페이지 196 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
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Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
페이지  196/202
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
hot XC2V3000-4BF957I
Xilinx Inc.

IC FPGA 684 I/O 957FCBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 684
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 957-BBGA, FCBGA
  • Supplier Device Package: 957-FCBGA (40x40)
패키지: 957-BBGA, FCBGA
재고6,064
-
1769472
684
3000000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
957-BBGA, FCBGA
957-FCBGA (40x40)
hot XC2V3000-4FF1152I
Xilinx Inc.

IC FPGA 720 I/O 1152FCBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 720
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 1152-BBGA, FCBGA
  • Supplier Device Package: 1152-CFCBGA (35x35)
패키지: 1152-BBGA, FCBGA
재고4,560
-
1769472
720
3000000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
1152-BBGA, FCBGA
1152-CFCBGA (35x35)
XC2V3000-5BG728I
Xilinx Inc.

IC FPGA 516 I/O 728BGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 516
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 728-BBGA
  • Supplier Device Package: 728-MBGA (35x35)
패키지: 728-BBGA
재고5,248
-
1769472
516
3000000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
728-BBGA
728-MBGA (35x35)
hot XC2V2000-5FG676I
Xilinx Inc.

IC FPGA 456 I/O 676FBGA

  • Number of LABs/CLBs: 2688
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1032192
  • Number of I/O: 456
  • Number of Gates: 2000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고5,552
-
1032192
456
2000000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XC2V3000-4FG676I
Xilinx Inc.

IC FPGA 484 I/O 676FBGA

  • Number of LABs/CLBs: 3584
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 1769472
  • Number of I/O: 484
  • Number of Gates: 3000000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고9,912
-
1769472
484
3000000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XC2V250-5FG456I
Xilinx Inc.

IC FPGA 200 I/O 456FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 442368
  • Number of I/O: 200
  • Number of Gates: 250000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고7,788
-
442368
200
250000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
hot XC2V1500-4BG575I
Xilinx Inc.

IC FPGA 392 I/O 575BGA

  • Number of LABs/CLBs: 1920
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 884736
  • Number of I/O: 392
  • Number of Gates: 1500000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 575-BBGA
  • Supplier Device Package: 575-BGA (31x31)
패키지: 575-BBGA
재고6,372
-
884736
392
1500000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
575-BBGA
575-BGA (31x31)
hot XC2V250-5FG256I
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 442368
  • Number of I/O: 172
  • Number of Gates: 250000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고4,000
-
442368
172
250000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
256-BGA
256-FBGA (17x17)
XC2V250-4FG456I
Xilinx Inc.

IC FPGA 200 I/O 456FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 442368
  • Number of I/O: 200
  • Number of Gates: 250000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고4,944
-
442368
200
250000
1.425 V ~ 1.575 V
Surface Mount
-40°C ~ 100°C (TJ)
456-BBGA
456-FBGA (23x23)
XC2S600E-6FG456Q
Xilinx Inc.

IC FPGA 329 I/O 456FBGA

  • Number of LABs/CLBs: 3456
  • Number of Logic Elements/Cells: 15552
  • Total RAM Bits: 294912
  • Number of I/O: 329
  • Number of Gates: 600000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 456-BBGA
  • Supplier Device Package: 456-FBGA (23x23)
패키지: 456-BBGA
재고6,288
15552
294912
329
600000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 125°C (TJ)
456-BBGA
456-FBGA (23x23)
XA2S50E-6TQ144I
Xilinx Inc.

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 32768
  • Number of I/O: 102
  • Number of Gates: 50000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고2,688
1728
32768
102
50000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
144-LQFP
144-TQFP (20x20)
hot XA2S300E-6FT256Q
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 182
  • Number of Gates: 300000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고7,368
6912
65536
182
300000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 125°C (TJ)
256-LBGA
256-FTBGA (17x17)
XA2S50E-6TQ144Q
Xilinx Inc.

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: 1728
  • Total RAM Bits: 32768
  • Number of I/O: 102
  • Number of Gates: 50000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고2,096
1728
32768
102
50000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 125°C (TJ)
144-LQFP
144-TQFP (20x20)
XA2S100E-6FT256Q
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 182
  • Number of Gates: 100000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고3,504
2700
40960
182
100000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 125°C (TJ)
256-LBGA
256-FTBGA (17x17)
XA2S300E-6FT256I
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 1536
  • Number of Logic Elements/Cells: 6912
  • Total RAM Bits: 65536
  • Number of I/O: 182
  • Number of Gates: 300000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고3,536
6912
65536
182
300000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-LBGA
256-FTBGA (17x17)
XA2S100E-6TQ144Q
Xilinx Inc.

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 102
  • Number of Gates: 100000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고6,272
2700
40960
102
100000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 125°C (TJ)
144-LQFP
144-TQFP (20x20)
XA2S100E-6TQ144I
Xilinx Inc.

IC FPGA 102 I/O 144TQFP

  • Number of LABs/CLBs: 600
  • Number of Logic Elements/Cells: 2700
  • Total RAM Bits: 40960
  • Number of I/O: 102
  • Number of Gates: 100000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고3,056
2700
40960
102
100000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
144-LQFP
144-TQFP (20x20)
XA2S150E-6FT256I
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 182
  • Number of Gates: 150000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고7,472
3888
49152
182
150000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-LBGA
256-FTBGA (17x17)
XA2S150E-6FT256Q
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 864
  • Number of Logic Elements/Cells: 3888
  • Total RAM Bits: 49152
  • Number of I/O: 182
  • Number of Gates: 150000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고2,896
3888
49152
182
150000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 125°C (TJ)
256-LBGA
256-FTBGA (17x17)
hot XA2S200E-6FT256I
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 182
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고6,672
5292
57344
182
200000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
256-LBGA
256-FTBGA (17x17)
XA2S200E-6FT256Q
Xilinx Inc.

IC FPGA 182 I/O 256FTBGA

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 182
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 125°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고3,456
5292
57344
182
200000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 125°C (TJ)
256-LBGA
256-FTBGA (17x17)
hot XC3S1400AN-4FG676I
Xilinx Inc.

IC FPGA 502 I/O 676FBGA

  • Number of LABs/CLBs: 2816
  • Number of Logic Elements/Cells: 25344
  • Total RAM Bits: 589824
  • Number of I/O: 502
  • Number of Gates: 1400000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고6,240
25344
589824
502
1400000
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC3S50AN-4TQ144I
Xilinx Inc.

IC FPGA 108 I/O 144TQFP

  • Number of LABs/CLBs: 176
  • Number of Logic Elements/Cells: 1584
  • Total RAM Bits: 55296
  • Number of I/O: 108
  • Number of Gates: 50000
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-TQFP (20x20)
패키지: 144-LQFP
재고5,392
1584
55296
108
50000
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
144-LQFP
144-TQFP (20x20)
hot XC2S200E-6PQ208I
Xilinx Inc.

IC FPGA 146 I/O 208QFP

  • Number of LABs/CLBs: 1176
  • Number of Logic Elements/Cells: 5292
  • Total RAM Bits: 57344
  • Number of I/O: 146
  • Number of Gates: 200000
  • Voltage - Supply: 1.71 V ~ 1.89 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 208-BFQFP
  • Supplier Device Package: 208-PQFP (28x28)
패키지: 208-BFQFP
재고6,368
5292
57344
146
200000
1.71 V ~ 1.89 V
Surface Mount
-40°C ~ 100°C (TJ)
208-BFQFP
208-PQFP (28x28)
XC6VHX380T-2FF1923CES9945
Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

  • Number of LABs/CLBs: 29880
  • Number of Logic Elements/Cells: 382464
  • Total RAM Bits: 28311552
  • Number of I/O: 720
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 1924-BBGA, FCBGA
  • Supplier Device Package: 1924-FCBGA (45x45)
패키지: 1924-BBGA, FCBGA
재고4,816
382464
28311552
720
-
0.95 V ~ 1.05 V
Surface Mount
0°C ~ 85°C (TJ)
1924-BBGA, FCBGA
1924-FCBGA (45x45)
hot XC2V250-6FG256C
Xilinx Inc.

IC FPGA 172 I/O 256FBGA

  • Number of LABs/CLBs: 384
  • Number of Logic Elements/Cells: -
  • Total RAM Bits: 442368
  • Number of I/O: 172
  • Number of Gates: 250000
  • Voltage - Supply: 1.425 V ~ 1.575 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-BGA
  • Supplier Device Package: 256-FBGA (17x17)
패키지: 256-BGA
재고5,648
-
442368
172
250000
1.425 V ~ 1.575 V
Surface Mount
0°C ~ 85°C (TJ)
256-BGA
256-FBGA (17x17)
XC5VSX35T-X1FFG665C
Xilinx Inc.

IC FPGA 360 I/O 665FCBGA

  • Number of LABs/CLBs: 2720
  • Number of Logic Elements/Cells: 34816
  • Total RAM Bits: 3096576
  • Number of I/O: 360
  • Number of Gates: -
  • Voltage - Supply: 0.95 V ~ 1.05 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 665-BBGA, FCBGA
  • Supplier Device Package: 665-FCBGA (27x27)
패키지: 665-BBGA, FCBGA
재고5,392
34816
3096576
360
-
0.95 V ~ 1.05 V
Surface Mount
0°C ~ 85°C (TJ)
665-BBGA, FCBGA
665-FCBGA (27x27)
XC6SLX75T-4FGG676C
Xilinx Inc.

IC FPGA 348 I/O 676FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 348
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BGA
  • Supplier Device Package: 676-FBGA (27x27)
패키지: 676-BGA
재고2,496
74637
3170304
348
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BGA
676-FBGA (27x27)