페이지 479 - TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT) | Heisener Electronics
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TE Connectivity Passive Product 제품 - 칩 저항기 - 표면실장(SMD, SMT)

기록 15,287
페이지  479/546
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부품 번호
제조업체
설명
패키지
재고
수량
Tolerance
Power (Watts)
Composition
Features
Temperature Coefficient
Operating Temperature
Package / Case
Supplier Device Package
Size / Dimension
Height - Seated (Max)
Number of Terminations
Failure Rate
RP73D2B33K2BTDF
TE Connectivity Passive Product

RES SMD 33.2K OHM 0.1% 1/4W 1206

  • Resistance: 33.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,150
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B32K4BTDF
TE Connectivity Passive Product

RES SMD 32.4K OHM 0.1% 1/4W 1206

  • Resistance: 32.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,002
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B31K6BTDF
TE Connectivity Passive Product

RES SMD 31.6K OHM 0.1% 1/4W 1206

  • Resistance: 31.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고5,022
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B30K9BTDF
TE Connectivity Passive Product

RES SMD 30.9K OHM 0.1% 1/4W 1206

  • Resistance: 30.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,624
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B30K1BTDF
TE Connectivity Passive Product

RES SMD 30.1K OHM 0.1% 1/4W 1206

  • Resistance: 30.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,254
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B29K4BTDF
TE Connectivity Passive Product

RES SMD 29.4K OHM 0.1% 1/4W 1206

  • Resistance: 29.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,722
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B28K7BTDF
TE Connectivity Passive Product

RES SMD 28.7K OHM 0.1% 1/4W 1206

  • Resistance: 28.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고4,554
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B28KBTDF
TE Connectivity Passive Product

RES SMD 28K OHM 0.1% 1/4W 1206

  • Resistance: 28 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고4,014
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B27K4BTDF
TE Connectivity Passive Product

RES SMD 27.4K OHM 0.1% 1/4W 1206

  • Resistance: 27.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고4,518
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B26K7BTDF
TE Connectivity Passive Product

RES SMD 26.7K OHM 0.1% 1/4W 1206

  • Resistance: 26.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고2,646
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B26K1BTDF
TE Connectivity Passive Product

RES SMD 26.1K OHM 0.1% 1/4W 1206

  • Resistance: 26.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고8,424
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B24K9BTDF
TE Connectivity Passive Product

RES SMD 24.9K OHM 0.1% 1/4W 1206

  • Resistance: 24.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고8,586
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B24K3BTDF
TE Connectivity Passive Product

RES SMD 24.3K OHM 0.1% 1/4W 1206

  • Resistance: 24.3 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고8,280
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B23K7BTDF
TE Connectivity Passive Product

RES SMD 23.7K OHM 0.1% 1/4W 1206

  • Resistance: 23.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,804
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B23K2BTDF
TE Connectivity Passive Product

RES SMD 23.2K OHM 0.1% 1/4W 1206

  • Resistance: 23.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,372
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B22K6BTDF
TE Connectivity Passive Product

RES SMD 22.6K OHM 0.1% 1/4W 1206

  • Resistance: 22.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고4,662
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B22K1BTDF
TE Connectivity Passive Product

RES SMD 22.1K OHM 0.1% 1/4W 1206

  • Resistance: 22.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고5,382
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B21K5BTDF
TE Connectivity Passive Product

RES SMD 21.5K OHM 0.1% 1/4W 1206

  • Resistance: 21.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,704
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B21KBTDF
TE Connectivity Passive Product

RES SMD 21K OHM 0.1% 1/4W 1206

  • Resistance: 21 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고7,704
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B20K5BTDF
TE Connectivity Passive Product

RES SMD 20.5K OHM 0.1% 1/4W 1206

  • Resistance: 20.5 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,708
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B20KBTDF
TE Connectivity Passive Product

RES SMD 20K OHM 0.1% 1/4W 1206

  • Resistance: 20 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고2,196
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B19K6BTDF
TE Connectivity Passive Product

RES SMD 19.6K OHM 0.1% 1/4W 1206

  • Resistance: 19.6 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고5,814
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B19K1BTDF
TE Connectivity Passive Product

RES SMD 19.1K OHM 0.1% 1/4W 1206

  • Resistance: 19.1 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고5,274
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B18K7BTDF
TE Connectivity Passive Product

RES SMD 18.7K OHM 0.1% 1/4W 1206

  • Resistance: 18.7 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,390
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B18K2BTDF
TE Connectivity Passive Product

RES SMD 18.2K OHM 0.1% 1/4W 1206

  • Resistance: 18.2 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고6,732
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B17K8BTDF
TE Connectivity Passive Product

RES SMD 17.8K OHM 0.1% 1/4W 1206

  • Resistance: 17.8 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고4,320
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B17K4BTDF
TE Connectivity Passive Product

RES SMD 17.4K OHM 0.1% 1/4W 1206

  • Resistance: 17.4 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고4,302
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-
RP73D2B16K9BTDF
TE Connectivity Passive Product

RES SMD 16.9K OHM 0.1% 1/4W 1206

  • Resistance: 16.9 kOhms
  • Tolerance: ±0.1%
  • Power (Watts): 0.25W, 1/4W
  • Composition: Thin Film
  • Features: -
  • Temperature Coefficient: ±15ppm/°C
  • Operating Temperature: -55°C ~ 155°C
  • Package / Case: 1206 (3216 Metric)
  • Supplier Device Package: 1206
  • Size / Dimension: 0.120" L x 0.061" W (3.05mm x 1.55mm)
  • Height - Seated (Max): 0.026" (0.65mm)
  • Number of Terminations: 2
  • Failure Rate: -
패키지: 1206 (3216 Metric)
재고3,654
±0.1%
0.25W, 1/4W
Thin Film
-
±15ppm/°C
-55°C ~ 155°C
1206 (3216 Metric)
1206
0.120" L x 0.061" W (3.05mm x 1.55mm)
0.026" (0.65mm)
2
-