TDK has developed a new TFM-BLE series of thin-film power supply circuit inductors. TDK has incorporated thin-film technology developed in the head business into the manufacturing of this series of inductors. Using TDK's characteristic conductor formation technology, magnetic metal materials with high saturation flux density are used as the core material to meet the DC bias characteristics required by inductors in power circuits and optimized for space-constrained applications such as smartphone power circuits. The introduction of thin film inductor is helpful to increase the inductance and reduce the device size, which opens up an effective way for the miniaturization of inductor and the realization of efficient power supply circuit.
The board area and terminal structure of TFM-BLE are consistent with those of universal patch elements, which are stable and can be installed in the universal pad layout. This series currently provides three inductors, with an inductance range of 0.24 µ H to 0.47 µ H, a tolerance of ± 20%, an operating temperature of − 40 ° C to+125 ° C, and an overall dimension of 2.0mm × 1.20mm × 0.8mm, suitable for compact application environment.
From the appearance, the new TDK inductor series is obviously superior to the previous generation product TFM201208BLD (2.0mm × 1.25mm × 0.8mm）。 Compared with the traditional product (0.33 µ H), the rated current of TFM-BLE increases by 10% to 5.5A, and the DC resistance decreases by 22% to 25m Ω. For inductors of this size, these parameters are excellent in the industry.
