China has developed the first "3D packaging" chip, which means the birth of China's first 7nm chip! The so-called "3D packaged" chip previously referred to TSMC's production technology. According to relevant data, the "3D packaged" chip broke through the 7nm process limit and integrated 60 billion transistors.
Compared with the previous packaging technology, the 3D packaging technology adopted by TSMC can stack more chip technologies in a fixed package, so that it will greatly improve the efficiency when processing information data. In the field of high-end chip technology, the development is already at its limit. TSMC has taken a different approach and adopted a unique packaging technology to improve the chip process, which also provides new ideas for the future development of the chip.
What is even more incredible is that the number of transistors in a chip with only 7nm exceeds 60 billion. This process is unheard of in the world's top chip manufacturing industry. The changes TSMC has made in this regard have far surpassed the processes of other chip manufacturing companies in the world. When the electronics industry is pursuing fast and efficient chips, 7nm chips using 3D packaging technology have undoubtedly become the focus of many technology companies. New selection.
After a British artificial intelligence computer company adopted "3D packaging" chips, its computing speed increased and the capacity of processing data also increased.
After the measurement and inspection of the "3D package" chip by many parties, its computing performance can stand the test. In the electronic product development industry, "3D packaging" chips will gradually become the new direction of choice for major companies in the future. At the same time, the technology of "3D packaging" chips has also opened up a new way for improving the development of chips towards a higher-end direction.
