페이지 167 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
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Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
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제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XCS05XL-4VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
패키지: 100-TQFP
재고14,748
238
3200
77
5000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
100-TQFP
100-VQFP (14x14)
hot XCS05XL-4PC84C
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 61
  • Number of Gates: 5000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
패키지: 84-LCC (J-Lead)
재고17,712
238
3200
61
5000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
84-LCC (J-Lead)
84-PLCC (29.31x29.31)
hot XCS05-4VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 5000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
패키지: 100-TQFP
재고11,472
238
3200
77
5000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
100-TQFP
100-VQFP (14x14)
hot XCS05-4PC84C
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 61
  • Number of Gates: 5000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
패키지: 84-LCC (J-Lead)
재고6,400
238
3200
61
5000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
84-LCC (J-Lead)
84-PLCC (29.31x29.31)
hot XCS05-3VQ100I
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 5000
  • Voltage - Supply: 4.5 V ~ 5.5 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
패키지: 100-TQFP
재고15,900
238
3200
77
5000
4.5 V ~ 5.5 V
Surface Mount
-40°C ~ 100°C (TJ)
100-TQFP
100-VQFP (14x14)
hot XCS05-3VQ100C
Xilinx Inc.

IC FPGA 77 I/O 100VQFP

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 77
  • Number of Gates: 5000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 100-TQFP
  • Supplier Device Package: 100-VQFP (14x14)
패키지: 100-TQFP
재고5,952
238
3200
77
5000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
100-TQFP
100-VQFP (14x14)
hot XCS05-3PC84C
Xilinx Inc.

IC FPGA 61 I/O 84PLCC

  • Number of LABs/CLBs: 100
  • Number of Logic Elements/Cells: 238
  • Total RAM Bits: 3200
  • Number of I/O: 61
  • Number of Gates: 5000
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 84-LCC (J-Lead)
  • Supplier Device Package: 84-PLCC (29.31x29.31)
패키지: 84-LCC (J-Lead)
재고24,144
238
3200
61
5000
4.75 V ~ 5.25 V
Surface Mount
0°C ~ 85°C (TJ)
84-LCC (J-Lead)
84-PLCC (29.31x29.31)
hot XC4085XL-3BG560I
Xilinx Inc.

IC FPGA 448 I/O 560MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 448
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고5,920
7448
100352
448
85000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XC4085XL-3BG560C
Xilinx Inc.

IC FPGA 448 I/O 560MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 448
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고7,472
7448
100352
448
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XC4085XL-3BG432I
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고7,632
7448
100352
352
85000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4085XL-3BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고7,200
7448
100352
352
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4085XL-2BG560I
Xilinx Inc.

IC FPGA 448 I/O 560MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 448
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고4,656
7448
100352
448
85000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XC4085XL-2BG560C
Xilinx Inc.

IC FPGA 448 I/O 560MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 448
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고4,368
7448
100352
448
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XC4085XL-2BG432I
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고7,536
7448
100352
352
85000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4085XL-2BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고2,752
7448
100352
352
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4085XL-1BG560I
Xilinx Inc.

IC FPGA 448 I/O 560MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 448
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고6,288
7448
100352
448
85000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XC4085XL-1BG560C
Xilinx Inc.

IC FPGA 448 I/O 560MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 448
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고6,048
7448
100352
448
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XC4085XL-1BG432I
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고7,648
7448
100352
352
85000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4085XL-1BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고7,376
7448
100352
352
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4085XL-09BG560C
Xilinx Inc.

IC FPGA 448 I/O 560MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 448
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고3,264
7448
100352
448
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XC4085XL-09BG432C
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 3136
  • Number of Logic Elements/Cells: 7448
  • Total RAM Bits: 100352
  • Number of I/O: 352
  • Number of Gates: 85000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고4,976
7448
100352
352
85000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)
XC4062XL-3HQ304I
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 256
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
패키지: 304-BFQFP Exposed Pad
재고3,312
5472
73728
256
62000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
304-BFQFP Exposed Pad
304-PQFP (40x40)
XC4062XL-3HQ304C
Xilinx Inc.

IC FPGA 256 I/O 304HQFP

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 256
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 304-BFQFP Exposed Pad
  • Supplier Device Package: 304-PQFP (40x40)
패키지: 304-BFQFP Exposed Pad
재고3,232
5472
73728
256
62000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
304-BFQFP Exposed Pad
304-PQFP (40x40)
hot XC4062XL-3HQ240I
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 193
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP Exposed Pad
재고4,496
5472
73728
193
62000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
hot XC4062XL-3HQ240C
Xilinx Inc.

IC FPGA 193 I/O 240HQFP

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 193
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 240-BFQFP Exposed Pad
  • Supplier Device Package: 240-PQFP (32x32)
패키지: 240-BFQFP Exposed Pad
재고10,344
5472
73728
193
62000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
240-BFQFP Exposed Pad
240-PQFP (32x32)
XC4062XL-3BG560I
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 384
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고4,080
5472
73728
384
62000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
XC4062XL-3BG560C
Xilinx Inc.

IC FPGA 384 I/O 560MBGA

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 384
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 560-LBGA, Metal
  • Supplier Device Package: 560-MBGA (42.5x42.5)
패키지: 560-LBGA, Metal
재고4,400
5472
73728
384
62000
3 V ~ 3.6 V
Surface Mount
0°C ~ 85°C (TJ)
560-LBGA, Metal
560-MBGA (42.5x42.5)
hot XC4062XL-3BG432I
Xilinx Inc.

IC FPGA 352 I/O 432MBGA

  • Number of LABs/CLBs: 2304
  • Number of Logic Elements/Cells: 5472
  • Total RAM Bits: 73728
  • Number of I/O: 352
  • Number of Gates: 62000
  • Voltage - Supply: 3 V ~ 3.6 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 432-LBGA, Metal
  • Supplier Device Package: 432-MBGA (40x40)
패키지: 432-LBGA, Metal
재고4,496
5472
73728
352
62000
3 V ~ 3.6 V
Surface Mount
-40°C ~ 100°C (TJ)
432-LBGA, Metal
432-MBGA (40x40)