페이지 141 - Xilinx Inc. 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
XCZU17EG-2FFVB1517I	Xilinx Inc.	IC FPGA 644 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고2,816
XCZU7EG-L2FFVC1156E	Xilinx Inc.	IC FPGA 360 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	패키지: 1156-BBGA, FCBGA	재고7,632
XCZU2EG-1SFVC784E	Xilinx Inc.	IC FPGA 252 I/O 784FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 784-BBGA, FCBGA Supplier Device Package: 784-FCBGA (23x23)	패키지: 784-BBGA, FCBGA	재고2,640
XC7Z010-L1CLG225I	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX7 225BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 28K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	패키지: 225-LFBGA, CSPBGA	재고3,376
XC7Z012S-2CLG485E	Xilinx Inc.	IC FPGA SOC 150I/O 485BGA Architecture: MCU, FPGA Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 766MHz Primary Attributes: Artix?-7 FPGA, 55K Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 484-LFBGA, CSPBGA Supplier Device Package: 485-CSBGA (19x19)	패키지: 484-LFBGA, CSPBGA	재고5,536
XQV300-4BG432N	Xilinx Inc.	IC FPGA 2.5V 300K GATES 432-BGA Number of LABs/CLBs: 1536 Number of Logic Elements/Cells: 6912 Total RAM Bits: 65536 Number of I/O: 316 Number of Gates: 322970 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	패키지: 432-LBGA, Metal	재고4,736
XC6SLX75-N3FG676I	Xilinx Inc.	IC FPGA 408 I/O 676FCBGA Number of LABs/CLBs: 5831 Number of Logic Elements/Cells: 74637 Total RAM Bits: 3170304 Number of I/O: 408 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	패키지: 676-BBGA, FCBGA	재고7,920
XA3S1000-4FTG256Q	Xilinx Inc.	IC FPGA 173 I/O 256FTBGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: 17280 Total RAM Bits: 442368 Number of I/O: 173 Number of Gates: 1000000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 125°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	패키지: 256-LBGA	재고5,568
XCV600E-6FG900C	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	패키지: 900-BBGA	재고22,212
XCV50E-7PQ240I	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 65536 Number of I/O: 158 Number of Gates: 71693 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	패키지: 240-BFQFP	재고4,080
XCV50E-7CS144C	Xilinx Inc.	IC FPGA 94 I/O 144CSBGA Number of LABs/CLBs: 384 Number of Logic Elements/Cells: 1728 Total RAM Bits: 65536 Number of I/O: 94 Number of Gates: 71693 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-TFBGA, CSPBGA Supplier Device Package: 144-LCSBGA (12x12)	패키지: 144-TFBGA, CSPBGA	재고6,600
XCVU080-1FFVB2104I	Xilinx Inc.	IC FPGA 702 I/O 2104FCBGA Number of LABs/CLBs: 55714 Number of Logic Elements/Cells: 975000 Total RAM Bits: 51200000 Number of I/O: 702 Number of Gates: - Voltage - Supply: 0.922 V ~ 0.979 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	패키지: 2104-BBGA, FCBGA	재고5,424
XC6VHX380T-1FF1924I	Xilinx Inc.	IC FPGA 640 I/O 1924FCBGA Number of LABs/CLBs: 29880 Number of Logic Elements/Cells: 382464 Total RAM Bits: 28311552 Number of I/O: 640 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	패키지: 1924-BBGA, FCBGA	재고5,040
XC2VP70-5FF1517I	Xilinx Inc.	IC FPGA 964 I/O 1517FCBGA Number of LABs/CLBs: 8272 Number of Logic Elements/Cells: 74448 Total RAM Bits: 6045696 Number of I/O: 964 Number of Gates: - Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고6,848
XCKU5P-1FFVB676I	Xilinx Inc.	IC FPGA 280 I/O 676FCBGA Number of LABs/CLBs: 27120 Number of Logic Elements/Cells: 474600 Total RAM Bits: 35737600 Number of I/O: 280 Number of Gates: - Voltage - Supply: 0.87 V ~ 0.93 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	패키지: 676-BBGA, FCBGA	재고4,304
XQ5VFX70T-1EF665I	Xilinx Inc.	IC FPGA VIRTEX-5FX 70K 665-FBGA Number of LABs/CLBs: 5600 Number of Logic Elements/Cells: 71680 Total RAM Bits: 5455872 Number of I/O: 360 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 665-BBGA, FCBGA Supplier Device Package: 665-FCBGA (27x27)	패키지: 665-BBGA, FCBGA	재고3,872
XC7A200T-2FB676I	Xilinx Inc.	IC FPGA ARTIX7 400 I/O 676FCBGA Number of LABs/CLBs: 16825 Number of Logic Elements/Cells: 215360 Total RAM Bits: 13455360 Number of I/O: 400 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	패키지: 676-BBGA, FCBGA	재고4,192
XC6SLX100T-2FG676C	Xilinx Inc.	IC FPGA 376 I/O 676FCBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 376 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	패키지: 676-BBGA, FCBGA	재고5,344
XC7A100T-L1FGG484I	Xilinx Inc.	IC FPGA 250 I/O 484FCBGA Number of LABs/CLBs: 7925 Number of Logic Elements/Cells: 101440 Total RAM Bits: 4976640 Number of I/O: 250 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	패키지: 484-BBGA	재고2,048
XC3S700A-4FG484C	Xilinx Inc.	IC FPGA 372 I/O 484FBGA Number of LABs/CLBs: 1472 Number of Logic Elements/Cells: 13248 Total RAM Bits: 368640 Number of I/O: 372 Number of Gates: 700000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 484-BBGA Supplier Device Package: 484-FBGA (23x23)	패키지: 484-BBGA	재고6,976
XC7A15T-L1FTG256I	Xilinx Inc.	IC FPGA ARTIX7 170 I/O 256FTBGA Number of LABs/CLBs: 1300 Number of Logic Elements/Cells: 16640 Total RAM Bits: 921600 Number of I/O: 170 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	패키지: 256-LBGA	재고2,832
XC6SLX16-N3CSG225I	Xilinx Inc.	IC FPGA 160 I/O 225CSBGA Number of LABs/CLBs: 1139 Number of Logic Elements/Cells: 14579 Total RAM Bits: 589824 Number of I/O: 160 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13)	패키지: 225-LFBGA, CSPBGA	재고3,280
XC3S400A-4FT256C	Xilinx Inc.	IC FPGA 195 I/O 256FTBGA Number of LABs/CLBs: 896 Number of Logic Elements/Cells: 8064 Total RAM Bits: 368640 Number of I/O: 195 Number of Gates: 400000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 256-LBGA Supplier Device Package: 256-FTBGA (17x17)	패키지: 256-LBGA	재고9,624
XC95144XL-5TQ100C	Xilinx Inc.	IC CPLD 144MC 5NS 100TQFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 5.0ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 144 Number of Gates: 3200 Number of I/O: 81 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-LQFP Supplier Device Package: 100-TQFP (14x14)	패키지: 100-LQFP	재고13,524
XCR3064XL-6VQ100C	Xilinx Inc.	IC CPLD 64MC 5.5NS 100VQFP Programmable Type: In System Programmable (min 1K program/erase cycles) Delay Time tpd(1) Max: 5.5ns Voltage Supply - Internal: 3 V ~ 3.6 V Number of Logic Elements/Blocks: 4 Number of Macrocells: 64 Number of Gates: 1500 Number of I/O: 68 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	패키지: 100-TQFP	재고6,000
XC2C128-7VQG100C	Xilinx Inc.	IC CPLD 128MC 7NS 100VQFP Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.0ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 8 Number of Macrocells: 128 Number of Gates: 3000 Number of I/O: 80 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	패키지: 100-TQFP	재고85,836
XC7S6-1FTGB196C	Xilinx Inc.	XC7S6-1FTGB196C Number of LABs/CLBs: - Number of Logic Elements/Cells: 6000 Total RAM Bits: 184320 Number of I/O: 100 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 196-LBGA, CSPBGA Supplier Device Package: 196-CSBGA (15x15)	패키지: 196-LBGA, CSPBGA	재고5,504
31018-07-3418	Xilinx Inc.	31018-07-3418 Number of LABs/CLBs: - Number of Logic Elements/Cells: - Total RAM Bits: - Number of I/O: - Number of Gates: - Voltage - Supply: - Mounting Type: - Operating Temperature: - Package / Case: - Supplier Device Package: -	패키지: -	재고6,400

XCZU17EG-2FFVB1517I

Xilinx Inc.

IC FPGA 644 I/O 1517FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고2,816

XCZU7EG-L2FFVC1156E

Xilinx Inc.

IC FPGA 360 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

패키지: 1156-BBGA, FCBGA

재고7,632

XCZU2EG-1SFVC784E

Xilinx Inc.

IC FPGA 252 I/O 784FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 103K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 784-BBGA, FCBGA
Supplier Device Package: 784-FCBGA (23x23)

패키지: 784-BBGA, FCBGA

재고2,640

XC7Z010-L1CLG225I

Xilinx Inc.

IC SOC CORTEX-A9 ARTIX7 225BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix?-7 FPGA, 28K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

패키지: 225-LFBGA, CSPBGA

재고3,376

XC7Z012S-2CLG485E

Xilinx Inc.

IC FPGA SOC 150I/O 485BGA

Architecture: MCU, FPGA
Core Processor: Single ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 766MHz
Primary Attributes: Artix?-7 FPGA, 55K Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 484-LFBGA, CSPBGA
Supplier Device Package: 485-CSBGA (19x19)

패키지: 484-LFBGA, CSPBGA

재고5,536

XQV300-4BG432N

Xilinx Inc.

IC FPGA 2.5V 300K GATES 432-BGA

Number of LABs/CLBs: 1536
Number of Logic Elements/Cells: 6912
Total RAM Bits: 65536
Number of I/O: 316
Number of Gates: 322970
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

패키지: 432-LBGA, Metal

재고4,736

XC6SLX75-N3FG676I

Xilinx Inc.

IC FPGA 408 I/O 676FCBGA

Number of LABs/CLBs: 5831
Number of Logic Elements/Cells: 74637
Total RAM Bits: 3170304
Number of I/O: 408
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

패키지: 676-BBGA, FCBGA

재고7,920

XA3S1000-4FTG256Q

Xilinx Inc.

IC FPGA 173 I/O 256FTBGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: 17280
Total RAM Bits: 442368
Number of I/O: 173
Number of Gates: 1000000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

패키지: 256-LBGA

재고5,568

XCV600E-6FG900C

Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

패키지: 900-BBGA

재고22,212

XCV50E-7PQ240I

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 384
Number of Logic Elements/Cells: 1728
Total RAM Bits: 65536
Number of I/O: 158
Number of Gates: 71693
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

패키지: 240-BFQFP

재고4,080

XCV50E-7CS144C

Xilinx Inc.

IC FPGA 94 I/O 144CSBGA

Number of LABs/CLBs: 384
Number of Logic Elements/Cells: 1728
Total RAM Bits: 65536
Number of I/O: 94
Number of Gates: 71693
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-TFBGA, CSPBGA
Supplier Device Package: 144-LCSBGA (12x12)

패키지: 144-TFBGA, CSPBGA

재고6,600

XCVU080-1FFVB2104I

Xilinx Inc.

IC FPGA 702 I/O 2104FCBGA

Number of LABs/CLBs: 55714
Number of Logic Elements/Cells: 975000
Total RAM Bits: 51200000
Number of I/O: 702
Number of Gates: -
Voltage - Supply: 0.922 V ~ 0.979 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

패키지: 2104-BBGA, FCBGA

재고5,424

XC6VHX380T-1FF1924I

Xilinx Inc.

IC FPGA 640 I/O 1924FCBGA

Number of LABs/CLBs: 29880
Number of Logic Elements/Cells: 382464
Total RAM Bits: 28311552
Number of I/O: 640
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1924-FCBGA (45x45)

패키지: 1924-BBGA, FCBGA

재고5,040

XC2VP70-5FF1517I

Xilinx Inc.

IC FPGA 964 I/O 1517FCBGA

Number of LABs/CLBs: 8272
Number of Logic Elements/Cells: 74448
Total RAM Bits: 6045696
Number of I/O: 964
Number of Gates: -
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고6,848

XCKU5P-1FFVB676I

Xilinx Inc.

IC FPGA 280 I/O 676FCBGA

Number of LABs/CLBs: 27120
Number of Logic Elements/Cells: 474600
Total RAM Bits: 35737600
Number of I/O: 280
Number of Gates: -
Voltage - Supply: 0.87 V ~ 0.93 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

패키지: 676-BBGA, FCBGA

재고4,304

XQ5VFX70T-1EF665I

Xilinx Inc.

IC FPGA VIRTEX-5FX 70K 665-FBGA

Number of LABs/CLBs: 5600
Number of Logic Elements/Cells: 71680
Total RAM Bits: 5455872
Number of I/O: 360
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 665-BBGA, FCBGA
Supplier Device Package: 665-FCBGA (27x27)

패키지: 665-BBGA, FCBGA

재고3,872

XC7A200T-2FB676I

Xilinx Inc.

IC FPGA ARTIX7 400 I/O 676FCBGA

Number of LABs/CLBs: 16825
Number of Logic Elements/Cells: 215360
Total RAM Bits: 13455360
Number of I/O: 400
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

패키지: 676-BBGA, FCBGA

재고4,192

XC6SLX100T-2FG676C

Xilinx Inc.

IC FPGA 376 I/O 676FCBGA

Number of LABs/CLBs: 7911
Number of Logic Elements/Cells: 101261
Total RAM Bits: 4939776
Number of I/O: 376
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

패키지: 676-BBGA, FCBGA

재고5,344

XC7A100T-L1FGG484I

Xilinx Inc.

IC FPGA 250 I/O 484FCBGA

Number of LABs/CLBs: 7925
Number of Logic Elements/Cells: 101440
Total RAM Bits: 4976640
Number of I/O: 250
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

패키지: 484-BBGA

재고2,048

XC3S700A-4FG484C

Xilinx Inc.

IC FPGA 372 I/O 484FBGA

Number of LABs/CLBs: 1472
Number of Logic Elements/Cells: 13248
Total RAM Bits: 368640
Number of I/O: 372
Number of Gates: 700000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 484-BBGA
Supplier Device Package: 484-FBGA (23x23)

패키지: 484-BBGA

재고6,976

XC7A15T-L1FTG256I

Xilinx Inc.

IC FPGA ARTIX7 170 I/O 256FTBGA

Number of LABs/CLBs: 1300
Number of Logic Elements/Cells: 16640
Total RAM Bits: 921600
Number of I/O: 170
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

패키지: 256-LBGA

재고2,832

XC6SLX16-N3CSG225I

Xilinx Inc.

IC FPGA 160 I/O 225CSBGA

Number of LABs/CLBs: 1139
Number of Logic Elements/Cells: 14579
Total RAM Bits: 589824
Number of I/O: 160
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)

패키지: 225-LFBGA, CSPBGA

재고3,280

XC3S400A-4FT256C

Xilinx Inc.

IC FPGA 195 I/O 256FTBGA

Number of LABs/CLBs: 896
Number of Logic Elements/Cells: 8064
Total RAM Bits: 368640
Number of I/O: 195
Number of Gates: 400000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 256-LBGA
Supplier Device Package: 256-FTBGA (17x17)

패키지: 256-LBGA

재고9,624

XC95144XL-5TQ100C

Xilinx Inc.

IC CPLD 144MC 5NS 100TQFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 5.0ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 144
Number of Gates: 3200
Number of I/O: 81
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Supplier Device Package: 100-TQFP (14x14)

패키지: 100-LQFP

재고13,524

XCR3064XL-6VQ100C

Xilinx Inc.

IC CPLD 64MC 5.5NS 100VQFP

Programmable Type: In System Programmable (min 1K program/erase cycles)
Delay Time tpd(1) Max: 5.5ns
Voltage Supply - Internal: 3 V ~ 3.6 V
Number of Logic Elements/Blocks: 4
Number of Macrocells: 64
Number of Gates: 1500
Number of I/O: 68
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

패키지: 100-TQFP

재고6,000

XC2C128-7VQG100C

Xilinx Inc.

IC CPLD 128MC 7NS 100VQFP

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.0ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 8
Number of Macrocells: 128
Number of Gates: 3000
Number of I/O: 80
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

패키지: 100-TQFP

재고85,836

XC7S6-1FTGB196C

Xilinx Inc.

XC7S6-1FTGB196C

Number of LABs/CLBs: -
Number of Logic Elements/Cells: 6000
Total RAM Bits: 184320
Number of I/O: 100
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 196-LBGA, CSPBGA
Supplier Device Package: 196-CSBGA (15x15)

패키지: 196-LBGA, CSPBGA

재고5,504

31018-07-3418

Xilinx Inc.

31018-07-3418

Number of LABs/CLBs: -
Number of Logic Elements/Cells: -
Total RAM Bits: -
Number of I/O: -
Number of Gates: -
Voltage - Supply: -
Mounting Type: -
Operating Temperature: -
Package / Case: -
Supplier Device Package: -

패키지: -

재고6,400