페이지 30 - 내장형 - 마이크로 컨트롤러, 마이크로 프로세서, FPGA 모듈 | 집적 회로(IC)

부품 번호	제조업체	설명	패키지	재고	Core Processor	Co-Processor	Speed	Flash Size	RAM Size	Connector Type	Size / Dimension	Operating Temperature
SOMOMAP3503-12-1782GFIR	Logic	SOM OMAP3530 Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,568	-	-	-	-	-	-	-	-
CC-9C-V226-ZA	Digi International	MODULE 9C 32MB SDRAM 64MB FLASH Module/Board Type: MPU Core Core Processor: ARM926EJ-S, NS9360 Co-Processor: - Speed: 155MHz Flash Size: 64MB RAM Size: 32MB Connector Type: SO-DIMM-144 Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고7,008	ARM926EJ-S, NS9360	-	155MHz	64MB	32MB	SO-DIMM-144	3.59" x 2.06" (91.2mm x 52.2mm)	-40°C ~ 85°C
A13-SOM-512	Olimex LTD	SYSTEM ON CHIP MODULE, WITH A13 Module/Board Type: MCU Core Core Processor: Allwinner ARM? Cortex?-A8 Co-Processor: - Speed: 1GHz Flash Size: - RAM Size: 512MB Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,056	Allwinner ARM? Cortex?-A8	-	1GHz	-	512MB	-	-	-
L138-FX-236-RC	Critical Link LLC	MITYDSP-L138 W/ OMAP-L138 Module/Board Type: MPU, DSP, FPGA Core Core Processor: ARM926EJ-S, OMAP-L138 Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA) Speed: 456MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고3,136	ARM926EJ-S, OMAP-L138	TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)	456MHz	512MB (NAND), 8MB (NOR)	8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)	SO-DIMM-200	2.66" x 2" (67.6mm x 50.8mm)	0°C ~ 70°C
DC-SP-01-C-W	Digi International	ADAPTER SP CUSTOMIZABLE MODEL Module/Board Type: MPU Core Core Processor: ARM7TDMI, NS7520 Co-Processor: - Speed: 55MHz Flash Size: 4MB RAM Size: 16MB Connector Type: RJ45 Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고7,552	ARM7TDMI, NS7520	-	55MHz	4MB	16MB	RJ45	3.88" x 1.68" (98.5mm x 42.7mm)	-40°C ~ 85°C
6455-JE-3X5-RC	Critical Link LLC	MITYDSP-PRO SOM TMS320C6455 Module/Board Type: DSP, FPGA Core Core Processor: TMS320C6455 Co-Processor: Spartan-3, XC3S4000 Speed: 1.2GHz Flash Size: 16MB RAM Size: 2MB (Internal), 128MB (External), 64MB (FPGA) Connector Type: SO-DIMM-200 Size / Dimension: 2.66" x 3.25" (67.6mm x 82.6mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고3,360	TMS320C6455	Spartan-3, XC3S4000	1.2GHz	16MB	2MB (Internal), 128MB (External), 64MB (FPGA)	SO-DIMM-200	2.66" x 3.25" (67.6mm x 82.6mm)	0°C ~ 70°C
SOMDM3730-10-2782IFCR	Logic	SYSTEM ON MODULE LV DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 1GHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고7,904	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	1GHz	512MB (NAND), 8MB (NOR)	256MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	0°C ~ 70°C
3352-HX-X27-RI	Critical Link LLC	MITYSOM-3352 W/ AM3352 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: 256MB RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,032	ARM? Cortex?-A8, AM3352	NEON SIMD	800MHz	256MB	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
3352-HX-XX7-RI	Critical Link LLC	MITYSOM-3352 W/ AM3352 Module/Board Type: MPU Core Core Processor: ARM? Cortex?-A8, AM3352 Co-Processor: NEON SIMD Speed: 800MHz Flash Size: - RAM Size: 256MB Connector Type: SO-DIMM-204 Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고6,304	ARM? Cortex?-A8, AM3352	NEON SIMD	800MHz	-	256MB	SO-DIMM-204	2.66" x 1.5" (67.6mm x 38.1mm)	-40°C ~ 85°C
SOMDM3730-10-1782IFXR	Logic	SYSTEM ON MODULE LV DM3730 Module/Board Type: MPU, DSP Core Core Processor: ARM? Cortex?-A8, DM3730 Co-Processor: TMS320C64x (DSP) Speed: 800MHz Flash Size: 512MB (NAND), 8MB (NOR) RAM Size: 256MB Connector Type: Board-to-Board (BTB) Socket - 480 Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm) Operating Temperature: -20°C ~ 70°C	패키지: -	재고7,968	ARM? Cortex?-A8, DM3730	TMS320C64x (DSP)	800MHz	512MB (NAND), 8MB (NOR)	256MB	Board-to-Board (BTB) Socket - 480	1.23" x 3.01" (31.2mm x 76.5mm)	-20°C ~ 70°C
20-101-1094	Digi International	MCU RCM4000 RABBITCORE Module/Board Type: MPU Core Core Processor: Rabbit 4000 Co-Processor: - Speed: 58.98MHz Flash Size: 512KB (Internal), 32MB (External) RAM Size: 512KB Connector Type: IDC Header 2x25, 2x5 Size / Dimension: 1.84" x 2.42" (47mm x 61mm) Operating Temperature: 0°C ~ 70°C	패키지: -	재고4,896	Rabbit 4000	-	58.98MHz	512KB (Internal), 32MB (External)	512KB	IDC Header 2x25, 2x5	1.84" x 2.42" (47mm x 61mm)	0°C ~ 70°C
20-101-1329	Digi International	RCM3720 W/MOUNTING HOLES Module/Board Type: MPU Core Core Processor: Rabbit 3000 Co-Processor: - Speed: 22.1MHz Flash Size: 512KB (Internal), 1MB (External) RAM Size: 256KB Connector Type: IDC Header 2x20 Size / Dimension: 1.2" x 2.95" (30mm x 75mm) Operating Temperature: -40°C ~ 70°C	패키지: -	재고21,588	Rabbit 3000	-	22.1MHz	512KB (Internal), 1MB (External)	256KB	IDC Header 2x20	1.2" x 2.95" (30mm x 75mm)	-40°C ~ 70°C
DC-ME-01T-MFL	Digi International	MODULE DIGI CONNECT ME Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고5,136	-	-	-	-	-	-	-	-
XPP100400S-02R	Lantronix, Inc.	XPORT PRO ROHS EXTENDED RAM, EXT Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고4,000	-	-	-	-	-	-	-	-
SOMOMAPL138-10-1603QHIR	Logic	OMAPL138 SOM-M1 I-TEMP Module/Board Type: - Core Processor: - Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -	패키지: -	재고19,740	-	-	-	-	-	-	-	-
TE0803-02-03-1EA-S	Trenz Electronic GmbH	IC MODULE ZYNQ USCALE 2GB 128MB Module/Board Type: FPGA Core Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: B2B Size / Dimension: 2.05" x 2.99" (52mm x 76mm) Operating Temperature: 0°C ~ 85°C	패키지: -	재고6,368	Zynq UltraScale+ XCZU3EG-1SFVC784E	-	-	128MB	2GB	B2B	2.05" x 2.99" (52mm x 76mm)	0°C ~ 85°C
TE0630-02IV	Trenz Electronic GmbH	IC MODULE LX150 100MHZ 128MB Module/Board Type: FPGA, USB Core Core Processor: Spartan-6 LX-150 Co-Processor: Cypress EZ-USB FX2LP Speed: 100MHz Flash Size: 8MB RAM Size: 128MB Connector Type: B2B Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고4,384	Spartan-6 LX-150	Cypress EZ-USB FX2LP	100MHz	8MB	128MB	B2B	1.6" x 1.9" (40.5mm x 47.5mm)	-40°C ~ 85°C
TE0714-03-35-2I	Trenz Electronic GmbH	IC MODULE Module/Board Type: FPGA Core Core Processor: Artix-7 A35T Co-Processor: - Speed: - Flash Size: - RAM Size: - Connector Type: - Size / Dimension: - Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Artix-7 A35T	-	-	-	-	-	-	-40°C ~ 85°C
TE0820-04-4AE21FA	Trenz Electronic GmbH	MOD MPSOC ZU4CG-1E 2GB DDR4 IND Module/Board Type: MPU Core Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E Co-Processor: - Speed: - Flash Size: 128MB RAM Size: 2GB Connector Type: Samtec LSHM Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Zynq UltraScale+ XCZU4CG-1SFVC784E	-	-	128MB	2GB	Samtec LSHM	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
TE0823-01-3PIU1ML	Trenz Electronic GmbH	ICOBOARD Module/Board Type: MCU, FPGA Core Processor: ARM Cortex-A53, ARM® Cortex®-R5 Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I Speed: - Flash Size: 128MB RAM Size: 1GB Connector Type: USB Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-R5	Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I	-	128MB	1GB	USB	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
CC-ST-DX58-ZK	Digi	CC STM32MP133C ETHERNET SOM Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4 Co-Processor: - Speed: 209MHz, 650MHz Flash Size: 256MB RAM Size: 256MB Connector Type: Pin(s) Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고60	ARM® Cortex®-A7, ARM® Cortex®-M4	-	209MHz, 650MHz	256MB	256MB	Pin(s)	1.142" L x 1.142" W (29.00mm x 29.00mm)	-40°C ~ 85°C
MYS-ZU3EG-8E4D-EDGE-K2	MYIR Tech Limited	ZU3EG SBC, FZ3 Accelerator Card Module/Board Type: MPU, FPGA Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 600MHz, 1.2GHz Flash Size: - RAM Size: - Connector Type: - Size / Dimension: 3.937" x 2.756" (100.00mm x 70.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	600MHz, 1.2GHz	-	-	-	3.937" x 2.756" (100.00mm x 70.00mm)	-40°C ~ 85°C
FORLINX-FETA40I-C-121GSE8GIB12	Forlinx Embedded	Allwinner A40iSOM,1GB DDR3,8GB e Module/Board Type: MPU Core Processor: ARM® Cortex®-A7 Co-Processor: - Speed: 1.2GHz Flash Size: 8GB eMMC RAM Size: 1GB Connector Type: Board-to-Board (BTB) 4 x 80 Pin Size / Dimension: 2.700" L x 1.772" W (68.00mm x 45.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A7	-	1.2GHz	8GB eMMC	1GB	Board-to-Board (BTB) 4 x 80 Pin	2.700" L x 1.772" W (68.00mm x 45.00mm)	-40°C ~ 85°C
6252-TX-XXD-RI	Critical Link LLC	SOM WITH TI SITARA AM6252, 1.4GH Module/Board Type: MPU Core Core Processor: ARM® Cortex®-A53 Co-Processor: NEON SIMD Speed: 1GHz Flash Size: - RAM Size: 2GB Connector Type: SO-DIMM-260 Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm) Operating Temperature: -40°C ~ 85°C	패키지: -	재고75	ARM® Cortex®-A53	NEON SIMD	1GHz	-	2GB	SO-DIMM-260	2.740" L x 1.500" W (69.60mm x 38.10mm)	-40°C ~ 85°C
TE0713-02-82C46-A	Trenz Electronic GmbH	IC SOM ARTIX-7 FPGA DDR3 Module/Board Type: FPGA Core Core Processor: Artix-7 XC7A200T-2FBG484C Co-Processor: - Speed: 200MHz Flash Size: 32MB RAM Size: 1GB Connector Type: B2B Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	Artix-7 XC7A200T-2FBG484C	-	200MHz	32MB	1GB	B2B	1.970" L x 1.570" W (50.00mm x 40.00mm)	0°C ~ 85°C
FORLINX-FETMX8MM-C-182GSE8GCA10	Forlinx Embedded	NXP i.MX8M MiniSOM,2G DDR4,8GB e Module/Board Type: MPU Core Processor: ARM Cortex-A53, ARM® Cortex®-M4F Co-Processor: - Speed: 1.8GHz Flash Size: 8GB eMMC RAM Size: 2GB Connector Type: Board-to-Board (BTB) Socket - 240 Size / Dimension: 2.200" L x 1.417" W (56.00mm x 36.00mm) Operating Temperature: 0°C ~ 70°C	패키지: -	Request a Quote	ARM Cortex-A53, ARM® Cortex®-M4F	-	1.8GHz	8GB eMMC	2GB	Board-to-Board (BTB) Socket - 240	2.200" L x 1.417" W (56.00mm x 36.00mm)	0°C ~ 70°C
TE0710-02-42I21-A	Trenz Electronic GmbH	DUAL FAST ETHERNET FPGA MODULE W Module/Board Type: FPGA Core Processor: Artix™ 7 XC7A35T-2CSG324I Co-Processor: - Speed: - Flash Size: 32MB RAM Size: 512MB Connector Type: 2 x 100 Pin Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm) Operating Temperature: -40°C ~ 85°C	패키지: -	Request a Quote	Artix™ 7 XC7A35T-2CSG324I	-	-	32MB	512MB	2 x 100 Pin	1.970" L x 1.570" W (50.00mm x 40.00mm)	-40°C ~ 85°C
ME-XU8-7EV-1E-D11E-R2-1	Enclustra FPGA Solutions	SOM ZYNQ XU8 US+ ZU7EV Module/Board Type: MPU, FPGA Core Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5 Co-Processor: - Speed: 533MHz, 1.333GHz Flash Size: 16GB RAM Size: 4GB Connector Type: 168 Pin Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm) Operating Temperature: 0°C ~ 85°C	패키지: -	Request a Quote	ARM® Cortex®-A53, ARM® Cortex®-R5	-	533MHz, 1.333GHz	16GB	4GB	168 Pin	2.910" L x 2.130" W (74.00mm x 54.00mm)	0°C ~ 85°C

SOMOMAP3503-12-1782GFIR

Logic

SOM OMAP3530

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,568

-

CC-9C-V226-ZA

Digi International

MODULE 9C 32MB SDRAM 64MB FLASH

Module/Board Type: MPU Core
Core Processor: ARM926EJ-S, NS9360
Co-Processor: -
Speed: 155MHz
Flash Size: 64MB
RAM Size: 32MB
Connector Type: SO-DIMM-144
Size / Dimension: 3.59" x 2.06" (91.2mm x 52.2mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고7,008

ARM926EJ-S, NS9360

-

155MHz

64MB

32MB

SO-DIMM-144

3.59" x 2.06" (91.2mm x 52.2mm)

-40°C ~ 85°C

A13-SOM-512

Olimex LTD

SYSTEM ON CHIP MODULE, WITH A13

Module/Board Type: MCU Core
Core Processor: Allwinner ARM? Cortex?-A8
Co-Processor: -
Speed: 1GHz
Flash Size: -
RAM Size: 512MB
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,056

Allwinner ARM? Cortex?-A8

-

1GHz

-

512MB

-

L138-FX-236-RC

Critical Link LLC

MITYDSP-L138 W/ OMAP-L138

Module/Board Type: MPU, DSP, FPGA Core
Core Processor: ARM926EJ-S, OMAP-L138
Co-Processor: TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)
Speed: 456MHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 2" (67.6mm x 50.8mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고3,136

ARM926EJ-S, OMAP-L138

TMS320C674x (DSP), Spartan-6, XC6SLX45 (FPGA)

456MHz

512MB (NAND), 8MB (NOR)

8KB (Internal MPU), 256KB (Internal DSP), 256MB (External)

SO-DIMM-200

2.66" x 2" (67.6mm x 50.8mm)

0°C ~ 70°C

DC-SP-01-C-W

Digi International

ADAPTER SP CUSTOMIZABLE MODEL

Module/Board Type: MPU Core
Core Processor: ARM7TDMI, NS7520
Co-Processor: -
Speed: 55MHz
Flash Size: 4MB
RAM Size: 16MB
Connector Type: RJ45
Size / Dimension: 3.88" x 1.68" (98.5mm x 42.7mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고7,552

ARM7TDMI, NS7520

-

55MHz

4MB

16MB

RJ45

3.88" x 1.68" (98.5mm x 42.7mm)

-40°C ~ 85°C

6455-JE-3X5-RC

Critical Link LLC

MITYDSP-PRO SOM TMS320C6455

Module/Board Type: DSP, FPGA Core
Core Processor: TMS320C6455
Co-Processor: Spartan-3, XC3S4000
Speed: 1.2GHz
Flash Size: 16MB
RAM Size: 2MB (Internal), 128MB (External), 64MB (FPGA)
Connector Type: SO-DIMM-200
Size / Dimension: 2.66" x 3.25" (67.6mm x 82.6mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고3,360

TMS320C6455

Spartan-3, XC3S4000

1.2GHz

16MB

2MB (Internal), 128MB (External), 64MB (FPGA)

SO-DIMM-200

2.66" x 3.25" (67.6mm x 82.6mm)

0°C ~ 70°C

SOMDM3730-10-2782IFCR

Logic

SYSTEM ON MODULE LV DM3730

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 1GHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고7,904

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

1GHz

512MB (NAND), 8MB (NOR)

256MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

0°C ~ 70°C

3352-HX-X27-RI

Critical Link LLC

MITYSOM-3352 W/ AM3352

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3352
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,032

ARM? Cortex?-A8, AM3352

NEON SIMD

800MHz

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

-40°C ~ 85°C

3352-HX-XX7-RI

Critical Link LLC

MITYSOM-3352 W/ AM3352

Module/Board Type: MPU Core
Core Processor: ARM? Cortex?-A8, AM3352
Co-Processor: NEON SIMD
Speed: 800MHz
Flash Size: -
RAM Size: 256MB
Connector Type: SO-DIMM-204
Size / Dimension: 2.66" x 1.5" (67.6mm x 38.1mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고6,304

ARM? Cortex?-A8, AM3352

NEON SIMD

800MHz

-

256MB

SO-DIMM-204

2.66" x 1.5" (67.6mm x 38.1mm)

-40°C ~ 85°C

SOMDM3730-10-1782IFXR

Logic

SYSTEM ON MODULE LV DM3730

Module/Board Type: MPU, DSP Core
Core Processor: ARM? Cortex?-A8, DM3730
Co-Processor: TMS320C64x (DSP)
Speed: 800MHz
Flash Size: 512MB (NAND), 8MB (NOR)
RAM Size: 256MB
Connector Type: Board-to-Board (BTB) Socket - 480
Size / Dimension: 1.23" x 3.01" (31.2mm x 76.5mm)
Operating Temperature: -20°C ~ 70°C

패키지: -

재고7,968

ARM? Cortex?-A8, DM3730

TMS320C64x (DSP)

800MHz

512MB (NAND), 8MB (NOR)

256MB

Board-to-Board (BTB) Socket - 480

1.23" x 3.01" (31.2mm x 76.5mm)

-20°C ~ 70°C

20-101-1094

Digi International

MCU RCM4000 RABBITCORE

Module/Board Type: MPU Core
Core Processor: Rabbit 4000
Co-Processor: -
Speed: 58.98MHz
Flash Size: 512KB (Internal), 32MB (External)
RAM Size: 512KB
Connector Type: IDC Header 2x25, 2x5
Size / Dimension: 1.84" x 2.42" (47mm x 61mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

재고4,896

Rabbit 4000

-

58.98MHz

512KB (Internal), 32MB (External)

512KB

IDC Header 2x25, 2x5

1.84" x 2.42" (47mm x 61mm)

0°C ~ 70°C

20-101-1329

Digi International

RCM3720 W/MOUNTING HOLES

Module/Board Type: MPU Core
Core Processor: Rabbit 3000
Co-Processor: -
Speed: 22.1MHz
Flash Size: 512KB (Internal), 1MB (External)
RAM Size: 256KB
Connector Type: IDC Header 2x20
Size / Dimension: 1.2" x 2.95" (30mm x 75mm)
Operating Temperature: -40°C ~ 70°C

패키지: -

재고21,588

Rabbit 3000

-

22.1MHz

512KB (Internal), 1MB (External)

256KB

IDC Header 2x20

1.2" x 2.95" (30mm x 75mm)

-40°C ~ 70°C

DC-ME-01T-MFL

Digi International

MODULE DIGI CONNECT ME

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고5,136

-

XPP100400S-02R

Lantronix, Inc.

XPORT PRO ROHS EXTENDED RAM, EXT

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고4,000

-

SOMOMAPL138-10-1603QHIR

Logic

OMAPL138 SOM-M1 I-TEMP

Module/Board Type: -
Core Processor: -
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -

패키지: -

재고19,740

-

TE0803-02-03-1EA-S

Trenz Electronic GmbH

IC MODULE ZYNQ USCALE 2GB 128MB

Module/Board Type: FPGA Core
Core Processor: Zynq UltraScale+ XCZU3EG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: B2B
Size / Dimension: 2.05" x 2.99" (52mm x 76mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

재고6,368

Zynq UltraScale+ XCZU3EG-1SFVC784E

-

128MB

2GB

B2B

2.05" x 2.99" (52mm x 76mm)

0°C ~ 85°C

TE0630-02IV

Trenz Electronic GmbH

IC MODULE LX150 100MHZ 128MB

Module/Board Type: FPGA, USB Core
Core Processor: Spartan-6 LX-150
Co-Processor: Cypress EZ-USB FX2LP
Speed: 100MHz
Flash Size: 8MB
RAM Size: 128MB
Connector Type: B2B
Size / Dimension: 1.6" x 1.9" (40.5mm x 47.5mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고4,384

Spartan-6 LX-150

Cypress EZ-USB FX2LP

100MHz

8MB

128MB

B2B

1.6" x 1.9" (40.5mm x 47.5mm)

-40°C ~ 85°C

TE0714-03-35-2I

Trenz Electronic GmbH

IC MODULE

Module/Board Type: FPGA Core
Core Processor: Artix-7 A35T
Co-Processor: -
Speed: -
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: -
Operating Temperature: -40°C ~ 85°C

패키지: -

Request a Quote

Artix-7 A35T

-

-40°C ~ 85°C

TE0820-04-4AE21FA

Trenz Electronic GmbH

MOD MPSOC ZU4CG-1E 2GB DDR4 IND

Module/Board Type: MPU Core
Core Processor: Zynq UltraScale+ XCZU4CG-1SFVC784E
Co-Processor: -
Speed: -
Flash Size: 128MB
RAM Size: 2GB
Connector Type: Samtec LSHM
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

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Zynq UltraScale+ XCZU4CG-1SFVC784E

-

128MB

2GB

Samtec LSHM

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

TE0823-01-3PIU1ML

Trenz Electronic GmbH

ICOBOARD

Module/Board Type: MCU, FPGA
Core Processor: ARM Cortex-A53, ARM® Cortex®-R5
Co-Processor: Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I
Speed: -
Flash Size: 128MB
RAM Size: 1GB
Connector Type: USB
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

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ARM Cortex-A53, ARM® Cortex®-R5

Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I

-

128MB

1GB

USB

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

CC-ST-DX58-ZK

Digi

CC STM32MP133C ETHERNET SOM

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M4
Co-Processor: -
Speed: 209MHz, 650MHz
Flash Size: 256MB
RAM Size: 256MB
Connector Type: Pin(s)
Size / Dimension: 1.142" L x 1.142" W (29.00mm x 29.00mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고60

ARM® Cortex®-A7, ARM® Cortex®-M4

-

209MHz, 650MHz

256MB

Pin(s)

1.142" L x 1.142" W (29.00mm x 29.00mm)

-40°C ~ 85°C

MYS-ZU3EG-8E4D-EDGE-K2

MYIR Tech Limited

ZU3EG SBC, FZ3 Accelerator Card

Module/Board Type: MPU, FPGA
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 600MHz, 1.2GHz
Flash Size: -
RAM Size: -
Connector Type: -
Size / Dimension: 3.937" x 2.756" (100.00mm x 70.00mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

600MHz, 1.2GHz

-

3.937" x 2.756" (100.00mm x 70.00mm)

-40°C ~ 85°C

FORLINX-FETA40I-C-121GSE8GIB12

Forlinx Embedded

Allwinner A40iSOM,1GB DDR3,8GB e

Module/Board Type: MPU
Core Processor: ARM® Cortex®-A7
Co-Processor: -
Speed: 1.2GHz
Flash Size: 8GB eMMC
RAM Size: 1GB
Connector Type: Board-to-Board (BTB) 4 x 80 Pin
Size / Dimension: 2.700" L x 1.772" W (68.00mm x 45.00mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

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ARM® Cortex®-A7

-

1.2GHz

8GB eMMC

1GB

Board-to-Board (BTB) 4 x 80 Pin

2.700" L x 1.772" W (68.00mm x 45.00mm)

-40°C ~ 85°C

6252-TX-XXD-RI

Critical Link LLC

SOM WITH TI SITARA AM6252, 1.4GH

Module/Board Type: MPU Core
Core Processor: ARM® Cortex®-A53
Co-Processor: NEON SIMD
Speed: 1GHz
Flash Size: -
RAM Size: 2GB
Connector Type: SO-DIMM-260
Size / Dimension: 2.740" L x 1.500" W (69.60mm x 38.10mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

재고75

ARM® Cortex®-A53

NEON SIMD

1GHz

-

2GB

SO-DIMM-260

2.740" L x 1.500" W (69.60mm x 38.10mm)

-40°C ~ 85°C

TE0713-02-82C46-A

Trenz Electronic GmbH

IC SOM ARTIX-7 FPGA DDR3

Module/Board Type: FPGA Core
Core Processor: Artix-7 XC7A200T-2FBG484C
Co-Processor: -
Speed: 200MHz
Flash Size: 32MB
RAM Size: 1GB
Connector Type: B2B
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

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Artix-7 XC7A200T-2FBG484C

-

200MHz

32MB

1GB

B2B

1.970" L x 1.570" W (50.00mm x 40.00mm)

0°C ~ 85°C

FORLINX-FETMX8MM-C-182GSE8GCA10

Forlinx Embedded

NXP i.MX8M MiniSOM,2G DDR4,8GB e

Module/Board Type: MPU
Core Processor: ARM Cortex-A53, ARM® Cortex®-M4F
Co-Processor: -
Speed: 1.8GHz
Flash Size: 8GB eMMC
RAM Size: 2GB
Connector Type: Board-to-Board (BTB) Socket - 240
Size / Dimension: 2.200" L x 1.417" W (56.00mm x 36.00mm)
Operating Temperature: 0°C ~ 70°C

패키지: -

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ARM Cortex-A53, ARM® Cortex®-M4F

-

1.8GHz

8GB eMMC

2GB

Board-to-Board (BTB) Socket - 240

2.200" L x 1.417" W (56.00mm x 36.00mm)

0°C ~ 70°C

TE0710-02-42I21-A

Trenz Electronic GmbH

DUAL FAST ETHERNET FPGA MODULE W

Module/Board Type: FPGA
Core Processor: Artix™ 7 XC7A35T-2CSG324I
Co-Processor: -
Speed: -
Flash Size: 32MB
RAM Size: 512MB
Connector Type: 2 x 100 Pin
Size / Dimension: 1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature: -40°C ~ 85°C

패키지: -

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Artix™ 7 XC7A35T-2CSG324I

-

32MB

512MB

2 x 100 Pin

1.970" L x 1.570" W (50.00mm x 40.00mm)

-40°C ~ 85°C

ME-XU8-7EV-1E-D11E-R2-1

Enclustra FPGA Solutions

SOM ZYNQ XU8 US+ ZU7EV

Module/Board Type: MPU, FPGA Core
Core Processor: ARM® Cortex®-A53, ARM® Cortex®-R5
Co-Processor: -
Speed: 533MHz, 1.333GHz
Flash Size: 16GB
RAM Size: 4GB
Connector Type: 168 Pin
Size / Dimension: 2.910" L x 2.130" W (74.00mm x 54.00mm)
Operating Temperature: 0°C ~ 85°C

패키지: -

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ARM® Cortex®-A53, ARM® Cortex®-R5

-

533MHz, 1.333GHz

16GB

4GB

168 Pin

2.910" L x 2.130" W (74.00mm x 54.00mm)

0°C ~ 85°C