페이지 28 - 내장형 - 마이크로 컨트롤러, 마이크로 프로세서, FPGA 모듈 | 집적 회로(IC)

부품 번호	제조업체	설명	패키지	재고	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
DLP-HS-FPGA	DLP Design Inc.	MODULE USB-TO-FPGA SPARTAN3 Module/Board Type: FPGA, USB Core Core Processor: Spartan-3A, XC3S200A Co-Processor: FT2232H Speed: 66MHz Flash Size: - RAM Size: 32MB Connector Type: USB - B, Pin Header Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고7,088	Spartan-3A, XC3S200A	FT2232H	66MHz	-	32MB	USB - B, Pin Header	3" x 1.2" (76.2mm x 30.5mm)	0°C ~ 70°C
M5474GFE	NXP	MODULE M5474 FIRE ENGINE Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고3,952	-	-	-	-	-	-	-	-
CENGLH79524-10-450HC	Logic	CARD ENGINE 64MB FLASH 32MB RAM Module/Board Type: MPU Core Core Processor: ARM720T, LH79524 Co-Processor: - Speed: 77.4MHz Flash Size: 16MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고2,528	ARM720T, LH79524	-	77.4MHz	16MB	32MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	0°C ~ 70°C
CENGLH7A400-10-402HI	Logic	CARD ENGINE 32MB SDRAM Module/Board Type: MPU Core Core Processor: ARM922T, LH7A400 Co-Processor: - Speed: 200MHz Flash Size: 16MB RAM Size: 64MB Connector Type: SO-DIMM-144 Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고7,632	ARM922T, LH7A400	-	200MHz	16MB	64MB	SO-DIMM-144	2.37" x 2.67" (60.2mm x 67.8mm)	-40°C ~ 85°C
101-0672	Digi International	MODULE RABBITCORE RCM3600 Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: IDC Header 2x20 Size / Dimension: 1.23" x 2.11" (31mm x 54mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고6,912	Rabbit 3000	-	22.1MHz	512KB	512KB	IDC Header 2x20	1.23" x 2.11" (31mm x 54mm)	-40°C ~ 85°C
101-0436	Digi International	MODULE RABBITCORE RCM2120 Module/Board Type: MPU Core Core Processor: Rabbit 2000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB RAM Size: 512KB Connector Type: 2 IDC Headers 2x20 Size / Dimension: 2" x 3.5" (51mm x 89mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,992	Rabbit 2000	-	22.1MHz	512KB	512KB	2 IDC Headers 2x20	2" x 3.5" (51mm x 89mm)	-40°C ~ 85°C
CC-MX-LD69-ZM-B	Digi International	MODULE I.MX53 512MB FLASH 25PK Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고7,952	-	-	-	-	-	-	-	-
TE0712-02-100-2C	Trenz Electronic GmbH	SOM ARTIX-7 XC7A100T-2C 1GB DDR3 Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고7,472	Artix-7 A100T	-	200MHz	32MB	1GB	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	0°C ~ 70°C
TE0711-01-100-2I	Trenz Electronic GmbH	SOM ARTIX-7 HIGH IO 100T USB 2I Module/Board Type: FPGA Core Processor: Artix-7 A100T Co-Processor: - Speed: 100MHz Flash Size: 32MB RAM Size: - Connector Type: Samtec LSHM Size / Dimension: 1.97" x 1.57" (50mm x 40mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고6,640	Artix-7 A100T	-	100MHz	32MB	-	Samtec LSHM	1.97" x 1.57" (50mm x 40mm)	-40°C ~ 85°C
DC-ME-Y402-TSB-1	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,712	-	-	-	-	-	-	-	-
DC-ME-01T-IZU	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,168	-	-	-	-	-	-	-	-
TE0820-05-4DI81MA	Trenz Electronic GmbH	MPSOC MODULE WITH XILINX ZYNQ UL Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-
TE0808-04-9BE21-AK	Trenz Electronic GmbH	IC MOD SOM MPSOC 4GB ZU9EG-E Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU9EG-1FFVC900E	-	-	128MB	2GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	0°C ~ 85°C
TE0820-04-2BI21FL	Trenz Electronic GmbH	MOD MPSOC 2GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU2EG-1SFVC784I	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0726-03-41C74-Q	Trenz Electronic GmbH	IC MODULE ZYNQBERRY Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7010) Speed: - Flash Size: 16MB RAM Size: 128MB Connector Type: CSI, DSI Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm) Operating Temperature: 0°C ~ 70°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7010)	-	16MB	128MB	CSI, DSI	1.180" L x 1.570" W (30.00mm x 40.00mm)	0°C ~ 70°C
6254-TX-X9E-RC	Critical Link LLC	SOM WITH TI SITARA AM6254, 1.4GH Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 1.4GHz Flash Size: 32GB eMMC RAM Size: 4GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: 0°C ~ 70°C	패키지: -	Request a Quote	ARM® Cortex®-A53	NEON SIMD	1.4GHz	32GB eMMC	4GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	0°C ~ 70°C
M100PF-1AC	ARIES Embedded	SoM PolarFire FPGA MPF100T Module/Board Type: FPGA Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm) Operating Temperature: 0°C ~ 70°C	패키지: -	Request a Quote	-	-	-	-	1GB	Board-to-Board (BTB) Socket	2.910" L x 1.650" W (74.00mm x 42.00mm)	0°C ~ 70°C
TE0745-02-81C31-A	Trenz Electronic GmbH	MOD SOM DDR3L 1GB Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7035) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Board-to-Board (BTB) Socket - 160 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7035)	-	64MB	1GB	Board-to-Board (BTB) Socket - 160	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0720-03-62I33ML	Trenz Electronic GmbH	IC SOC MODULE XILINX ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7020) Speed: - Flash Size: 8GB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7020)	-	8GB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0710-03-72I21-A	Trenz Electronic GmbH	MOD FPGA ARTIX7 100T 512MB 78BGA Module/Board Type: FPGA Core Processor: Artix™ 7 XC7A100T-2CSG324I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Artix™ 7 XC7A100T-2CSG324I	-	-	32MB	512MB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
EC-V-H264-8B-30-1080-MXC-LL	System-On-Chip (SOC) Technologies Inc.	IC MOD ARTIX-7 A200T 256KB 32MB Module/Board Type: FPGA Core Core Processor: Artix-7 A200T Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 256KB Connector Type: SO-DIMM-204 Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Artix-7 A200T	-	-	32MB	256KB	SO-DIMM-204	2.700" L x 2.000" W (68.00mm x 51.00mm)	0°C ~ 85°C
TE0715-04-71I33-L	Trenz Electronic GmbH	IC SOC MODULE 1GB DDR3L Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: 125MHz Flash Size: 32MB RAM Size: 1GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A9	Zynq-7000 (Z-7030)	125MHz	32MB	1GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
TE0745-02-71I11-AK	Trenz Electronic GmbH	IC MOD SOM DDR3L 1GB ZYNQ Module/Board Type: MCU, FPGA Core Processor: ARM® Cortex®-A9 Co-Processor: Zynq-7000 (Z-7030) Speed: - Flash Size: 64MB RAM Size: 1GB Connector Type: Samtec ST5 Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A9	Zynq-7000 (Z-7030)	-	64MB	1GB	Samtec ST5	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0820-05-2AE21MA	Trenz Electronic GmbH	MOD MPSOC ZU2CG-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Pin(s) Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E	-	128MB	2GB	Pin(s)	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0808-05-BBE81-A	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-
TE0813-02-3BE81-A	Trenz Electronic GmbH	MPSOC MODULE WITH AMD ZYNQ ULTRA Module/Board Type: MPU Core Core Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: Board-to-Board (BTB) Socket - 4 x 240 Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	4GB	Board-to-Board (BTB) Socket - 4 x 240	2.990" L x 2.050" W (76.00mm x 52.00mm)	0°C ~ 85°C
TE0807-03-7AI21-A	Trenz Electronic GmbH	MPSOC ZYNQ USCALE 4GB DDR4 Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU7CG-1FBVB900I Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 4GB Connector Type: B2B Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU7CG-1FBVB900I	-	-	128MB	4GB	B2B	2.050" L x 2.990" W (52.00mm x 76.00mm)	-40°C ~ 85°C
TE0808-05-9BE81-AK	Trenz Electronic GmbH	ULTRASOM+ MPSOC MODULE WITH ZYNQ Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	Request a Quote	-	-	-	-	-	-	-	-

DLP-HS-FPGA

DLP Design Inc.

MODULE USB-TO-FPGA SPARTAN3

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-3A, XC3S200A
Co-Processor: FT2232H
Speed: 66MHz
Flash Size: -
RAM Size: 32MB
Connector Type: USB - B, Pin Header
Size / Dimension: 3" x 1.2" (76.2mm x 30.5mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고7,088

Spartan-3A, XC3S200A

FT2232H

66MHz

-

32MB

USB - B, Pin Header

3" x 1.2" (76.2mm x 30.5mm)

0°C ~ 70°C

M5474GFE

NXP

MODULE M5474 FIRE ENGINE

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고3,952

-

CENGLH79524-10-450HC

Logic

CARD ENGINE 64MB FLASH 32MB RAM

Module/Board Type: MPU Core
Core Processor: ARM720T, LH79524
Co-Processor: -
Speed: 77.4MHz
Flash Size: 16MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고2,528

ARM720T, LH79524

-

77.4MHz

16MB

32MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

0°C ~ 70°C

CENGLH7A400-10-402HI

Logic

CARD ENGINE 32MB SDRAM

Module/Board Type: MPU Core
Core Processor: ARM922T, LH7A400
Co-Processor: -
Speed: 200MHz
Flash Size: 16MB
RAM Size: 64MB
Connector Type: SO-DIMM-144
Size / Dimension: 2.37" x 2.67" (60.2mm x 67.8mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고7,632

ARM922T, LH7A400

-

200MHz

16MB

64MB

SO-DIMM-144

2.37" x 2.67" (60.2mm x 67.8mm)

-40°C ~ 85°C

101-0672

Digi International

MODULE RABBITCORE RCM3600

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.23" x 2.11" (31mm x 54mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고6,912

Rabbit 3000

-

22.1MHz

512KB

IDC Header 2x20

1.23" x 2.11" (31mm x 54mm)

-40°C ~ 85°C

101-0436

Digi International

MODULE RABBITCORE RCM2120

Module/Board Type: MPU Core
Core Processor: Rabbit 2000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB
RAM Size: 512KB
Connector Type: 2 IDC Headers 2x20
Size / Dimension: 2" x 3.5" (51mm x 89mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,992

Rabbit 2000

-

22.1MHz

512KB

2 IDC Headers 2x20

2" x 3.5" (51mm x 89mm)

-40°C ~ 85°C

CC-MX-LD69-ZM-B

Digi International

MODULE I.MX53 512MB FLASH 25PK

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고7,952

-

TE0712-02-100-2C

Trenz Electronic GmbH

SOM ARTIX-7 XC7A100T-2C 1GB DDR3

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고7,472

Artix-7 A100T

-

200MHz

32MB

1GB

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

0°C ~ 70°C

TE0711-01-100-2I

Trenz Electronic GmbH

SOM ARTIX-7 HIGH IO 100T USB 2I

Module/Board Type: FPGA
Core Processor: Artix-7 A100T
Co-Processor: -
Speed: 100MHz
Flash Size: 32MB
RAM Size: -
Connector Type: Samtec LSHM
Size / Dimension: 1.97" x 1.57" (50mm x 40mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고6,640

Artix-7 A100T

-

100MHz

32MB

-

Samtec LSHM

1.97" x 1.57" (50mm x 40mm)

-40°C ~ 85°C

DC-ME-Y402-TSB-1

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,712

-

DC-ME-01T-IZU

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,168

-

TE0820-05-4DI81MA

Trenz Electronic GmbH

MPSOC MODULE WITH XILINX ZYNQ UL

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

Request a Quote

-

TE0808-04-9BE21-AK

Trenz Electronic GmbH

IC MOD SOM MPSOC 4GB ZU9EG-E

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU9EG-1FFVC900E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

Request a Quote

Zynq UltraScale+ XCZU9EG-1FFVC900E

-

128MB

2GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

0°C ~ 85°C

TE0820-04-2BI21FL

Trenz Electronic GmbH

MOD MPSOC 2GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU2EG-1SFVC784I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

Request a Quote

Zynq UltraScale+ XCZU2EG-1SFVC784I

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0726-03-41C74-Q

Trenz Electronic GmbH

IC MODULE ZYNQBERRY

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7010)
Speed: -
Flash Size: 16MB
RAM Size: 128MB
Connector Type: CSI, DSI
Size / Dimension: 1.180" L x 1.570" W (30.00mm x 40.00mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

Request a Quote

ARM Cortex-A9

Zynq-7000 (Z-7010)

-

16MB

128MB

CSI, DSI

1.180" L x 1.570" W (30.00mm x 40.00mm)

0°C ~ 70°C

6254-TX-X9E-RC

Critical Link LLC

SOM WITH TI SITARA AM6254, 1.4GH

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: NEON SIMD
Speed: 1.4GHz
Flash Size: 32GB eMMC
RAM Size: 4GB
Connector Type: SO-DIMM-260
Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

Request a Quote

ARM® Cortex®-A53

NEON SIMD

1.4GHz

32GB eMMC

4GB

SO-DIMM-260

2.740" L x 1.500" W (69.60mm x 38.10mm)

0°C ~ 70°C

M100PF-1AC

ARIES Embedded

SoM PolarFire FPGA MPF100T

Module/Board Type: FPGA
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket
Size / Dimension: 2.910" L x 1.650" W (74.00mm x 42.00mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

Request a Quote

-

1GB

Board-to-Board (BTB) Socket

2.910" L x 1.650" W (74.00mm x 42.00mm)

0°C ~ 70°C

TE0745-02-81C31-A

Trenz Electronic GmbH

MOD SOM DDR3L 1GB

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7035)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) Socket - 160
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7035)

-

64MB

1GB

Board-to-Board (BTB) Socket - 160

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0720-03-62I33ML

Trenz Electronic GmbH

IC SOC MODULE XILINX ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7020)
Speed: -
Flash Size: 8GB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7020)

-

8GB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0710-03-72I21-A

Trenz Electronic GmbH

MOD FPGA ARTIX7 100T 512MB 78BGA

Module/Board Type: FPGA
Core Processor: Artix™ 7 XC7A100T-2CSG324I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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Artix™ 7 XC7A100T-2CSG324I

-

32MB

512MB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

EC-V-H264-8B-30-1080-MXC-LL

System-On-Chip (SOC) Technologies Inc.

IC MOD ARTIX-7 A200T 256KB 32MB

Module/Board Type: FPGA Core
Core Processor: Artix-7 A200T
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 256KB
Connector Type: SO-DIMM-204
Size / Dimension: 2.700" L x 2.000" W (68.00mm x 51.00mm)
Operating Temperature: 0°C ~ 85°C

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Artix-7 A200T

-

32MB

256KB

SO-DIMM-204

2.700" L x 2.000" W (68.00mm x 51.00mm)

0°C ~ 85°C

TE0715-04-71I33-L

Trenz Electronic GmbH

IC SOC MODULE 1GB DDR3L

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: 125MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM Cortex-A9

Zynq-7000 (Z-7030)

125MHz

32MB

1GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

TE0745-02-71I11-AK

Trenz Electronic GmbH

IC MOD SOM DDR3L 1GB ZYNQ

Module/Board Type: MCU, FPGA
Core Processor: ARM® Cortex®-A9
Co-Processor: Zynq-7000 (Z-7030)
Speed: -
Flash Size: 64MB
RAM Size: 1GB
Connector Type: Samtec ST5
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

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ARM® Cortex®-A9

Zynq-7000 (Z-7030)

-

64MB

1GB

Samtec ST5

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0820-05-2AE21MA

Trenz Electronic GmbH

MOD MPSOC ZU2CG-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Pin(s)
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

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ARM® Cortex®-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E

-

128MB

2GB

Pin(s)

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0808-05-BBE81-A

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

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-

TE0813-02-3BE81-A

Trenz Electronic GmbH

MPSOC MODULE WITH AMD ZYNQ ULTRA

Module/Board Type: MPU Core
Core Processor: Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: Board-to-Board (BTB) Socket - 4 x 240
Size / Dimension: 2.990" L x 2.050" W (76.00mm x 52.00mm)
Operating Temperature: 0°C ~ 85°C

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Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

4GB

Board-to-Board (BTB) Socket - 4 x 240

2.990" L x 2.050" W (76.00mm x 52.00mm)

0°C ~ 85°C

TE0807-03-7AI21-A

Trenz Electronic GmbH

MPSOC ZYNQ USCALE 4GB DDR4

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU7CG-1FBVB900I
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 4GB
Connector Type: B2B
Size / Dimension: 2.050" L x 2.990" W (52.00mm x 76.00mm)
Operating Temperature: -40°C ~ 85°C

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Zynq UltraScale+ XCZU7CG-1FBVB900I

-

128MB

4GB

B2B

2.050" L x 2.990" W (52.00mm x 76.00mm)

-40°C ~ 85°C

TE0808-05-9BE81-AK

Trenz Electronic GmbH

ULTRASOM+ MPSOC MODULE WITH ZYNQ

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

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