TT Electronics introduces HPDC series of high power density chip resistors. This high power density device saves PCB area and improves reliability by limiting the temperature rise of the device hot spot. The professional design optimizes power management, actuator drive and heating applications, benefiting from enhanced heat transfer from component to terminal.
Brian Stephenson, director of engineering said:"Aluminum nitride -- with large area welding terminals -- provides the TT's HPDC family with the highest power density to date. With this product, our customers can reduce the size of their power conversion designs while improving component reliability by limiting component hot spot temperatures, " TT Electronics. "These characteristics make the HPDC series ideal for applications with high transient load conditions, such as power supplies, motor drivers, power amplifiers, and actuator controls."
The new chip resistor uses aluminum nitride ceramic substrate, which has about six times the thermal conductivity of traditional chip resistor substrate material alumina. These chip resistors also provide large area terminals to enhance thermal contact with the PCB. As a result, the heat generated in the resistive element is effectively transmitted away, thus reducing the temperature rise. This enables these resistors to provide high power density solutions with power ratings of 2.4W and 3.5W in the 1206 and 2512 packages, respectively.
Short-term overload performance is also improved by 4.7W in the 1206 and 7.7W in the 2512 for 5 seconds, making it ideal for active capacitor discharge circuits. In addition, these high-power resistors can be used for temperatures-controlled heating applications, where the power applied is limited only by a maximum element temperature of 155C and a maximum connection temperature of 110C.
