페이지 897 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
MRFE6S9201HSR3	NXP	FET RF 66V 880MHZ NI-780S Transistor Type: LDMOS Frequency: 880MHz Gain: 20.8dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 1.4A Power - Output: 40W Voltage - Rated: 66V Package / Case: NI-780S Supplier Device Package: NI-780S	패키지: NI-780S	재고3,952
BLF4G22S-100,112	NXP	FET RF 65V 2.17GHZ SOT502B Transistor Type: LDMOS Frequency: 2.11GHz ~ 2.17GHz Gain: 13.5dB Voltage - Test: 28V Current Rating: 12A Noise Figure: - Current - Test: 900mA Power - Output: 25W Voltage - Rated: 65V Package / Case: SOT-502B Supplier Device Package: SOT502B	패키지: SOT-502B	재고7,952
LD6805K/25P,115	NXP	IC REG LIN 2.5V 150MA DFN1010C-4 Output Configuration: Positive Output Type: Fixed Number of Regulators: 1 Voltage - Input (Max): 5.5V Voltage - Output (Min/Fixed): 2.5V Voltage - Output (Max): - Voltage Dropout (Max): 0.25V @ 150mA Current - Output: 150mA Current - Quiescent (Iq): - Current - Supply (Max): 35µA ~ 150µA PSRR: 75dB (1kHz) Control Features: Enable Protection Features: Over Current, Transient Voltage Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 4-UDFN Exposed Pad Supplier Device Package: DFN1010C-4	패키지: 4-UDFN Exposed Pad	재고2,736
MC34903CP5EKR2	NXP	IC SBC HIGH SPEED CAN 5V 32SOIC Applications: System Basis Chip Current - Supply: 2mA Voltage - Supply: 5.5 V ~ 28 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC	패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad	재고4,368
74HC4075DB,112	NXP	IC GATE OR 3CH 3-INP 14-SSOP Logic Type: OR Gate Number of Circuits: 3 Number of Inputs: 3 Features: - Voltage - Supply: 2 V ~ 6 V Current - Quiescent (Max): 2µA Current - Output High, Low: 5.2mA, 5.2mA Logic Level - Low: 0.5 V ~ 1.8 V Logic Level - High: 1.5 V ~ 4.2 V Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Supplier Device Package: 14-SSOP Package / Case: 14-SSOP (0.209", 5.30mm Width)	패키지: 14-SSOP (0.209", 5.30mm Width)	재고6,080
74HC4024DB,112	NXP	IC 7-STAGE BINARY RIPPLE 14-SSOP Logic Type: Binary Counter Direction: Up Number of Elements: 1 Number of Bits per Element: 7 Reset: Asynchronous Timing: - Count Rate: 90MHz Trigger Type: Negative Edge Voltage - Supply: 2 V ~ 6 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 14-SSOP (0.209", 5.30mm Width) Supplier Device Package: 14-SSOP	패키지: 14-SSOP (0.209", 5.30mm Width)	재고4,688
74LVC241APW,118	NXP	IC BUFF/DVR TRI-ST DUAL 20TSSOP Logic Type: Buffer, Non-Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 24mA, 24mA Voltage - Supply: 1.2 V ~ 3.6 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고7,120
MCZ33793AEFR2	NXP	IC DSI SLAVE SENSOR 16-SOIC Type: Sensor Interface Input Type: Logic Output Type: Logic Interface: Parallel Current - Supply: 250mA Operating Temperature: -40°C ~ 150°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.154", 3.90mm Width)	재고4,976
MPC5200VR400BR2	NXP	IC MPU MPC52XX 400MHZ 272BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: - RAM Controllers: DDR, SDRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100 Mbps (1) SATA: - USB: USB 1.1 (2) Voltage - I/O: 2.5V, 3.3V Operating Temperature: 0°C ~ 70°C (TA) Security Features: - Package / Case: 272-BBGA Supplier Device Package: 272-PBGA (27x27)	패키지: 272-BBGA	재고3,520
P87C51X2FA,512	NXP	IC MCU 8BIT 4KB OTP 44PLCC Core Processor: 8051 Core Size: 8-Bit Speed: 33MHz Connectivity: EBI/EMI, UART/USART Peripherals: POR Number of I/O: 32 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-LCC (J-Lead) Supplier Device Package: 44-PLCC (16.59x16.59)	패키지: 44-LCC (J-Lead)	재고4,192
MC9S08DZ16MLC	NXP	IC MCU 8BIT 16KB FLASH 32LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: CAN, I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 25 Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH EEPROM Size: 512 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 10x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	패키지: 32-LQFP	재고13,668
P89LPC922FDH,529	NXP	IC MCU 8BIT 8KB FLASH 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 18MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Number of I/O: 18 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 256 x 8 Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V Data Converters: - Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	패키지: 20-TSSOP (0.173", 4.40mm Width)	재고5,360
MMC2113CFCPU33	NXP	IC MCU 32BIT 128KB FLASH 100LQFP Core Processor: M210 Core Size: 32-Bit Speed: 33MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 67 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고5,376
LPC1812JBD144E	NXP	IC MCU 32BIT 512KB FLASH 144LQFP Core Processor: ARM? Cortex?-M3 Core Size: 32-Bit Speed: 180MHz Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Number of I/O: 83 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 16K x 8 RAM Size: 104K x 8 Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V Data Converters: A/D 8x10b; D/A 1x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: -	패키지: 144-LQFP	재고4,688
MC9S08GT8ACFBE	NXP	IC MCU 8BIT 8KB FLASH 44QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 36 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 44-QFP Supplier Device Package: 44-QFP (10x10)	패키지: 44-QFP	재고11,316
LPC11C24FBD48/301,	NXP	IC MCU 32BIT 32KB FLASH 48LQFP Core Processor: ARM? Cortex?-M0 Core Size: 32-Bit Speed: 50MHz Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고12,342
SPAKXCL307VL160	NXP	IC DSP 24BIT 160MHZ 196-MAPBGA Type: Fixed Point Interface: Host Interface, SSI, SCI Clock Rate: 160MHz Non-Volatile Memory: ROM (576 B) On-Chip RAM: 576kB Voltage - I/O: 3.30V Voltage - Core: 1.80V Operating Temperature: -40°C ~ 100°C Mounting Type: Surface Mount Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	패키지: 196-LBGA	재고16,644
UDA1330ATS/N2,118	NXP	IC STEREO FILTER DAC 16SSOP Type: DAC, Audio Number of Channels: - Resolution (Bits): 20 b Sampling Rate (Per Second): 55k Data Interface: I2S Voltage Supply Source: Analog and Digital Voltage - Supply: 2.7 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-LSSOP (0.173", 4.40mm Width) Supplier Device Package: 16-SSOP	패키지: 16-LSSOP (0.173", 4.40mm Width)	재고6,464
MMA2612NIKGCWR2	NXP	ACCELEROMETER DSI2.5 16QFN Type: Digital Axis: X Acceleration Range: ±125g Sensitivity (LSB/g): 4.096 Sensitivity (mV/g): - Bandwidth: - Output Type: PCM Voltage - Supply: 6.3 V ~ 30 V Features: Selectable Low Pass Filter Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	패키지: 16-QFN Exposed Pad	재고5,058
PCF7961ATT/D1AE07J	NXP	IC REMOTE KEYLESS ENTRY 20TSSOP Frequency: - Applications: - Modulation or Protocol: - Data Rate (Max): - Power - Output: - Current - Transmitting: - Data Interface: - Antenna Connector: - Memory Size: - Features: - Voltage - Supply: - Operating Temperature: - Package / Case: -	패키지: -	재고8,586
T1023NSN7KQA	NXP	QORIQ 2XCPU 64-BIT PWR ARCH 1. Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	패키지: -	재고4,192
S912XEQ512F1CAG	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고3,168
S912ZVML31F1WKFR	NXP	MAGNIV 16-BIT MCU S12Z CORE 32 Core Processor: S12Z Core Size: 16-Bit Speed: 40MHz Connectivity: LINbus, SCI Peripherals: DMA, POR, PWM, WDT Number of I/O: 31 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 128 x 8 RAM Size: 4K x 8 Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V Data Converters: A/D 4x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 150°C (TA) Mounting Type: - Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	패키지: 48-LQFP Exposed Pad	재고6,896
S9S12G128AVLLR	NXP	16BIT 128K FLASH Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CANbus, IrDA, LINbus, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고5,408
S9S08DV32F2MLHR	NXP	IC MCU 8BIT 32KB FLASH Core Processor: - Core Size: - Speed: - Connectivity: - Peripherals: - Number of I/O: - Program Memory Size: - Program Memory Type: - EEPROM Size: - RAM Size: - Voltage - Supply (Vcc/Vdd): - Data Converters: - Oscillator Type: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
LPC55S16JBD100Y	NXP	IC MCU 32BIT 256KB FLSH 100LQFP Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Speed: 150MHz Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Number of I/O: 64 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 96K x 8 Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-HLQFP (14x14)	패키지: -	Request a Quote
FS32K146UAT0VMHR	NXP	IC MCU 32BIT 1MB FLASH 100MAPBGA Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 112MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 89 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 100-LFBGA Supplier Device Package: 100-MAPBGA (11x11)	패키지: -	Request a Quote
MC33FS8520A0KS	NXP	SAFETY POWER MANAGEMENT IC, QFN5 Applications: System Basis Chip Current - Supply: 15mA Voltage - Supply: 60V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount, Wettable Flank Package / Case: 56-VFQFN Exposed Pad Supplier Device Package: 56-HVQFN (8x8)	패키지: -	Request a Quote

MRFE6S9201HSR3

NXP

FET RF 66V 880MHZ NI-780S

Transistor Type: LDMOS
Frequency: 880MHz
Gain: 20.8dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 1.4A
Power - Output: 40W
Voltage - Rated: 66V
Package / Case: NI-780S
Supplier Device Package: NI-780S

패키지: NI-780S

재고3,952

BLF4G22S-100,112

NXP

FET RF 65V 2.17GHZ SOT502B

Transistor Type: LDMOS
Frequency: 2.11GHz ~ 2.17GHz
Gain: 13.5dB
Voltage - Test: 28V
Current Rating: 12A
Noise Figure: -
Current - Test: 900mA
Power - Output: 25W
Voltage - Rated: 65V
Package / Case: SOT-502B
Supplier Device Package: SOT502B

패키지: SOT-502B

재고7,952

LD6805K/25P,115

NXP

IC REG LIN 2.5V 150MA DFN1010C-4

Output Configuration: Positive
Output Type: Fixed
Number of Regulators: 1
Voltage - Input (Max): 5.5V
Voltage - Output (Min/Fixed): 2.5V
Voltage - Output (Max): -
Voltage Dropout (Max): 0.25V @ 150mA
Current - Output: 150mA
Current - Quiescent (Iq): -
Current - Supply (Max): 35µA ~ 150µA
PSRR: 75dB (1kHz)
Control Features: Enable
Protection Features: Over Current, Transient Voltage
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 4-UDFN Exposed Pad
Supplier Device Package: DFN1010C-4

패키지: 4-UDFN Exposed Pad

재고2,736

MC34903CP5EKR2

NXP

IC SBC HIGH SPEED CAN 5V 32SOIC

Applications: System Basis Chip
Current - Supply: 2mA
Voltage - Supply: 5.5 V ~ 28 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC

패키지: 32-BSSOP (0.295", 7.50mm Width) Exposed Pad

재고4,368

74HC4075DB,112

NXP

IC GATE OR 3CH 3-INP 14-SSOP

Logic Type: OR Gate
Number of Circuits: 3
Number of Inputs: 3
Features: -
Voltage - Supply: 2 V ~ 6 V
Current - Quiescent (Max): 2µA
Current - Output High, Low: 5.2mA, 5.2mA
Logic Level - Low: 0.5 V ~ 1.8 V
Logic Level - High: 1.5 V ~ 4.2 V
Max Propagation Delay @ V, Max CL: 17ns @ 6V, 50pF
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Supplier Device Package: 14-SSOP
Package / Case: 14-SSOP (0.209", 5.30mm Width)

패키지: 14-SSOP (0.209", 5.30mm Width)

재고6,080

74HC4024DB,112

NXP

IC 7-STAGE BINARY RIPPLE 14-SSOP

Logic Type: Binary Counter
Direction: Up
Number of Elements: 1
Number of Bits per Element: 7
Reset: Asynchronous
Timing: -
Count Rate: 90MHz
Trigger Type: Negative Edge
Voltage - Supply: 2 V ~ 6 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 14-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 14-SSOP

패키지: 14-SSOP (0.209", 5.30mm Width)

재고4,688

74LVC241APW,118

NXP

IC BUFF/DVR TRI-ST DUAL 20TSSOP

Logic Type: Buffer, Non-Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 24mA, 24mA
Voltage - Supply: 1.2 V ~ 3.6 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고7,120

MCZ33793AEFR2

NXP

IC DSI SLAVE SENSOR 16-SOIC

Type: Sensor Interface
Input Type: Logic
Output Type: Logic
Interface: Parallel
Current - Supply: 250mA
Operating Temperature: -40°C ~ 150°C
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.154", 3.90mm Width)

재고4,976

MPC5200VR400BR2

NXP

IC MPU MPC52XX 400MHZ 272BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: -
RAM Controllers: DDR, SDRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100 Mbps (1)
SATA: -
USB: USB 1.1 (2)
Voltage - I/O: 2.5V, 3.3V
Operating Temperature: 0°C ~ 70°C (TA)
Security Features: -
Package / Case: 272-BBGA
Supplier Device Package: 272-PBGA (27x27)

패키지: 272-BBGA

재고3,520

P87C51X2FA,512

NXP

IC MCU 8BIT 4KB OTP 44PLCC

Core Processor: 8051
Core Size: 8-Bit
Speed: 33MHz
Connectivity: EBI/EMI, UART/USART
Peripherals: POR
Number of I/O: 32
Program Memory Size: 4KB (4K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-LCC (J-Lead)
Supplier Device Package: 44-PLCC (16.59x16.59)

패키지: 44-LCC (J-Lead)

재고4,192

MC9S08DZ16MLC

NXP

IC MCU 8BIT 16KB FLASH 32LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: CAN, I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 25
Program Memory Size: 16KB (16K x 8)
Program Memory Type: FLASH
EEPROM Size: 512 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 10x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

패키지: 32-LQFP

재고13,668

P89LPC922FDH,529

NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 18MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Number of I/O: 18
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 256 x 8
Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

패키지: 20-TSSOP (0.173", 4.40mm Width)

재고5,360

MMC2113CFCPU33

NXP

IC MCU 32BIT 128KB FLASH 100LQFP

Core Processor: M210
Core Size: 32-Bit
Speed: 33MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 67
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고5,376

LPC1812JBD144E

NXP

IC MCU 32BIT 512KB FLASH 144LQFP

Core Processor: ARM? Cortex?-M3
Core Size: 32-Bit
Speed: 180MHz
Connectivity: CAN, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Number of I/O: 83
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 16K x 8
RAM Size: 104K x 8
Voltage - Supply (Vcc/Vdd): 2.2 V ~ 3.6 V
Data Converters: A/D 8x10b; D/A 1x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: -

패키지: 144-LQFP

재고4,688

MC9S08GT8ACFBE

NXP

IC MCU 8BIT 8KB FLASH 44QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 36
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 44-QFP
Supplier Device Package: 44-QFP (10x10)

패키지: 44-QFP

재고11,316

LPC11C24FBD48/301,

NXP

IC MCU 32BIT 32KB FLASH 48LQFP

Core Processor: ARM? Cortex?-M0
Core Size: 32-Bit
Speed: 50MHz
Connectivity: CAN, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, POR, WDT
Number of I/O: 36
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고12,342

SPAKXCL307VL160

NXP

IC DSP 24BIT 160MHZ 196-MAPBGA

Type: Fixed Point
Interface: Host Interface, SSI, SCI
Clock Rate: 160MHz
Non-Volatile Memory: ROM (576 B)
On-Chip RAM: 576kB
Voltage - I/O: 3.30V
Voltage - Core: 1.80V
Operating Temperature: -40°C ~ 100°C
Mounting Type: Surface Mount
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

패키지: 196-LBGA

재고16,644

UDA1330ATS/N2,118

NXP

IC STEREO FILTER DAC 16SSOP

Type: DAC, Audio
Number of Channels: -
Resolution (Bits): 20 b
Sampling Rate (Per Second): 55k
Data Interface: I2S
Voltage Supply Source: Analog and Digital
Voltage - Supply: 2.7 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 16-LSSOP (0.173", 4.40mm Width)
Supplier Device Package: 16-SSOP

패키지: 16-LSSOP (0.173", 4.40mm Width)

재고6,464

MMA2612NIKGCWR2

NXP

ACCELEROMETER DSI2.5 16QFN

Type: Digital
Axis: X
Acceleration Range: ±125g
Sensitivity (LSB/g): 4.096
Sensitivity (mV/g): -
Bandwidth: -
Output Type: PCM
Voltage - Supply: 6.3 V ~ 30 V
Features: Selectable Low Pass Filter
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN-EP (6x6)

패키지: 16-QFN Exposed Pad

재고5,058

PCF7961ATT/D1AE07J

NXP

IC REMOTE KEYLESS ENTRY 20TSSOP

Frequency: -
Applications: -
Modulation or Protocol: -
Data Rate (Max): -
Power - Output: -
Current - Transmitting: -
Data Interface: -
Antenna Connector: -
Memory Size: -
Features: -
Voltage - Supply: -
Operating Temperature: -
Package / Case: -

패키지: -

재고8,586

T1023NSN7KQA

NXP

QORIQ 2XCPU 64-BIT PWR ARCH 1.

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고4,192

S912XEQ512F1CAG

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고3,168

S912ZVML31F1WKFR

NXP

MAGNIV 16-BIT MCU S12Z CORE 32

Core Processor: S12Z
Core Size: 16-Bit
Speed: 40MHz
Connectivity: LINbus, SCI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 31
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 128 x 8
RAM Size: 4K x 8
Voltage - Supply (Vcc/Vdd): 3.5 V ~ 40 V
Data Converters: A/D 4x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 150°C (TA)
Mounting Type: -
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

패키지: 48-LQFP Exposed Pad

재고6,896

S9S12G128AVLLR

NXP

16BIT 128K FLASH

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CANbus, IrDA, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고5,408

S9S08DV32F2MLHR

NXP

IC MCU 8BIT 32KB FLASH

Core Processor: -
Core Size: -
Speed: -
Connectivity: -
Peripherals: -
Number of I/O: -
Program Memory Size: -
Program Memory Type: -
EEPROM Size: -
RAM Size: -
Voltage - Supply (Vcc/Vdd): -
Data Converters: -
Oscillator Type: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

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LPC55S16JBD100Y

NXP

IC MCU 32BIT 256KB FLSH 100LQFP

Core Processor: ARM® Cortex®-M33
Core Size: 32-Bit Single-Core
Speed: 150MHz
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O: 64
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 96K x 8
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Data Converters: A/D 10x16b SAR
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-HLQFP (14x14)

패키지: -

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FS32K146UAT0VMHR

NXP

IC MCU 32BIT 1MB FLASH 100MAPBGA

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 112MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 89
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LFBGA
Supplier Device Package: 100-MAPBGA (11x11)

패키지: -

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MC33FS8520A0KS

NXP

SAFETY POWER MANAGEMENT IC, QFN5

Applications: System Basis Chip
Current - Supply: 15mA
Voltage - Supply: 60V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Supplier Device Package: 56-HVQFN (8x8)

패키지: -

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