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부품 번호 |
제조업체 |
설명 |
패키지 |
재고 |
수량 |
Mounting Type | Connector/Contact Type | Number of Positions | Pitch | Termination | FFC, FCB Thickness | Height Above Board | Locking Feature | Cable End Type | Contact Material | Contact Finish | Housing Material | Actuator Material | Features | Voltage Rating | Operating Temperature | Material Flammability Rating |
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Molex, LLC |
CONN FFC VERT 29POS 0.50MM SMD
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패키지: - |
재고7,146 |
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Surface Mount | Contacts, Vertical, 1 Sided | 29 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 29POS 0.50MM SMD
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패키지: - |
재고8,478 |
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Surface Mount | Contacts, Vertical, 1 Sided | 29 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 24POS 0.50MM SMD
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패키지: - |
재고7,182 |
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Surface Mount | Contacts, Vertical, 1 Sided | 24 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 18POS 0.50MM R/A
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패키지: - |
재고2,412 |
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Surface Mount, Right Angle | Contacts, Bottom | 18 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 22POS 0.50MM R/A
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패키지: - |
재고7,668 |
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Surface Mount, Right Angle | Contacts, Bottom | 22 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -25°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 19POS 1.25MM PCB
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패키지: - |
재고4,572 |
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Through Hole | Contacts, Vertical, 1 Sided | 19 | 0.049" (1.25mm) | Solder | 0.30mm | 0.295" (7.50mm) | Slide Lock | Straight | Phosphor Bronze | Tin Bismuth | Polybutylene Terephthalate (PBT), Polyester | Polybutylene Terephthalate (PBT), Polyester | Zero Insertion Force (ZIF) | 200V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 28POS 0.50MM SMD
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패키지: - |
재고6,192 |
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Surface Mount | Contacts, Vertical, 1 Sided | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 28POS 0.50MM SMD
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패키지: - |
재고3,780 |
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Surface Mount | Contacts, Vertical, 1 Sided | 28 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 14POS 0.50MM R/A
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패키지: - |
재고4,680 |
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Surface Mount, Right Angle | Contacts, Top | 14 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 19POS 0.50MM R/A
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패키지: - |
재고3,186 |
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Surface Mount, Right Angle | Contacts, Bottom | 19 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 12POS 0.50MM R/A
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패키지: - |
재고2,502 |
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Surface Mount, Right Angle | Contacts, Bottom | 12 | 0.020" (0.50mm) | Solder | 0.30mm | 0.051" (1.30mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 27POS 0.50MM SMD
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패키지: - |
재고4,374 |
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Surface Mount | Contacts, Vertical, 1 Sided | 27 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 27POS 0.50MM SMD
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패키지: - |
재고5,256 |
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Surface Mount | Contacts, Vertical, 1 Sided | 27 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 13POS 0.5MM R/A
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패키지: - |
재고8,226 |
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Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.020" (0.50mm) | Solder | 0.30mm | 0.047" (1.20mm) | Slide Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Liquid Crystal Polymer (LCP), Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 24POS 1.00MM R/A
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패키지: - |
재고2,502 |
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Surface Mount, Right Angle | Contacts, Bottom | 24 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 26POS 0.50MM SMD
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패키지: - |
재고3,472 |
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Surface Mount | Contacts, Vertical, 1 Sided | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 26POS 0.50MM SMD
|
패키지: - |
재고4,860 |
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Surface Mount | Contacts, Vertical, 1 Sided | 26 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
05 FFCFPC ZIF EO2HSGASSY21CKTEMB
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패키지: - |
재고6,354 |
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Surface Mount, Right Angle | Contacts, Bottom | 21 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC/FPC 50POS .5MM SMD R/A
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패키지: - |
재고6,084 |
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Surface Mount, Right Angle | Contacts, Bottom | 50 | 0.020" (0.50mm) | Solder | 0.30mm | 0.075" (1.90mm) | Flip Lock | Tabbed, Tapered | Phosphor Bronze | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 125°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 37POS .3MM SMD R/A
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패키지: - |
재고6,282 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 37 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tapered | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC 37POS .3MM SMD R/A
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패키지: - |
재고3,600 |
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Surface Mount, Right Angle | Contacts, Top and Bottom | 37 | 0.012" (0.30mm) | Solder | 0.20mm | 0.030" (0.75mm) | Flip Lock, Backlock | Tabbed | Copper Alloy | Gold | Liquid Crystal Polymer (LCP), Glass Filled | Polyamide (PA), Nylon, Glass Filled | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 25POS 0.50MM SMD
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패키지: - |
재고8,280 |
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Surface Mount | Contacts, Vertical, 1 Sided | 25 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC VERT 25POS 0.50MM SMD
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패키지: - |
재고7,650 |
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Surface Mount | Contacts, Vertical, 1 Sided | 25 | 0.020" (0.50mm) | Solder | 0.30mm | 0.161" (4.10mm) | - | Tapered | Copper Alloy | Tin Bismuth | Polyamide (PA46), Nylon 4/6, Glass Filled | - | - | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC TOP 25POS 1.00MM R/A
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패키지: - |
재고4,266 |
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Surface Mount, Right Angle | Contacts, Top | 25 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Tin Bismuth | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC TOP 21POS 0.50MM R/A
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패키지: - |
재고3,042 |
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Surface Mount, Right Angle | Contacts, Top | 21 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Slide Lock | Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -20°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FPC BOTTOM 13POS 1.00MM R/A
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패키지: - |
재고8,748 |
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Surface Mount, Right Angle | Contacts, Bottom | 13 | 0.039" (1.00mm) | Solder | 0.30mm | 0.118" (3.00mm) | Slide Lock | Tapered | Phosphor Bronze | Gold | Polyamide (PA46), Nylon 4/6 | Polyphenylene Sulfide (PPS) | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 29POS 1.00MM R/A
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패키지: - |
재고7,758 |
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Surface Mount, Right Angle | Contacts, Bottom | 29 | 0.039" (1.00mm) | Solder | 0.30mm | 0.122" (3.10mm) | - | Straight | Phosphor Bronze | Gold | Polyphenylene Sulfide (PPS) | - | Solder Retention | 50V | -20°C ~ 80°C | UL94 V-0 |
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Molex, LLC |
CONN FFC BOTTOM 17POS 0.50MM R/A
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패키지: - |
재고5,148 |
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Surface Mount, Right Angle | Contacts, Bottom | 17 | 0.020" (0.50mm) | Solder | 0.30mm | 0.079" (2.00mm) | Flip Lock | Straight, Tapered | Phosphor Bronze | Tin Bismuth | Polyamide (PA), Nylon, Glass Filled | Polyphenylene Sulfide (PPS), Glass Filled | Solder Retention, Zero Insertion Force (ZIF) | 50V | -40°C ~ 85°C | UL94 V-0 |