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산업 동향

Microchip Launches New Turnkey Capacitive Touch Controller MTCH2120

에 게시 12월 20, 2024
The MTCH2120 touch controller is designed for seamless integration with a comprehensive tool ecosystem, simplifying development processes and accelerating time-to-market. This turnkey solution offers a straightforward way to upgrade mechanical buttons to modern touch buttons or displays.

Japan's First EUV Lithography Machine Begins Installation

에 게시 12월 19, 2024
Rapidus has achieved a significant milestone, becoming the first Japanese semiconductor company to receive Extreme Ultraviolet (EUV) lithography equipment, marking a crucial step toward producing Japan's most advanced semiconductor chips.

CCPAK1212 Packaging to Further Enhance Nexperia's Power MOSFET Performance

에 게시 12월 16, 2024
Nexperia has launched 16 new 80V and 100V power MOSFETs with an innovative copper clip CCPA12 packaging design, offering industry-leading power density, high current handling, low parasitic inductance, and excellent thermal performance. These devices are ideal for motor control, power supplies, renewable energy systems, and other high-power applications. The series also includes application-specific

Google Unveils Its Most Powerful Quantum Chip, Willow

에 게시 12월 10, 2024
On December 10, Google made a groundbreaking announcement, unveiling its latest quantum chip, Willow, which features 105 physical qubits and delivers state-of-the-art performance across multiple metrics. Willow also marks two significant achievements in the field of quantum computing:

AMD Disables Loop Buffer Function in Zen 4 Processors

에 게시 12월 3, 2024
On December 3rd, reports have surfaced indicating that AMD has quietly disabled the loop buffer functionality in its Zen 4 architecture processors following a recent BIOS update. The specific reasons behind this decision remain undisclosed.

Melexis Launches Coreless Current Sensor MLX91235 for High-Current Measurement

에 게시 11월 23, 2024
Melexis, a global microelectronics leader, has introduced the MLX91235, a coreless current sensor chip designed to accurately measure high currents flowing through PCB traces and busbars. Targeted at automotive and alternative mobility applications, the sensor supports use cases such as inverters, battery management systems (BMS), and low-voltage DC-DC converters.

Nexperia Launches New 120 V/4 A Half-Bridge Gate Drivers

에 게시 11월 21, 2024
Nexperia has introduced a series of high-performance gate driver ICs for driving high-side and low-side N-channel MOSFETs in synchronous buck or half-bridge configurations. These ICs, available in automotive-grade and industrial-grade versions, deliver high current output and dynamic performance to enhance efficiency and robustness.

ST Launches ST AIoT Craft: Web Tool for AIoT Development

에 게시 11월 19, 2024
STMicroelectronics has launched ST AIoT Craft, a web-based tool designed to simplify the development of AIoT (Artificial Intelligence of Things) projects and related network configurations. The tool focuses on leveraging the Machine Learning Core (MLC) of ST’s intelligent MEMS sensors, enabling efficient node-to-cloud solutions.

New Nanometer-Scale 3D Transistor Unveiled

에 게시 11월 7, 2024
A team from the Massachusetts Institute of Technology (MIT) has successfully developed a novel nanometer-scale 3D transistor using ultra-thin semiconductor materials. This transistor is the smallest 3D transistor known to date, with performance and functionality that can match or even exceed current silicon-based transistors. It is expected to open new pathways for the development of high-performance, energy-efficient electronic products. The related paper was published in the Nature Electronics journal on the 5th.

Breakthrough in Multi-Band Electromagnetic Wave Absorbing Ultra-Thin Film

에 게시 11월 7, 2024
Scientists at the Korea Institute of Materials Science have developed an ultra-thin composite film capable of absorbing over 99% of electromagnetic waves across various frequencies, including 5G, 6G, WiFi, and radar for autonomous vehicles, which could significantly enhance the reliability of wireless communication. The findings were published in Advanced Functional Materials.