Infineon technologies meets different design requirements and delivers maximum performance in the smallest space by providing power system designers with more choices. For applications including electric scooters, electric forklifts and other electric vehicles, as well as power tools and battery management systems, high current ratings, ruggediness and extended life are required. Through an innovative To-lead (TOLL) package, it now offers two new Optimmos power MOSFET packages in the TOLx family :TOLG(To-lead with gull-wing leads) and TOLT (To-lead top cooling). In summary, the TOLx series offers very low RDS(on) and high current ratings in excess of 300A to improve system efficiency in high power density designs.
TOLG packages mix the best features of TOLL and D2PAK 7-PIN packages, sharing the same 10mm x 11mm2 footprint and electrical performance for increased flexibility compared to d2PAK 7-PIN. In the design of aluminum insulating metal substrate, TOLG's main advantages are particularly obvious. In these designs, the coefficient of thermal expansion, which represents the tendency of the material to change with temperature, is higher than for copper-IMS and FR4 plates.
Over time, the temperature cycle on the board can create cracks in the solder joints between the package and the PCB. Due to the versatility of gull wing leads, TOLG demonstrates superior solder joint robustness, significantly improving product reliability in repeated temperature cycle applications. The new package offers twice the TCoB performance required by the IPC-9701 standard.
TOLT packages are optimized for superior thermal performance. The lead frame of the package flips to place exposed metal on top, and each side contains multiple Gull-wing leads for high-current-bearing drain and source connections. For overturned lead frames, heat is transferred directly from its exposed metal top through the insulation to the radiator. TOLT improves R thJA by 20% and R thJC by 50% compared to TOLL bottom cooling packages. These specifications help reduce the BOM, especially for radiators. In addition, OptiMOS in TOLT reduces PCB space because components can now be mounted at the bottom of the MOSFET.
