TE Connectivity Potter & Brumfield Relays 제품 - IC용 소켓, 트랜지스터

부품 번호	제조업체	설명	패키지	재고	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature
1437540-5	TE Connectivity Potter & Brumfield Relays	CONN IC DIP SOCKET 32POS TINLEAD Type: DIP, 0.6" (15.24mm) Row Spacing Number of Positions or Pins (Grid): 32 (2 x 16) Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin-Lead Contact Finish Thickness - Mating: 80µin (2.03µm) Contact Material - Mating: Copper Alloy Mounting Type: Through Hole Features: Open Frame Termination: Solder Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: Polyester Operating Temperature: -55°C ~ 105°C	패키지: -	재고3,600	32 (2 x 16)	0.100" (2.54mm)	Tin-Lead	80µin (2.03µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	-	-	-	Polyester	-55°C ~ 105°C
8058-1G55	TE Connectivity Potter & Brumfield Relays	TRANSISTOR SKT Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	패키지: -	재고4,554	-	-	-	-	-	-	-	-	-	-	-	-	-	-
5-1437504-8	TE Connectivity Potter & Brumfield Relays	TRANSISTOR SKT Type: - Number of Positions or Pins (Grid): - Pitch - Mating: - Contact Finish - Mating: - Contact Finish Thickness - Mating: - Contact Material - Mating: - Mounting Type: - Features: - Termination: - Pitch - Post: - Contact Finish - Post: - Contact Finish Thickness - Post: - Contact Material - Post: - Housing Material: - Operating Temperature: -	패키지: -	재고6,264	-	-	-	-	-	-	-	-	-	-	-	-	-	-