New Bluetooth low energy IC for automotive applications | Heisener Electronics
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New Bluetooth low energy IC for automotive applications

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포스트 날짜: 2017-12-28, Toshiba Semiconductor and Storage
Toshiba Europe Electronics has new integrated circuits that comply with the Bluetooth Low Energy Core 4.2 specification, including support for secure connections, LE privacy features, and extended packet length support. It is ready for use in a wide temperature range and challenging automotive environments. The mixed-signal TC35679IFTG includes an analog RF and analog baseband section, providing a small and compact overall solution in a 6mm x 6mm x 1 mm QFN 40-pin "wettable" package with a pitch of 0.5 mm. Toshiba Europe Electronics has new integrated circuits that comply with the Bluetooth Low Energy Core 4.2 specification, which includes support for secure connections, LE privacy features, and extended packet length support. It is suitable for a wide temperature range and harsh automotive environments. The mixed-signal TC35679IFTG includes an analog RF and analog baseband section, providing a total solution in a 6-pin x 6 mm x 1 mm 40-pin QFN package with a pitch of 0.5 mm. A key feature of the TC35679 is the ability to be part of a complex system with 17 GPIO lines and numerous communication options, including SPI, I2C, and 921.6 kbps. The UART dual-channel GPIO family provides a range of on-chip functions, including a boot interface, a quad PWM interface, a six-channel AD converter and a control interface, this interface controls any external power amplifier to meet the needs of longer applications. The on-chip DC-DC converter or LDO circuit changes the voltage to the desired value on the chip. Current applications cover keyless entry systems, reducing wiring by providing a reliable wireless connection to the sensor. The device also allows remote connection of diagnostic devices and the creation of "soft" Bluetooth OBD ports, reducing the weight and cost of related OBD cables and connectors.

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