Nexperia, a specialist in high-throughput production of basic semiconductor devices, announces a new series of 20 V and 30 V MOSFETs DFN0603 in an ultra-small DFN package. Nexperia has previously offered ESD protection devices in this package, and now Nexperia has gone a step further by successfully applying this packaging technology to its MOSFET product portfolio, becoming a leader in the industry's competition. This family of small MOSFETs includes:
The new generation of wearables and hearables is incorporating new artificial intelligence (AI) and machine learning (ML) technologies, which pose several challenges for product design. First, as functionality increases, available board space becomes at a premium, and as power consumption increases, heat dissipation becomes an issue that cannot be ignored.
Nexperia, the industry leader in discrete device production, has successfully overcome these two problems by designing this innovative ultra-small size MOSFET series with decades of experience. The ultra-thin DFN0603 package, measuring only 0.63 x 0.33 x 0.25 mm, uses 13% less space than the MOSFET in the second smallest package (DFN0604). Amazingly, this size reduction has no impact on device performance, in fact, the RDS(on) of these MOSFETs is reduced by 74%, which helps improve efficiency, thus enabling wearable device designers to achieve more great power density.
This new family of small MOSFETs includes:
● PMX100UN 20 V, N-Channel Trench MOSFET
● PMX100UNE 20 V, N-Channel Trench MOSFET with 2kV ESD Protection (HBM)
● PMX300UNE 30 V, N-Channel Trench MOSFET
● PMX400UP 20 V, P-channel Trench MOSFET
Nexperia plans to add two more MOSFETs to the family in the second half of 2022.
