페이지 185 - 최신 기술 | Heisener Electronics
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최신 기술

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Technology Cover

2018-04-02, APEC: 1MHz active clamp flyback chipset and 6-A three-level buck battery buck.

Operating at up to 1 MHz, TI has a new chipset that combines.

Technology Cover

2018-04-02, Cypress adds Arm secure firmware to PSoC6

Plath semiconductor realizes the security system of ARM platform (PSA), trusts firmware-m and refers to Cypress's PSoC 6 microcontroller.

Technology Cover

2018-04-02, APEC: Synchronous Rectifier Saves Secondary Power

Diodes has announced ZXGD3113, a synchronous rectifier controller intended to work with a mosfet to replace the voltage drop associated with a Schottky diode on the secondary side of an isolated power converter such as ac-dc power supplies – potentially removing the need for secondary-side heatsinking.

Technology Cover

2018-04-02, APEC: Microsemi's sample 1.2KV SiC MOSFET.

Microsemi is sampling the first of its next-generation 1.2kV silicon carbide mosfets, the 40m[Ohm] MSC040SMA120B, plus 1.2kV SiC Schottky barrier diodes to go with it.

Technology Cover

2018-04-02, Pico's data recording software is completely redesigned.

UK test equipment maker Pico Technology revealed a ground-up redesign of its data logging software at Embedded World.

Technology Cover

2018-04-02, Harting designs low profile 250A connector for railways

Offering a high-current connector for tight spaces on rail vehicles, Harting has added a low profile high-current connector for up to four 250A contacts to its Han HPR connector series.

Technology Cover

2018-04-02, Knowles provides EMI filters for space and medical treatment

Syfer-branded EMI filters from Knowles Precision Devices are being targeted at medical implantable devices and the space sector.

Technology Cover

2018-04-02, ADI creates internal silicon PCB for system-in-package ADCs

The passives are in the silicon, not in poly, real silicon. They are matched to 0.1%, with temperature drift in the same direction, and have 1% absolute accuracy over temperature: -40 to +125 or -40 to +105°C.

Technology Cover

2018-04-02, BOSCH aims 6 axis inertial chips as VR and AR headphones

Bosch has launched a 6 axis MEMS inertial measurement unit with a 3 axis 16bit accelerometer and 3 axis, 16bit gyroscope in a single package.

Technology Cover

2018-04-02, New version of PVRTune from Imagination

Imagination has brought out a a new version of PVRTune, the PowerVR GPU performance analysis tool.

Technology Cover

2018-04-02, The Maxim uSLIC module provides a switching regulator with a LDO shape

Micro system-level IC (“uSLIC”) modules from Maxim claim to deliver switching regulators with the size and simplicity of a linear regulator (LDO).

Technology Cover

2018-04-02, 500W 12 to 24V converter is suitable for bad environment

Gresham power electronics has introduced 500W DC to DC converter for military and non tactical vehicle communication and security systems.

Technology Cover

2018-04-02, Samsung will rise 10nm Exynos AP at H2

Samsung says it will begin volume production of a 10nm Exynos AP in H2.

Technology Cover

2018-04-02, Toshiba launched a PI -MOS IX 600V plane MOSFET

Toshiba has launched a new series of 600V planar MOSFETs known as “π-MOS IX”.

Technology Cover

2018-01-30, Eliminate the need for pin inserting and stitching equipment in automotive manufacturing

Eliminate the need for pin inserting and stitching equipment in automotive manufacturing

Technology Cover

2018-01-30, Gas sensor evaluation kit designed to be simple and cost-efficient (Sensirion SEK-SGP30)

Gas sensor evaluation kit designed to be simple and cost-efficient (Sensirion SEK-SGP30)

Technology Cover

2018-01-30, HVC module provides very fast recognition speed (Omron HVC-P2)

HVC module provides very fast recognition speed (Omron HVC-P2)