STMicroelectronics 5G M2M embedded SIM card chip passed the latest GSMA eSA (safety assurance) certification | Heisener Electronics
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STMicroelectronics 5G M2M embedded SIM card chip passed the latest GSMA eSA (safety assurance) certification

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포스트 날짜: 2022-06-30, STMicroelectronics

   STMicroelectronics announced the ST4SIM-201 Machine-to-Machine Communication (M2M) embedded SIM (eSIM) chip, which complies with the latest 5G network access and M2M security specifications, as well as flexible remote activation management standards.

     ST4SIM-201 is compliant with ETSI/3GPP Standard Release 16 and can connect to 5G Standalone (SA), as well as 3G and 4G networks, as well as Low Power Wide Area (LPWA) network technologies such as Long Term Evolution (LTE) -M) Network and Narrowband Internet of Things (NB-IoT).

     ST4SIM-201 is certified to the latest GSMA eUICC M2M specification, SGP.02 Version 4.2, which supports remote SIM card issuance to simplify card activation and maintenance. The new product is the first SIM card chip to implement GSMA eUICC Security Assurance (eSA) using the SGP.05 eUICC Protection Profile specification version 1.1. With this SIM chip, users can change operators remotely without connecting the chip, which simplifies logistics distribution, improves application flexibility, and helps reduce the user's cost of ownership over the life of the card. In addition, users can use the test profile and emergency profile specified in the SGP.02 specification version 4.2.

      The ST4SIM-201 is an industrial grade product ideal for IoT applications and any device requiring cellular connectivity, including smart IoT devices such as smart meters, asset trackers, health monitors, police equipment, telemetry, security systems, and more.

   Compliance with the ETSI specification ensures that the chip supports energy-efficiency enhancements for M2M applications, including Power Save Mode (PSM) and Extended Discontinuous Reception (eDRX) modes to take advantage of idle modes. ST4SIM-201 also supports ETSI-specified suspend/resume commands to improve power management energy efficiency.

     ST4SIM-201 is available in a variety of package sizes to meet different customer requirements, including 5mm x 6mm DFN8 dual flat no-lead package and wafer level chip level package (WLCSP), as well as standard 2FF, 3FF and 4FF add-in cards.

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