페이지 124 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  124/546
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RN73C2A6K65BTDF
TE Connectivity Passive Product

RES SMD 6.65KOHM 0.1% 1/10W 0805

  • Resistance: 6.65 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,398
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A2K67BTDF
TE Connectivity Passive Product

RES SMD 2.67KOHM 0.1% 1/10W 0805

  • Resistance: 2.67 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,444
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K24BTDF
TE Connectivity Passive Product

RES SMD 1.24KOHM 0.1% 1/10W 0805

  • Resistance: 1.24 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,024
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A681RBTDF
TE Connectivity Passive Product

RES SMD 681 OHM 0.1% 1/10W 0805

  • Resistance: 681 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,526
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A953RBTDF
TE Connectivity Passive Product

RES SMD 953 OHM 0.1% 1/10W 0805

  • Resistance: 953 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,434
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A45K3BTDF
TE Connectivity Passive Product

RES SMD 45.3KOHM 0.1% 1/10W 0805

  • Resistance: 45.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,328
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A24K9BTDF
TE Connectivity Passive Product

RES SMD 24.9KOHM 0.1% 1/10W 0805

  • Resistance: 24.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,546
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A27K4BTDF
TE Connectivity Passive Product

RES SMD 27.4KOHM 0.1% 1/10W 0805

  • Resistance: 27.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고5,292
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A5K49BTDF
TE Connectivity Passive Product

RES SMD 5.49KOHM 0.1% 1/10W 0805

  • Resistance: 5.49 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,442
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A14K3BTDF
TE Connectivity Passive Product

RES SMD 14.3KOHM 0.1% 1/10W 0805

  • Resistance: 14.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,984
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A53K6BTDF
TE Connectivity Passive Product

RES SMD 53.6KOHM 0.1% 1/10W 0805

  • Resistance: 53.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,088
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A14K7BTDF
TE Connectivity Passive Product

RES SMD 14.7KOHM 0.1% 1/10W 0805

  • Resistance: 14.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,106
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A143RBTDF
TE Connectivity Passive Product

RES SMD 143 OHM 0.1% 1/10W 0805

  • Resistance: 143 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,672
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A40K2BTDF
TE Connectivity Passive Product

RES SMD 40.2KOHM 0.1% 1/10W 0805

  • Resistance: 40.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,590
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A4K64BTDF
TE Connectivity Passive Product

RES SMD 4.64KOHM 0.1% 1/10W 0805

  • Resistance: 4.64 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,338
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6K81BTDF
TE Connectivity Passive Product

RES SMD 6.81KOHM 0.1% 1/10W 0805

  • Resistance: 6.81 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,526
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6K19BTDF
TE Connectivity Passive Product

RES SMD 6.19KOHM 0.1% 1/10W 0805

  • Resistance: 6.19 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,614
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A39K2BTDF
TE Connectivity Passive Product

RES SMD 39.2KOHM 0.1% 1/10W 0805

  • Resistance: 39.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고8,676
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A20K5BTDF
TE Connectivity Passive Product

RES SMD 20.5KOHM 0.1% 1/10W 0805

  • Resistance: 20.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,876
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K78BTDF
TE Connectivity Passive Product

RES SMD 1.78KOHM 0.1% 1/10W 0805

  • Resistance: 1.78 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고3,996
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A54K9BTDF
TE Connectivity Passive Product

RES SMD 54.9KOHM 0.1% 1/10W 0805

  • Resistance: 54.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,714
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A3K24BTDF
TE Connectivity Passive Product

RES SMD 3.24KOHM 0.1% 1/10W 0805

  • Resistance: 3.24 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고2,196
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K69BTDF
TE Connectivity Passive Product

RES SMD 1.69KOHM 0.1% 1/10W 0805

  • Resistance: 1.69 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,552
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A1K27BTDF
TE Connectivity Passive Product

RES SMD 1.27KOHM 0.1% 1/10W 0805

  • Resistance: 1.27 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고6,084
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A16K2BTDF
TE Connectivity Passive Product

RES SMD 16.2KOHM 0.1% 1/10W 0805

  • Resistance: 16.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,956
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A348RBTDF
TE Connectivity Passive Product

RES SMD 348 OHM 0.1% 1/10W 0805

  • Resistance: 348 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고4,284
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A5K36BTDF
TE Connectivity Passive Product

RES SMD 5.36KOHM 0.1% 1/10W 0805

  • Resistance: 5.36 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,578
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-
RN73C2A6R04BTDF
TE Connectivity Passive Product

RES SMD 6.04 OHM 0.1% 1/10W 0805

  • Resistance: 6.04 Ohms
  • Tolerance: ±0.1%
  • Power (Watts): 0.1W, 1/10W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±10ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 0805 (2012 Metric)
  • Supplier Device Package: 0805
  • Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 0805 (2012 Metric)
재고7,308
±0.1%
0.1W, 1/10W
Thin Film
-
±10ppm/°C
-55°C ~ 155°C
0805 (2012 Metric)
0805
0.079" L x 0.049" W (2.00mm x 1.25mm)
0.026" (0.65mm)
2
-