페이지 46 - Xilinx Inc. 제품 | Heisener Electronics

부품 번호	제조업체	설명	패키지	재고
XC17128EVO8I	Xilinx Inc.	IC SERIAL CFG PROM 128K 8-SOIC Programmable Type: OTP Memory Size: 128kb Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C Package / Case: 8-SOIC (0.154", 3.90mm Width) Supplier Device Package: 8-TSOP	패키지: 8-SOIC (0.154", 3.90mm Width)	재고4,784
XCZU17EG-L1FFVC1760I	Xilinx Inc.	IC FPGA 512 I/O 1760FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1760-FCBGA (42.5x42.5)	패키지: 1760-BBGA, FCBGA	재고4,064
XCZU9EG-3FFVB1156E	Xilinx Inc.	IC FPGA 328 I/O 1156FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	패키지: 1156-BBGA, FCBGA	재고3,104
XCZU7EG-1FFVF1517E	Xilinx Inc.	IC FPGA 464 I/O 1517FCBGA Architecture: MCU, FPGA Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA, WDT Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 600MHz, 1.5GHz Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고6,080
XC7Z020-L1CLG400I	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7400BGA Architecture: MCU, FPGA Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight? Flash Size: - RAM Size: 256KB Peripherals: DMA Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Speed: 667MHz Primary Attributes: Artix?-7 FPGA, 85K Logic Cells Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-LFBGA, CSPBGA Supplier Device Package: 400-CSPBGA (17x17)	패키지: 400-LFBGA, CSPBGA	재고6,656
XC2V1500-5BG575I	Xilinx Inc.	IC FPGA 392 I/O 575BGA Number of LABs/CLBs: 1920 Number of Logic Elements/Cells: - Total RAM Bits: 884736 Number of I/O: 392 Number of Gates: 1500000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 575-BBGA Supplier Device Package: 575-BGA (31x31)	패키지: 575-BBGA	재고4,496
XC2V2000-4FFG896C	Xilinx Inc.	IC FPGA 624 I/O 896FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: - Total RAM Bits: 1032192 Number of I/O: 624 Number of Gates: 2000000 Voltage - Supply: 1.425 V ~ 1.575 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 896-BBGA, FCBGA Supplier Device Package: 896-FCBGA (31x31)	패키지: 896-BBGA, FCBGA	재고5,008
XCS20XL-4VQG100C	Xilinx Inc.	IC FPGA 77 I/O 100VQFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 77 Number of Gates: 20000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	패키지: 100-TQFP	재고13,332
XCV100E-7PQ240I	Xilinx Inc.	IC FPGA 158 I/O 240QFP Number of LABs/CLBs: 600 Number of Logic Elements/Cells: 2700 Total RAM Bits: 81920 Number of I/O: 158 Number of Gates: 128236 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Supplier Device Package: 240-PQFP (32x32)	패키지: 240-BFQFP	재고6,080
XCS30-3VQ100C	Xilinx Inc.	IC FPGA 77 I/O 100VQFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 77 Number of Gates: 30000 Voltage - Supply: 4.75 V ~ 5.25 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 100-TQFP Supplier Device Package: 100-VQFP (14x14)	패키지: 100-TQFP	재고4,720
XC4085XL-09BG560C	Xilinx Inc.	IC FPGA 448 I/O 560MBGA Number of LABs/CLBs: 3136 Number of Logic Elements/Cells: 7448 Total RAM Bits: 100352 Number of I/O: 448 Number of Gates: 85000 Voltage - Supply: 3 V ~ 3.6 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	패키지: 560-LBGA, Metal	재고3,264
XC4013E-4HQ240I	Xilinx Inc.	IC FPGA 192 I/O 240HQFP Number of LABs/CLBs: 576 Number of Logic Elements/Cells: 1368 Total RAM Bits: 18432 Number of I/O: 192 Number of Gates: 13000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	패키지: 240-BFQFP Exposed Pad	재고5,856
XC4010E-2HQ208I	Xilinx Inc.	IC FPGA 160 I/O 208HQFP Number of LABs/CLBs: 400 Number of Logic Elements/Cells: 950 Total RAM Bits: 12800 Number of I/O: 160 Number of Gates: 10000 Voltage - Supply: 4.5 V ~ 5.5 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 208-BFQFP Exposed Pad Supplier Device Package: 208-PQFP (28x28)	패키지: 208-BFQFP Exposed Pad	재고2,160
XC6VHX565T-2FF1923C	Xilinx Inc.	IC FPGA 720 I/O 1923FCBGA Number of LABs/CLBs: 44280 Number of Logic Elements/Cells: 566784 Total RAM Bits: 33619968 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 1924-BBGA, FCBGA Supplier Device Package: 1924-FCBGA (45x45)	패키지: 1924-BBGA, FCBGA	재고7,344
XC6VLX365T-1FFG1759I	Xilinx Inc.	IC FPGA 720 I/O 1759FCBGA Number of LABs/CLBs: 28440 Number of Logic Elements/Cells: 364032 Total RAM Bits: 15335424 Number of I/O: 720 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1760-BBGA, FCBGA Supplier Device Package: 1759-FCBGA (42.5x42.5)	패키지: 1760-BBGA, FCBGA	재고18,624
XCKU060-L1FFVA1156I	Xilinx Inc.	IC FPGA 520 I/O 1156FCBGA Number of LABs/CLBs: 41460 Number of Logic Elements/Cells: 725550 Total RAM Bits: 38912000 Number of I/O: 520 Number of Gates: - Voltage - Supply: 0.880 V ~ 0.920 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	패키지: 1156-BBGA, FCBGA	재고2,192
XC4VFX100-10FF1517I	Xilinx Inc.	IC FPGA 768 I/O 1517FCBGA Number of LABs/CLBs: 10544 Number of Logic Elements/Cells: 94896 Total RAM Bits: 6930432 Number of I/O: 768 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1517-BBGA, FCBGA Supplier Device Package: 1517-FCBGA (40x40)	패키지: 1517-BBGA, FCBGA	재고3,936
XC6VLX130T-L1FF484I	Xilinx Inc.	IC FPGA 240 I/O 484FCBGA Number of LABs/CLBs: 10000 Number of Logic Elements/Cells: 128000 Total RAM Bits: 9732096 Number of I/O: 240 Number of Gates: - Voltage - Supply: 0.91 V ~ 0.97 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 484-BBGA, FCBGA Supplier Device Package: 484-FCBGA (23x23)	패키지: 484-BBGA, FCBGA	재고5,376
XC4VLX25-10SFG363I	Xilinx Inc.	IC FPGA 240 I/O 363FCBGA Number of LABs/CLBs: 2688 Number of Logic Elements/Cells: 24192 Total RAM Bits: 1327104 Number of I/O: 240 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 363-FBGA, FCBGA Supplier Device Package: 363-FCBGA (17x17)	패키지: 363-FBGA, FCBGA	재고5,552
XC6SLX100-L1FGG676C	Xilinx Inc.	IC FPGA 480 I/O 676FBGA Number of LABs/CLBs: 7911 Number of Logic Elements/Cells: 101261 Total RAM Bits: 4939776 Number of I/O: 480 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BGA Supplier Device Package: 676-FBGA (27x27)	패키지: 676-BGA	재고5,584
XA3S1200E-4FGG400I	Xilinx Inc.	IC FPGA 304 I/O 400FBGA Number of LABs/CLBs: 8672 Number of Logic Elements/Cells: 19512 Total RAM Bits: 516096 Number of I/O: 304 Number of Gates: 1200000 Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 400-BGA Supplier Device Package: 400-FBGA (21x21)	패키지: 400-BGA	재고5,120
XA7A35T-2CSG325I	Xilinx Inc.	IC FPGA 150 I/O 325BGA Number of LABs/CLBs: 2600 Number of Logic Elements/Cells: 33280 Total RAM Bits: 1843200 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 324-LFBGA, CSPBGA Supplier Device Package: 325-CSBGA (15x15)	패키지: 324-LFBGA, CSPBGA	재고2,544
XC6SLX4-2TQG144C	Xilinx Inc.	IC FPGA 102 I/O 144TQFP Number of LABs/CLBs: 300 Number of Logic Elements/Cells: 3840 Total RAM Bits: 221184 Number of I/O: 102 Number of Gates: - Voltage - Supply: 1.14 V ~ 1.26 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 144-LQFP Supplier Device Package: 144-TQFP (20x20)	패키지: 144-LQFP	재고60,348
XC95108-7PQ160C	Xilinx Inc.	IC CPLD 108MC 7.5NS 160QFP Programmable Type: In System Programmable (min 10K program/erase cycles) Delay Time tpd(1) Max: 7.5ns Voltage Supply - Internal: 4.75 V ~ 5.25 V Number of Logic Elements/Blocks: 6 Number of Macrocells: 108 Number of Gates: 2400 Number of I/O: 108 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 160-BQFP Supplier Device Package: 160-PQFP (28x28)	패키지: 160-BQFP	재고13,152
XC2C384-7FGG324C	Xilinx Inc.	IC CPLD 384MC 7.1NS 324FBGA Programmable Type: In System Programmable Delay Time tpd(1) Max: 7.1ns Voltage Supply - Internal: 1.7 V ~ 1.9 V Number of Logic Elements/Blocks: 24 Number of Macrocells: 384 Number of Gates: 9000 Number of I/O: 240 Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 324-BBGA Supplier Device Package: 324-FBGA (23x23)	패키지: 324-BBGA	재고2,976
XA7A25T-2CPG238I	Xilinx Inc.	XA7A25T-2CPG238I Number of LABs/CLBs: 1825 Number of Logic Elements/Cells: 23360 Total RAM Bits: 1658880 Number of I/O: 150 Number of Gates: - Voltage - Supply: 0.95 V ~ 1.05 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 238-LFBGA, CSPBGA Supplier Device Package: 236-CSBGA (10x10)	패키지: 238-LFBGA, CSPBGA	재고8,244
XCVU5P-1FLVC2104I	Xilinx Inc.	IC FPGA VIRTEX-UP 2104FCBGA Number of LABs/CLBs: 75072 Number of Logic Elements/Cells: 1313763 Total RAM Bits: 190976000 Number of I/O: 416 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 2104-BBGA, FCBGA Supplier Device Package: 2104-FCBGA (47.5x47.5)	패키지: 2104-BBGA, FCBGA	재고3,264
XCKU15P-2FFVA1156E	Xilinx Inc.	XCKU15P-2FFVA1156E Number of LABs/CLBs: 65340 Number of Logic Elements/Cells: 1143450 Total RAM Bits: 82329600 Number of I/O: 516 Number of Gates: - Voltage - Supply: 0.825 V ~ 0.876 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 100°C (TJ) Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35)	패키지: 1156-BBGA, FCBGA	재고5,936

XC17128EVO8I

Xilinx Inc.

IC SERIAL CFG PROM 128K 8-SOIC

Programmable Type: OTP
Memory Size: 128kb
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package: 8-TSOP

패키지: 8-SOIC (0.154", 3.90mm Width)

재고4,784

XCZU17EG-L1FFVC1760I

Xilinx Inc.

IC FPGA 512 I/O 1760FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 926K+ Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1760-FCBGA (42.5x42.5)

패키지: 1760-BBGA, FCBGA

재고4,064

XCZU9EG-3FFVB1156E

Xilinx Inc.

IC FPGA 328 I/O 1156FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 599K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

패키지: 1156-BBGA, FCBGA

재고3,104

XCZU7EG-1FFVF1517E

Xilinx Inc.

IC FPGA 464 I/O 1517FCBGA

Architecture: MCU, FPGA
Core Processor: Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA, WDT
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 600MHz, 1.5GHz
Primary Attributes: Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고6,080

XC7Z020-L1CLG400I

Xilinx Inc.

IC SOC CORTEX-A9 KINTEX7400BGA

Architecture: MCU, FPGA
Core Processor: Dual ARM? Cortex?-A9 MPCore? with CoreSight?
Flash Size: -
RAM Size: 256KB
Peripherals: DMA
Connectivity: CAN, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed: 667MHz
Primary Attributes: Artix?-7 FPGA, 85K Logic Cells
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-LFBGA, CSPBGA
Supplier Device Package: 400-CSPBGA (17x17)

패키지: 400-LFBGA, CSPBGA

재고6,656

XC2V1500-5BG575I

Xilinx Inc.

IC FPGA 392 I/O 575BGA

Number of LABs/CLBs: 1920
Number of Logic Elements/Cells: -
Total RAM Bits: 884736
Number of I/O: 392
Number of Gates: 1500000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 575-BBGA
Supplier Device Package: 575-BGA (31x31)

패키지: 575-BBGA

재고4,496

XC2V2000-4FFG896C

Xilinx Inc.

IC FPGA 624 I/O 896FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: -
Total RAM Bits: 1032192
Number of I/O: 624
Number of Gates: 2000000
Voltage - Supply: 1.425 V ~ 1.575 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 896-BBGA, FCBGA
Supplier Device Package: 896-FCBGA (31x31)

패키지: 896-BBGA, FCBGA

재고5,008

XCS20XL-4VQG100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 77
Number of Gates: 20000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

패키지: 100-TQFP

재고13,332

XCV100E-7PQ240I

Xilinx Inc.

IC FPGA 158 I/O 240QFP

Number of LABs/CLBs: 600
Number of Logic Elements/Cells: 2700
Total RAM Bits: 81920
Number of I/O: 158
Number of Gates: 128236
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP
Supplier Device Package: 240-PQFP (32x32)

패키지: 240-BFQFP

재고6,080

XCS30-3VQ100C

Xilinx Inc.

IC FPGA 77 I/O 100VQFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 77
Number of Gates: 30000
Voltage - Supply: 4.75 V ~ 5.25 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 100-TQFP
Supplier Device Package: 100-VQFP (14x14)

패키지: 100-TQFP

재고4,720

XC4085XL-09BG560C

Xilinx Inc.

IC FPGA 448 I/O 560MBGA

Number of LABs/CLBs: 3136
Number of Logic Elements/Cells: 7448
Total RAM Bits: 100352
Number of I/O: 448
Number of Gates: 85000
Voltage - Supply: 3 V ~ 3.6 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

패키지: 560-LBGA, Metal

재고3,264

XC4013E-4HQ240I

Xilinx Inc.

IC FPGA 192 I/O 240HQFP

Number of LABs/CLBs: 576
Number of Logic Elements/Cells: 1368
Total RAM Bits: 18432
Number of I/O: 192
Number of Gates: 13000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

패키지: 240-BFQFP Exposed Pad

재고5,856

XC4010E-2HQ208I

Xilinx Inc.

IC FPGA 160 I/O 208HQFP

Number of LABs/CLBs: 400
Number of Logic Elements/Cells: 950
Total RAM Bits: 12800
Number of I/O: 160
Number of Gates: 10000
Voltage - Supply: 4.5 V ~ 5.5 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 208-BFQFP Exposed Pad
Supplier Device Package: 208-PQFP (28x28)

패키지: 208-BFQFP Exposed Pad

재고2,160

XC6VHX565T-2FF1923C

Xilinx Inc.

IC FPGA 720 I/O 1923FCBGA

Number of LABs/CLBs: 44280
Number of Logic Elements/Cells: 566784
Total RAM Bits: 33619968
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 1924-BBGA, FCBGA
Supplier Device Package: 1924-FCBGA (45x45)

패키지: 1924-BBGA, FCBGA

재고7,344

XC6VLX365T-1FFG1759I

Xilinx Inc.

IC FPGA 720 I/O 1759FCBGA

Number of LABs/CLBs: 28440
Number of Logic Elements/Cells: 364032
Total RAM Bits: 15335424
Number of I/O: 720
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1760-BBGA, FCBGA
Supplier Device Package: 1759-FCBGA (42.5x42.5)

패키지: 1760-BBGA, FCBGA

재고18,624

XCKU060-L1FFVA1156I

Xilinx Inc.

IC FPGA 520 I/O 1156FCBGA

Number of LABs/CLBs: 41460
Number of Logic Elements/Cells: 725550
Total RAM Bits: 38912000
Number of I/O: 520
Number of Gates: -
Voltage - Supply: 0.880 V ~ 0.920 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

패키지: 1156-BBGA, FCBGA

재고2,192

XC4VFX100-10FF1517I

Xilinx Inc.

IC FPGA 768 I/O 1517FCBGA

Number of LABs/CLBs: 10544
Number of Logic Elements/Cells: 94896
Total RAM Bits: 6930432
Number of I/O: 768
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)

패키지: 1517-BBGA, FCBGA

재고3,936

XC6VLX130T-L1FF484I

Xilinx Inc.

IC FPGA 240 I/O 484FCBGA

Number of LABs/CLBs: 10000
Number of Logic Elements/Cells: 128000
Total RAM Bits: 9732096
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 0.91 V ~ 0.97 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 484-BBGA, FCBGA
Supplier Device Package: 484-FCBGA (23x23)

패키지: 484-BBGA, FCBGA

재고5,376

XC4VLX25-10SFG363I

Xilinx Inc.

IC FPGA 240 I/O 363FCBGA

Number of LABs/CLBs: 2688
Number of Logic Elements/Cells: 24192
Total RAM Bits: 1327104
Number of I/O: 240
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 363-FBGA, FCBGA
Supplier Device Package: 363-FCBGA (17x17)

패키지: 363-FBGA, FCBGA

재고5,552

XC6SLX100-L1FGG676C

Xilinx Inc.

IC FPGA 480 I/O 676FBGA

Number of LABs/CLBs: 7911
Number of Logic Elements/Cells: 101261
Total RAM Bits: 4939776
Number of I/O: 480
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BGA
Supplier Device Package: 676-FBGA (27x27)

패키지: 676-BGA

재고5,584

XA3S1200E-4FGG400I

Xilinx Inc.

IC FPGA 304 I/O 400FBGA

Number of LABs/CLBs: 8672
Number of Logic Elements/Cells: 19512
Total RAM Bits: 516096
Number of I/O: 304
Number of Gates: 1200000
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 400-BGA
Supplier Device Package: 400-FBGA (21x21)

패키지: 400-BGA

재고5,120

XA7A35T-2CSG325I

Xilinx Inc.

IC FPGA 150 I/O 325BGA

Number of LABs/CLBs: 2600
Number of Logic Elements/Cells: 33280
Total RAM Bits: 1843200
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 324-LFBGA, CSPBGA
Supplier Device Package: 325-CSBGA (15x15)

패키지: 324-LFBGA, CSPBGA

재고2,544

XC6SLX4-2TQG144C

Xilinx Inc.

IC FPGA 102 I/O 144TQFP

Number of LABs/CLBs: 300
Number of Logic Elements/Cells: 3840
Total RAM Bits: 221184
Number of I/O: 102
Number of Gates: -
Voltage - Supply: 1.14 V ~ 1.26 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 144-LQFP
Supplier Device Package: 144-TQFP (20x20)

패키지: 144-LQFP

재고60,348

XC95108-7PQ160C

Xilinx Inc.

IC CPLD 108MC 7.5NS 160QFP

Programmable Type: In System Programmable (min 10K program/erase cycles)
Delay Time tpd(1) Max: 7.5ns
Voltage Supply - Internal: 4.75 V ~ 5.25 V
Number of Logic Elements/Blocks: 6
Number of Macrocells: 108
Number of Gates: 2400
Number of I/O: 108
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 160-BQFP
Supplier Device Package: 160-PQFP (28x28)

패키지: 160-BQFP

재고13,152

XC2C384-7FGG324C

Xilinx Inc.

IC CPLD 384MC 7.1NS 324FBGA

Programmable Type: In System Programmable
Delay Time tpd(1) Max: 7.1ns
Voltage Supply - Internal: 1.7 V ~ 1.9 V
Number of Logic Elements/Blocks: 24
Number of Macrocells: 384
Number of Gates: 9000
Number of I/O: 240
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: Surface Mount
Package / Case: 324-BBGA
Supplier Device Package: 324-FBGA (23x23)

패키지: 324-BBGA

재고2,976

XA7A25T-2CPG238I

Xilinx Inc.

XA7A25T-2CPG238I

Number of LABs/CLBs: 1825
Number of Logic Elements/Cells: 23360
Total RAM Bits: 1658880
Number of I/O: 150
Number of Gates: -
Voltage - Supply: 0.95 V ~ 1.05 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 238-LFBGA, CSPBGA
Supplier Device Package: 236-CSBGA (10x10)

패키지: 238-LFBGA, CSPBGA

재고8,244

XCVU5P-1FLVC2104I

Xilinx Inc.

IC FPGA VIRTEX-UP 2104FCBGA

Number of LABs/CLBs: 75072
Number of Logic Elements/Cells: 1313763
Total RAM Bits: 190976000
Number of I/O: 416
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 2104-BBGA, FCBGA
Supplier Device Package: 2104-FCBGA (47.5x47.5)

패키지: 2104-BBGA, FCBGA

재고3,264

XCKU15P-2FFVA1156E

Xilinx Inc.

XCKU15P-2FFVA1156E

Number of LABs/CLBs: 65340
Number of Logic Elements/Cells: 1143450
Total RAM Bits: 82329600
Number of I/O: 516
Number of Gates: -
Voltage - Supply: 0.825 V ~ 0.876 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C (TJ)
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)

패키지: 1156-BBGA, FCBGA

재고5,936