페이지 98 - NXP 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
74HC109N,652	NXP	IC JK TYPE POS TRG DUAL 16DIP Function: Set(Preset) and Reset Type: JK Type Output Type: Differential Number of Elements: 2 Number of Bits per Element: 1 Clock Frequency: 81MHz Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF Trigger Type: Positive Edge Current - Output High, Low: 5.2mA, 5.2mA Voltage - Supply: 2 V ~ 6 V Current - Quiescent (Iq): 4µA Input Capacitance: 3.5pF Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Through Hole Package / Case: 16-DIP (0.300", 7.62mm)	패키지: 16-DIP (0.300", 7.62mm)	재고4,496
N74F240D,623	NXP	IC BUFF INVERT 8BIT 5.5V 20SOIC Logic Type: Buffer, Inverting Number of Elements: 2 Number of Bits per Element: 4 Input Type: - Output Type: Push-Pull Current - Output High, Low: 15mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 20-SOIC (0.295", 7.50mm Width) Supplier Device Package: 20-SO	패키지: 20-SOIC (0.295", 7.50mm Width)	재고4,544
TDA8567Q/N3C,112	NXP	IC AMP AUDIO PWR 35W QUAD 23SIL Type: Class B Output Type: 4-Channel (Quad) Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm Voltage - Supply: 6 V ~ 18 V Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby Mounting Type: Through Hole Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: DBS23P Package / Case: 23-SIP Formed Leads	패키지: 23-SIP Formed Leads	재고5,984
PTN36241GHXZ	NXP	IC REDRIVER USB 3.0 12X2QFN Type: Buffer, ReDriver Applications: USB 3.0 Input: - Output: - Data Rate (Max): 5Gbps Number of Channels: 1 Delay Time: 1.0ns Signal Conditioning: Input Equalization, Output De-Emphasis Capacitance - Input: - Voltage - Supply: 3 V ~ 3.6 V Current - Supply: 100mA Operating Temperature: 0°C ~ 85°C Mounting Type: - Package / Case: 12-XFQFN Supplier Device Package: 12-X2QFN (1.25x2.10)	패키지: 12-XFQFN	재고48,396
UJA1023T/2R04,512	NXP	IC CAN/LIN I/O SLAVE 16SOIC Protocol: LIN Function: I/O Slave Interface: LIN Standards: LIN 2.0 Voltage - Supply: 6.5 V ~ 27 V Current - Supply: 45µA Operating Temperature: -40°C ~ 125°C Package / Case: 16-SOIC (0.154", 3.90mm Width) Supplier Device Package: 16-SO	패키지: 16-SOIC (0.154", 3.90mm Width)	재고3,376
MPC8379CVRALG	NXP	IC MPU MPC83XX 667MHZ 689TEBGA Core Processor: PowerPC e300c4s Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 667MHz Co-Processors/DSP: - RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (2) SATA: SATA 3Gbps (4) USB: USB 2.0 + PHY (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 125°C (TA) Security Features: - Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	패키지: 689-BBGA Exposed Pad	재고6,416
MC94MX21DVKN3	NXP	IC MPU I.MX21 350MHZ 289MAPBGA Core Processor: ARM926EJ-S Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 350MHz Co-Processors/DSP: - RAM Controllers: SDRAM Graphics Acceleration: Yes Display & Interface Controllers: - Ethernet: - SATA: - USB: USB 1.x (2) Voltage - I/O: 1.8V, 3.0V Operating Temperature: -30°C ~ 70°C (TA) Security Features: - Package / Case: 289-LFBGA Supplier Device Package: -	패키지: 289-LFBGA	재고26,652
MPC8358VRAGDGA	NXP	IC MPU MPC83XX 400MHZ 668BGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 400MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 668-BBGA Exposed Pad Supplier Device Package: 668-PBGA-PGE (29x29)	패키지: 668-BBGA Exposed Pad	재고7,632
MC68HC908MR32CB	NXP	IC MCU 8BIT 32KB FLASH 56PSDIP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 36 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 768 x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 56-SDIP (0.600", 15.24mm) Supplier Device Package: 56-PSDIP	패키지: 56-SDIP (0.600", 15.24mm)	재고6,128
MC68HC908GZ8CFA	NXP	IC MCU 8BIT 8KB FLASH 48LQFP Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: CAN, LIN, SCI, SPI Peripherals: LVD, POR, PWM Number of I/O: 37 Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP	재고6,864
SPC5668GK0VMGR	NXP	IC MCU 32BIT 2MB FLASH 208MAPBGA Core Processor: e200z650 Core Size: 32-Bit Speed: 116MHz Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 155 Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 592K x 8 Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V Data Converters: A/D 36x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 208-BGA Supplier Device Package: 208-MAPBGA (17x17)	패키지: 208-BGA	재고7,072
S912B32E4CFUE8R	NXP	IC MCU 8BIT 32KB FLASH 80QFP Core Processor: CPU12 Core Size: 16-Bit Speed: 8MHz Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Number of I/O: 63 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 768 x 8 RAM Size: 1K x 8 Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 80-QFP Supplier Device Package: 80-QFP (14x14)	패키지: 80-QFP	재고3,248
MC9S08AC60MPUE	NXP	IC MCU 8BIT 60KB FLASH 64LQFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 60KB (60K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고3,808
S9S12G128F0VLH	NXP	IC MCU 16BIT 128KB FLASH 64LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: 64-LQFP	재고139,884
MCHC908QT4VDWER	NXP	IC MCU 8BIT 4KB FLASH 8SOIC Core Processor: HC08 Core Size: 8-Bit Speed: 8MHz Connectivity: - Peripherals: LVD, POR, PWM Number of I/O: 5 Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 4x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 8-SOIC (0.209", 5.30mm Width) Supplier Device Package: 8-SOIC	패키지: 8-SOIC (0.209", 5.30mm Width)	재고13,548
MKL03Z32VFG4	NXP	IC MCU 32BIT 32KB FLASH 16QFN Core Processor: ARM? Cortex?-M0+ Core Size: 32-Bit Speed: 48MHz Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT Number of I/O: 14 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V Data Converters: A/D 7x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 16-WFQFN Exposed Pad Supplier Device Package: 16-QFN (3x3)	패키지: 16-WFQFN Exposed Pad	재고6,800
S9S12G96F0MLL	NXP	IC MCU 16BIT 96KB FLASH 100LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: CAN, IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 86 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 3K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 12x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 100-LQFP Supplier Device Package: 100-LQFP (14x14)	패키지: 100-LQFP	재고22,728
MSC8144EVT1000B	NXP	ENCRYPTION PACSUN R2.1 783FCBGA Type: SC3400 Core Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA Clock Rate: 1GHz Non-Volatile Memory: External On-Chip RAM: 10.5MB Voltage - I/O: 3.30V Voltage - Core: 1.00V Operating Temperature: 0°C ~ 90°C (TJ) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29x29)	패키지: 783-BBGA, FCBGA	재고3,696
MPX5700A	NXP	SENSOR ABS PRESS 101.5PSI MAX Pressure Type: Absolute Operating Pressure: 2.18 PSI ~ 101.53 PSI (15 kPa ~ 700 kPa) Output Type: Analog Voltage Output: 0.2 V ~ 4.7 V Accuracy: ±2.5% Voltage - Supply: 4.75 V ~ 5.25 V Port Size: - Port Style: No Port Features: Temperature Compensated Termination Style: PCB Maximum Pressure: 406.11 PSI (2800 kPa) Operating Temperature: -40°C ~ 125°C Package / Case: 6-SIP Module Supplier Device Package: -	패키지: 6-SIP Module	재고6,966
MMA2260D	NXP	ACCELEROMETER 1.5G ANALOG 16SOIC Type: Analog Axis: X Acceleration Range: ±1.5g Sensitivity (LSB/g): - Sensitivity (mV/g): 1200 Bandwidth: 50Hz Output Type: Analog Voltage Voltage - Supply: 4.75 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 16-SOIC (0.295", 7.50mm Width) Supplier Device Package: 16-SOIC	패키지: 16-SOIC (0.295", 7.50mm Width)	재고3,204
MPC8308-NSG	NXP	REF DESIGN SMART GATEWAY MPC8308 Type: Gateway Frequency: - For Use With/Related Products: MPC8308 Supplied Contents: Board, Cables, Power Supply	패키지: -	재고4,446
MC33FS4500LAE	NXP	SYSTEM BASIS CHIP LINEAR 0.5A V Applications: System Basis Chip Current - Supply: - Voltage - Supply: -1.0 V ~ 40 V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP (7x7)	패키지: 48-LQFP Exposed Pad	재고2,208
UJA1079ATW/3V3/WDJ	NXP	IC SBC LIN Applications: Automotive Interface: SPI Serial Voltage - Supply: 4.5 V ~ 28 V Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad Supplier Device Package: 32-HTSSOP Mounting Type: Surface Mount	패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad	재고7,136
SPC5605BK0MLQ4R	NXP	NXP 32-BIT MCU POWER ARCH CORE Core Processor: e200z0h Core Size: 32-Bit Speed: 64MHz Connectivity: CANbus, I²C, LINbus, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 121 Program Memory Size: 768KB (768K x 8) Program Memory Type: FLASH EEPROM Size: 64K x 8 RAM Size: 64K x 8 Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V Data Converters: A/D 15x10b, 5x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	패키지: 144-LQFP	재고4,288
PNX9531E/V140,518	NXP	IC MEDIA PROCESSOR Applications: Multimedia Core Processor: TriMedia™ Program Memory Type: - Controller Series: Nexperia RAM Size: - Interface: GPIO, Host Interface, I²C, PCI, USB, XIO Number of I/O: 8 Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 456-BGA Supplier Device Package: 456-PBGA (27x27)	패키지: 456-BGA	재고4,144
SC900570CVW1	NXP	IC Type: - Protocol: - Number of Drivers/Receivers: - Duplex: - Receiver Hysteresis: - Data Rate: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	패키지: -	Request a Quote
S912ZVL96F0VLFR	NXP	IC MCU 16BIT 96KB FLASH 48LQFP Core Processor: S12Z Core Size: 16-Bit Speed: 32MHz Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART Peripherals: LVD, POR, PWM, WDT Number of I/O: 34 Program Memory Size: 96KB (96K x 8) Program Memory Type: FLASH EEPROM Size: 2K x 8 RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V Data Converters: A/D 10x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	패키지: -	Request a Quote
FS32K146UAT0VLHR	NXP	IC MCU 32BIT 1MB FLASH 64LQFP Core Processor: ARM® Cortex®-M4F Core Size: 32-Bit Single-Core Speed: 112MHz Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: POR, PWM, WDT Number of I/O: 58 Program Memory Size: 1MB (1M x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 128K x 8 Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 24x12b SAR; D/A1x8b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 64-LQFP Supplier Device Package: 64-LQFP (10x10)	패키지: -	Request a Quote

74HC109N,652

NXP

IC JK TYPE POS TRG DUAL 16DIP

Function: Set(Preset) and Reset
Type: JK Type
Output Type: Differential
Number of Elements: 2
Number of Bits per Element: 1
Clock Frequency: 81MHz
Max Propagation Delay @ V, Max CL: 30ns @ 6V, 50pF
Trigger Type: Positive Edge
Current - Output High, Low: 5.2mA, 5.2mA
Voltage - Supply: 2 V ~ 6 V
Current - Quiescent (Iq): 4µA
Input Capacitance: 3.5pF
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Through Hole
Package / Case: 16-DIP (0.300", 7.62mm)

패키지: 16-DIP (0.300", 7.62mm)

재고4,496

N74F240D,623

NXP

IC BUFF INVERT 8BIT 5.5V 20SOIC

Logic Type: Buffer, Inverting
Number of Elements: 2
Number of Bits per Element: 4
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 15mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 20-SO

패키지: 20-SOIC (0.295", 7.50mm Width)

재고4,544

TDA8567Q/N3C,112

NXP

IC AMP AUDIO PWR 35W QUAD 23SIL

Type: Class B
Output Type: 4-Channel (Quad)
Max Output Power x Channels @ Load: 35W x 4 @ 4 Ohm
Voltage - Supply: 6 V ~ 18 V
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: DBS23P
Package / Case: 23-SIP Formed Leads

패키지: 23-SIP Formed Leads

재고5,984

PTN36241GHXZ

NXP

IC REDRIVER USB 3.0 12X2QFN

Type: Buffer, ReDriver
Applications: USB 3.0
Input: -
Output: -
Data Rate (Max): 5Gbps
Number of Channels: 1
Delay Time: 1.0ns
Signal Conditioning: Input Equalization, Output De-Emphasis
Capacitance - Input: -
Voltage - Supply: 3 V ~ 3.6 V
Current - Supply: 100mA
Operating Temperature: 0°C ~ 85°C
Mounting Type: -
Package / Case: 12-XFQFN
Supplier Device Package: 12-X2QFN (1.25x2.10)

패키지: 12-XFQFN

재고48,396

UJA1023T/2R04,512

NXP

IC CAN/LIN I/O SLAVE 16SOIC

Protocol: LIN
Function: I/O Slave
Interface: LIN
Standards: LIN 2.0
Voltage - Supply: 6.5 V ~ 27 V
Current - Supply: 45µA
Operating Temperature: -40°C ~ 125°C
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 16-SO

패키지: 16-SOIC (0.154", 3.90mm Width)

재고3,376

MPC8379CVRALG

NXP

IC MPU MPC83XX 667MHZ 689TEBGA

Core Processor: PowerPC e300c4s
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 667MHz
Co-Processors/DSP: -
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (2)
SATA: SATA 3Gbps (4)
USB: USB 2.0 + PHY (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: -40°C ~ 125°C (TA)
Security Features: -
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

패키지: 689-BBGA Exposed Pad

재고6,416

MC94MX21DVKN3

NXP

IC MPU I.MX21 350MHZ 289MAPBGA

Core Processor: ARM926EJ-S
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 350MHz
Co-Processors/DSP: -
RAM Controllers: SDRAM
Graphics Acceleration: Yes
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: USB 1.x (2)
Voltage - I/O: 1.8V, 3.0V
Operating Temperature: -30°C ~ 70°C (TA)
Security Features: -
Package / Case: 289-LFBGA
Supplier Device Package: -

패키지: 289-LFBGA

재고26,652

MPC8358VRAGDGA

NXP

IC MPU MPC83XX 400MHZ 668BGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 400MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 668-BBGA Exposed Pad
Supplier Device Package: 668-PBGA-PGE (29x29)

패키지: 668-BBGA Exposed Pad

재고7,632

MC68HC908MR32CB

NXP

IC MCU 8BIT 32KB FLASH 56PSDIP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 36
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 768 x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 56-SDIP (0.600", 15.24mm)
Supplier Device Package: 56-PSDIP

패키지: 56-SDIP (0.600", 15.24mm)

재고6,128

MC68HC908GZ8CFA

NXP

IC MCU 8BIT 8KB FLASH 48LQFP

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: CAN, LIN, SCI, SPI
Peripherals: LVD, POR, PWM
Number of I/O: 37
Program Memory Size: 8KB (8K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP

재고6,864

SPC5668GK0VMGR

NXP

IC MCU 32BIT 2MB FLASH 208MAPBGA

Core Processor: e200z650
Core Size: 32-Bit
Speed: 116MHz
Connectivity: CAN, Ethernet, I2C, LIN, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 155
Program Memory Size: 2MB (2M x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 592K x 8
Voltage - Supply (Vcc/Vdd): 3.3 V ~ 5 V
Data Converters: A/D 36x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 208-BGA
Supplier Device Package: 208-MAPBGA (17x17)

패키지: 208-BGA

재고7,072

S912B32E4CFUE8R

NXP

IC MCU 8BIT 32KB FLASH 80QFP

Core Processor: CPU12
Core Size: 16-Bit
Speed: 8MHz
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Number of I/O: 63
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 768 x 8
RAM Size: 1K x 8
Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 80-QFP
Supplier Device Package: 80-QFP (14x14)

패키지: 80-QFP

재고3,248

MC9S08AC60MPUE

NXP

IC MCU 8BIT 60KB FLASH 64LQFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 60KB (60K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고3,808

S9S12G128F0VLH

NXP

IC MCU 16BIT 128KB FLASH 64LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: 64-LQFP

재고139,884

MCHC908QT4VDWER

NXP

IC MCU 8BIT 4KB FLASH 8SOIC

Core Processor: HC08
Core Size: 8-Bit
Speed: 8MHz
Connectivity: -
Peripherals: LVD, POR, PWM
Number of I/O: 5
Program Memory Size: 4KB (4K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 4x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Supplier Device Package: 8-SOIC

패키지: 8-SOIC (0.209", 5.30mm Width)

재고13,548

MKL03Z32VFG4

NXP

IC MCU 32BIT 32KB FLASH 16QFN

Core Processor: ARM? Cortex?-M0+
Core Size: 32-Bit
Speed: 48MHz
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number of I/O: 14
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
Data Converters: A/D 7x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 16-WFQFN Exposed Pad
Supplier Device Package: 16-QFN (3x3)

패키지: 16-WFQFN Exposed Pad

재고6,800

S9S12G96F0MLL

NXP

IC MCU 16BIT 96KB FLASH 100LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: CAN, IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 86
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 3K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 12x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 100-LQFP
Supplier Device Package: 100-LQFP (14x14)

패키지: 100-LQFP

재고22,728

MSC8144EVT1000B

NXP

ENCRYPTION PACSUN R2.1 783FCBGA

Type: SC3400 Core
Interface: Ethernet, I2C, SPI, TDM, UART, UTOPIA
Clock Rate: 1GHz
Non-Volatile Memory: External
On-Chip RAM: 10.5MB
Voltage - I/O: 3.30V
Voltage - Core: 1.00V
Operating Temperature: 0°C ~ 90°C (TJ)
Mounting Type: Surface Mount
Package / Case: 783-BBGA, FCBGA
Supplier Device Package: 783-FCPBGA (29x29)

패키지: 783-BBGA, FCBGA

재고3,696

MPX5700A

NXP

SENSOR ABS PRESS 101.5PSI MAX

Pressure Type: Absolute
Operating Pressure: 2.18 PSI ~ 101.53 PSI (15 kPa ~ 700 kPa)
Output Type: Analog Voltage
Output: 0.2 V ~ 4.7 V
Accuracy: ±2.5%
Voltage - Supply: 4.75 V ~ 5.25 V
Port Size: -
Port Style: No Port
Features: Temperature Compensated
Termination Style: PCB
Maximum Pressure: 406.11 PSI (2800 kPa)
Operating Temperature: -40°C ~ 125°C
Package / Case: 6-SIP Module
Supplier Device Package: -

패키지: 6-SIP Module

재고6,966

MMA2260D

NXP

ACCELEROMETER 1.5G ANALOG 16SOIC

Type: Analog
Axis: X
Acceleration Range: ±1.5g
Sensitivity (LSB/g): -
Sensitivity (mV/g): 1200
Bandwidth: 50Hz
Output Type: Analog Voltage
Voltage - Supply: 4.75 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 16-SOIC

패키지: 16-SOIC (0.295", 7.50mm Width)

재고3,204

MPC8308-NSG

NXP

REF DESIGN SMART GATEWAY MPC8308

Type: Gateway
Frequency: -
For Use With/Related Products: MPC8308
Supplied Contents: Board, Cables, Power Supply

패키지: -

재고4,446

MC33FS4500LAE

NXP

SYSTEM BASIS CHIP LINEAR 0.5A V

Applications: System Basis Chip
Current - Supply: -
Voltage - Supply: -1.0 V ~ 40 V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP (7x7)

패키지: 48-LQFP Exposed Pad

재고2,208

UJA1079ATW/3V3/WDJ

NXP

IC SBC LIN

Applications: Automotive
Interface: SPI Serial
Voltage - Supply: 4.5 V ~ 28 V
Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
Supplier Device Package: 32-HTSSOP
Mounting Type: Surface Mount

패키지: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad

재고7,136

SPC5605BK0MLQ4R

NXP

NXP 32-BIT MCU POWER ARCH CORE

Core Processor: e200z0h
Core Size: 32-Bit
Speed: 64MHz
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 121
Program Memory Size: 768KB (768K x 8)
Program Memory Type: FLASH
EEPROM Size: 64K x 8
RAM Size: 64K x 8
Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
Data Converters: A/D 15x10b, 5x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

패키지: 144-LQFP

재고4,288

PNX9531E/V140,518

NXP

IC MEDIA PROCESSOR

Applications: Multimedia
Core Processor: TriMedia™
Program Memory Type: -
Controller Series: Nexperia
RAM Size: -
Interface: GPIO, Host Interface, I²C, PCI, USB, XIO
Number of I/O: 8
Voltage - Supply: 1.16V ~ 1.24V, 3.15V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 456-BGA
Supplier Device Package: 456-PBGA (27x27)

패키지: 456-BGA

재고4,144

SC900570CVW1

NXP

IC

Type: -
Protocol: -
Number of Drivers/Receivers: -
Duplex: -
Receiver Hysteresis: -
Data Rate: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

패키지: -

Request a Quote

S912ZVL96F0VLFR

NXP

IC MCU 16BIT 96KB FLASH 48LQFP

Core Processor: S12Z
Core Size: 16-Bit
Speed: 32MHz
Connectivity: CANbus, I2C, IrDA, LINbus, SCI, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 34
Program Memory Size: 96KB (96K x 8)
Program Memory Type: FLASH
EEPROM Size: 2K x 8
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 5.5V ~ 18V
Data Converters: A/D 10x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

패키지: -

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FS32K146UAT0VLHR

NXP

IC MCU 32BIT 1MB FLASH 64LQFP

Core Processor: ARM® Cortex®-M4F
Core Size: 32-Bit Single-Core
Speed: 112MHz
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Number of I/O: 58
Program Memory Size: 1MB (1M x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 128K x 8
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Data Converters: A/D 24x12b SAR; D/A1x8b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Supplier Device Package: 64-LQFP (10x10)

패키지: -

Request a Quote