surface Mount
  • Package / Case: 484-TFBGA
  • Supplier Device Package: 484-TFBGA (15x15)
패키지: 484-TFBGA
재고2,656
NCF29A3VHN/0500IJ
NXP

IC REMOTE KEYLESS ENTRY 32HVQFN

  • Type: -
  • Frequency: -
  • Standards: -
  • Interface: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
재고5,940
SPC5646BK0MLU1
NXP

NXP 32-BIT MCU POWER ARCH CORE

  • Core Processor: e200z4d
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: CANbus, I²C, LINbus, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 147
  • Program Memory Size: 3MB (3M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 64K x 8
  • RAM Size: 192K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 27x10b, 5x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP
  • Supplier Device Package: 176-LQFP (24x24)
패키지: 176-LQFP
재고3,328
TDA9981AHL-15-C181
NXP

IC HDMI TX 150MHZ SGL OUT 80LQFP

  • Type: -
  • Applications: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
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MC34PF1510A0EP
NXP

POWER MANAGEMENT IC, 3 BUCK REGS

  • Applications: Processor
  • Current - Supply: 35µA
  • Voltage - Supply: 2.5V ~ 4.5V
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 40-VFQFN Exposed Pad
  • Supplier Device Package: 40-HVQFN (5x5)
패키지: -
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FS32K116LFT0VLFT
NXP

IC MCU 32BIT 128KB FLASH 48LQFP

  • Core Processor: ARM® Cortex®-M0+
  • Core Size: 32-Bit Single-Core
  • Speed: 48MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: DMA, PWM, WDT
  • Number of I/O: 43
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 2K x 8
  • RAM Size: 17K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 13x12b SAR; D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
패키지: -
Request a Quote
FS32K142HFT0VLLT
NXP

IC MCU 32BIT 256KB FLASH 100LQFP

  • Core Processor: ARM® Cortex®-M4F
  • Core Size: 32-Bit Single-Core
  • Speed: 80MHz
  • Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 89
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
  • Data Converters: A/D 16x12b SAR; D/A1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 100-LQFP
  • Supplier Device Package: 100-LQFP (14x14)
패키지: -
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SAF7754HV-N208WY
NXP

CAR DSP

  • Type: -
  • Interface: -
  • Clock Rate: -
  • Non-Volatile Memory: -
  • On-Chip RAM: -
  • Voltage - I/O: -
  • Voltage - Core: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
패키지: -
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MC33FS6515LAE
NXP

SYSTEM BASIS CHIP, DCDC 1.5A VCO

  • Applications: System Basis Chip
  • Current - Supply: -
  • Voltage - Supply: 1V ~ 5V
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-LQFP Exposed Pad
  • Supplier Device Package: 48-HLQFP (7x7)
패키지: -
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