페이지 201 - Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array) | Heisener Electronics
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Xilinx Inc. 제품 - 임베디드 - FPGA (Field Programmable Gate Array)

기록 5,652
페이지  201/202
이미지
부품 번호
제조업체
설명
패키지
재고
수량
Number of Logic Elements/Cells
Total RAM Bits
Number of I/O
Number of Gates
Voltage - Supply
Mounting Type
Operating Temperature
Package / Case
Supplier Device Package
XC7K410T-1FF676I
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고3,152
406720
29306880
400
-
0.97 V ~ 1.03 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC7K410T-1FF676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 31775
  • Number of Logic Elements/Cells: 406720
  • Total RAM Bits: 29306880
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,776
406720
29306880
400
-
0.97 V ~ 1.03 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XC7K325T-2FF676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고18,300
326080
16404480
400
-
0.97 V ~ 1.03 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC7K325T-2FB900C
Xilinx Inc.

IC FPGA 500 I/O 900FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 500
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA, FCBGA
  • Supplier Device Package: 900-FCBGA (31x31)
패키지: 900-BBGA, FCBGA
재고7,888
326080
16404480
500
-
0.97 V ~ 1.03 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA, FCBGA
900-FCBGA (31x31)
XC7K325T-2FB676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고6,672
326080
16404480
400
-
0.97 V ~ 1.03 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
hot XC7K325T-1FF676C
Xilinx Inc.

IC FPGA 400 I/O 676FCBGA

  • Number of LABs/CLBs: 25475
  • Number of Logic Elements/Cells: 326080
  • Total RAM Bits: 16404480
  • Number of I/O: 400
  • Number of Gates: -
  • Voltage - Supply: 0.97 V ~ 1.03 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고14,880
326080
16404480
400
-
0.97 V ~ 1.03 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX9-N3FT256I
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고7,408
9152
589824
186
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
256-LBGA
256-FTBGA (17x17)
XC6SLX9-N3FT256C
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 715
  • Number of Logic Elements/Cells: 9152
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고7,760
9152
589824
186
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
256-LBGA
256-FTBGA (17x17)
XC6SLX75T-N3FG676C
Xilinx Inc.

IC FPGA 348 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 348
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고4,848
74637
3170304
348
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX75T-N3FG484C
Xilinx Inc.

IC FPGA 268 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 268
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고7,360
74637
3170304
268
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX75-N3FG676I
Xilinx Inc.

IC FPGA 408 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,920
74637
3170304
408
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX75-N3FG676C
Xilinx Inc.

IC FPGA 408 I/O 676FCBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 408
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고6,208
74637
3170304
408
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX75-N3FG484I
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고2,624
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX75-N3FG484C
Xilinx Inc.

IC FPGA 280 I/O 484FBGA

  • Number of LABs/CLBs: 5831
  • Number of Logic Elements/Cells: 74637
  • Total RAM Bits: 3170304
  • Number of I/O: 280
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고3,792
74637
3170304
280
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX45T-N3FG484C
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고4,112
43661
2138112
296
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX45-N3FG676I
Xilinx Inc.

IC FPGA 358 I/O 676FCBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 358
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고6,496
43661
2138112
358
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX45-N3FG676C
Xilinx Inc.

IC FPGA 358 I/O 676FCBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 358
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,088
43661
2138112
358
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX45-N3FG484I
Xilinx Inc.

IC FPGA 316 I/O 484FBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 316
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고3,744
43661
2138112
316
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX45-N3FG484C
Xilinx Inc.

IC FPGA 316 I/O 484FBGA

  • Number of LABs/CLBs: 3411
  • Number of Logic Elements/Cells: 43661
  • Total RAM Bits: 2138112
  • Number of I/O: 316
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고5,328
43661
2138112
316
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX25T-N3FG484C
Xilinx Inc.

IC FPGA 250 I/O 484FBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 250
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고4,864
24051
958464
250
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX25-N3FG484C
Xilinx Inc.

IC FPGA 266 I/O 484FBGA

  • Number of LABs/CLBs: 1879
  • Number of Logic Elements/Cells: 24051
  • Total RAM Bits: 958464
  • Number of I/O: 266
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고5,648
24051
958464
266
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX16-N3FT256I
Xilinx Inc.

IC FPGA 186 I/O 256FTBGA

  • Number of LABs/CLBs: 1139
  • Number of Logic Elements/Cells: 14579
  • Total RAM Bits: 589824
  • Number of I/O: 186
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 256-LBGA
  • Supplier Device Package: 256-FTBGA (17x17)
패키지: 256-LBGA
재고2,912
14579
589824
186
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
256-LBGA
256-FTBGA (17x17)
XC6SLX150T-N3FG900I
Xilinx Inc.

IC FPGA 540 I/O 900FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 540
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
패키지: 900-BBGA
재고2,368
147443
4939776
540
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA
900-FBGA (31x31)
XC6SLX150T-N3FG900C
Xilinx Inc.

IC FPGA 540 I/O 900FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 540
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
패키지: 900-BBGA
재고6,320
147443
4939776
540
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
900-BBGA
900-FBGA (31x31)
XC6SLX150T-N3FG676C
Xilinx Inc.

IC FPGA 396 I/O 676FCBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 396
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 676-BBGA, FCBGA
  • Supplier Device Package: 676-FCBGA (27x27)
패키지: 676-BBGA, FCBGA
재고7,008
147443
4939776
396
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
676-BBGA, FCBGA
676-FCBGA (27x27)
XC6SLX150T-N3FG484I
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고6,384
147443
4939776
296
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX150T-N3FG484C
Xilinx Inc.

IC FPGA 296 I/O 484FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 296
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: 0°C ~ 85°C (TJ)
  • Package / Case: 484-BBGA
  • Supplier Device Package: 484-FBGA (23x23)
패키지: 484-BBGA
재고7,952
147443
4939776
296
-
1.14 V ~ 1.26 V
Surface Mount
0°C ~ 85°C (TJ)
484-BBGA
484-FBGA (23x23)
XC6SLX150-N3FG900I
Xilinx Inc.

IC FPGA 576 I/O 900FBGA

  • Number of LABs/CLBs: 11519
  • Number of Logic Elements/Cells: 147443
  • Total RAM Bits: 4939776
  • Number of I/O: 576
  • Number of Gates: -
  • Voltage - Supply: 1.14 V ~ 1.26 V
  • Mounting Type: Surface Mount
  • Operating Temperature: -40°C ~ 100°C (TJ)
  • Package / Case: 900-BBGA
  • Supplier Device Package: 900-FBGA (31x31)
패키지: 900-BBGA
재고7,152
147443
4939776
576
-
1.14 V ~ 1.26 V
Surface Mount
-40°C ~ 100°C (TJ)
900-BBGA
900-FBGA (31x31)