The Teledyne e2v's quad-core aerospace processor provides a huge boost for on-board imaging and artificial intelligence | Heisener Electronics
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The Teledyne e2v's quad-core aerospace processor provides a huge boost for on-board imaging and artificial intelligence

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포스트 날짜: 2022-10-19, Teledyne LeCroy

     Teledyne e2v announced the delivery of its advanced astronautically certified quad-core Cortex-A72 edge processing platform flight Positive (FM), LS1046-Space. For computationally intensive space applications, including high-throughput satellites, data compression, and artificial intelligence and imaging, the processor performs up to 30 times better than existing schemes. This product is an important addition to Teledyne e2v's portfolio, supporting a wide range of new aerospace applications.

     The LS1046 Space processor combines minimal power consumption with extreme data processing to extend edge computing performance with minimal profile size. It is particularly suitable for power constrained cubesat and microsatellite platforms that require advanced data path design and access to multiple integrated peripherals.

     Thomas Guillemain, Digital Product Marketing and Business Development Manager, said:"With LS1046-Space, our customers can achieve the highest performance astronaut-grade edge computing platform available today. With its advanced processing power, powerful features, and ease of use and implementation in space systems, it will be an important driver of artificial intelligence and machine learning (AI and ML). It is particularly suitable for future low Earth orbit (LEO) missions."

     The Teledyne e2v's 64-bit LS1046-Space processor has a clock frequency of up to 1.8 GHz and can achieve 30,000 DMIP. In addition, it offers a fast 2.1 GT/s 64-bit DDR4 SDRAM memory controller with embedded 8-bit error correcting code (ECC), and a 2MB L2 cache shared by the four ARM cores. Both L1 and L2 caches support ECC protection to achieve a high degree of dynamic data corruption-proof capability.

     This highly reliable processor has rich embedded interfaces including 10 Gbit Ethernet, three PCI Express (PCIe) v.3.0 channels, SPI, I2C, and multiple UART to further enhance its performance. The device comes in a compact 23 x 23 mm 780 ball grid BGA package.