페이지 475 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  475/546
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부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2B2K21BTDF
TE Connectivity Passive Product

RES SMD 2.21K OHM 0.1% 1/4W 1206

  • Resistance: 2.21 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고8,298
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B2K15BTDF
TE Connectivity Passive Product

RES SMD 2.15K OHM 0.1% 1/4W 1206

  • Resistance: 2.15 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,960
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B2K1BTDF
TE Connectivity Passive Product

RES SMD 2.1K OHM 0.1% 1/4W 1206

  • Resistance: 2.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고2,628
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B2K05BTDF
TE Connectivity Passive Product

RES SMD 2.05K OHM 0.1% 1/4W 1206

  • Resistance: 2.05 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,452
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B2K0BTDF
TE Connectivity Passive Product

RES SMD 2K OHM 0.1% 1/4W 1206

  • Resistance: 2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,956
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K96BTDF
TE Connectivity Passive Product

RES SMD 1.96K OHM 0.1% 1/4W 1206

  • Resistance: 1.96 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고5,112
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K91BTDF
TE Connectivity Passive Product

RES SMD 1.91K OHM 0.1% 1/4W 1206

  • Resistance: 1.91 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,714
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K87BTDF
TE Connectivity Passive Product

RES SMD 1.87K OHM 0.1% 1/4W 1206

  • Resistance: 1.87 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,344
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K82BTDF
TE Connectivity Passive Product

RES SMD 1.82K OHM 0.1% 1/4W 1206

  • Resistance: 1.82 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,186
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K78BTDF
TE Connectivity Passive Product

RES SMD 1.78K OHM 0.1% 1/4W 1206

  • Resistance: 1.78 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,858
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K74BTDF
TE Connectivity Passive Product

RES SMD 1.74K OHM 0.1% 1/4W 1206

  • Resistance: 1.74 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고8,172
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K69BTDF
TE Connectivity Passive Product

RES SMD 1.69K OHM 0.1% 1/4W 1206

  • Resistance: 1.69 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,200
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K65BTDF
TE Connectivity Passive Product

RES SMD 1.65K OHM 0.1% 1/4W 1206

  • Resistance: 1.65 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,744
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K62BTDF
TE Connectivity Passive Product

RES SMD 1.62K OHM 0.1% 1/4W 1206

  • Resistance: 1.62 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고8,118
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K58BTDF
TE Connectivity Passive Product

RES SMD 1.58K OHM 0.1% 1/4W 1206

  • Resistance: 1.58 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,258
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K54BTDF
TE Connectivity Passive Product

RES SMD 1.54K OHM 0.1% 1/4W 1206

  • Resistance: 1.54 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고2,340
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K5BTDF
TE Connectivity Passive Product

RES SMD 1.5K OHM 0.1% 1/4W 1206

  • Resistance: 1.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고2,214
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K47BTDF
TE Connectivity Passive Product

RES SMD 1.47K OHM 0.1% 1/4W 1206

  • Resistance: 1.47 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,240
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K43BTDF
TE Connectivity Passive Product

RES SMD 1.43K OHM 0.1% 1/4W 1206

  • Resistance: 1.43 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고2,610
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K4BTDF
TE Connectivity Passive Product

RES SMD 1.4K OHM 0.1% 1/4W 1206

  • Resistance: 1.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,902
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K37BTDF
TE Connectivity Passive Product

RES SMD 1.37K OHM 0.1% 1/4W 1206

  • Resistance: 1.37 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,294
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K33BTDF
TE Connectivity Passive Product

RES SMD 1.33K OHM 0.1% 1/4W 1206

  • Resistance: 1.33 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고5,508
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K3BTDF
TE Connectivity Passive Product

RES SMD 1.3K OHM 0.1% 1/4W 1206

  • Resistance: 1.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,318
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K27BTDF
TE Connectivity Passive Product

RES SMD 1.27K OHM 0.1% 1/4W 1206

  • Resistance: 1.27 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고2,952
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K24BTDF
TE Connectivity Passive Product

RES SMD 1.24K OHM 0.1% 1/4W 1206

  • Resistance: 1.24 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,714
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K21BTDF
TE Connectivity Passive Product

RES SMD 1.21K OHM 0.1% 1/4W 1206

  • Resistance: 1.21 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고5,076
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K18BTDF
TE Connectivity Passive Product

RES SMD 1.18K OHM 0.1% 1/4W 1206

  • Resistance: 1.18 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,544
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B1K15BTDF
TE Connectivity Passive Product

RES SMD 1.15K OHM 0.1% 1/4W 1206

  • Resistance: 1.15 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,902
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-